Patents by Inventor Kelvin Ming Wai Ng

Kelvin Ming Wai Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic transducer
    Patent number: 6871770
    Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
    Type: Grant
    Filed: April 18, 2003
    Date of Patent: March 29, 2005
    Assignee: ASM Assembly Automation Limited
    Inventors: Hing Leung Li, Kelvin Ming Wai Ng, Helen Lai Wa Chan, Peter Chou Kee Liu
  • Ultrasonic transducer
    Publication number: 20040035912
    Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
    Type: Application
    Filed: April 18, 2003
    Publication date: February 26, 2004
    Inventors: Hing Leung LI, Kelvin Ming Wai NG, Helen Lai Wa CHAN, Peter Chou Kee LIU
  • Ultrasonic transducer
    Publication number: 20030062395
    Abstract: A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
    Type: Application
    Filed: October 1, 2001
    Publication date: April 3, 2003
    Inventors: Hing Leung Li, Kelvin Ming Wai NG, Helen Lai Wa Chan, Peter Chou Kee Liu