Abstract: A glass article having a low level of grainy appearance that can appear to have a shift in the pattern of the grains with changing viewing angle of a display, or “sparkle.” The glass article—which, in some embodiments, is a transparent glass sheet—has small-angle-scattering properties and/or distinctness-of-reflected-image (DOI), leading to improved viewability in display applications, especially under high ambient lighting conditions. In some embodiments, the antiglare surface of the glass sheet is an etched surface, with no foreign coating present on the antiglare surface.

Abstract: Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

Abstract: A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the glass article includes, for example: depositing deformable particles on at least a portion of a glass surface of the article; causing the deposited deformable particles on the surface to deform and adhere to the surface; and contacting the surface having the adhered particles with an etchant to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed.

Abstract: A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the article having an anti-glare surface includes, for example, forming a protective film on selected portions of at least one surface of the article; contacting the at least one surface with a liquid etchant; and removing the protective film from the surface of the article to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed.

Abstract: A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the glass article includes, for example, depositing sacrificial particles on a surface of the article; and contacting the resulting particulated surface with an etchant. A display system that incorporates the glass article, as defined herein, is also disclosed.

Abstract: A glass article that is ion-exchangeable and has at least one roughened surface. The roughened surface has a distinctness-of-reflected image DOI of less than 90 when measured at an incidence angle of 20°. A pixelated display system that includes such a glass article is also provided.

Abstract: Methods for sealing a photonic device are disclosed. The photonic device may, for example, comprise a display device, a lighting device or a photovoltaic device. The device is sealed with a glass frit that is heated with a laser from both sides of the device (through both glass substrate plates), either sequentially or simultaneously. The methods can facilitate wider seal widths, and wider overall frit wall widths for increased device strength.

Abstract: A method for forming a fritted cover sheet for sealing a glass package includes providing a transparent substrate having a sealing surface and a backing surface and forming at least one mask on one of the sealing surface of the substrate or the backing surface of the substrate. A sealing frit may be formed on the sealing surface of the substrate such that the at least one mask is positioned adjacent a perimeter defined by the sealing frit.

Abstract: A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.

Abstract: A method for sealing an organic light emitting diode (OLED) device is disclosed wherein the OLED device comprises a color filter. A color filter is deposited on a first glass plate or substrate and a glass-based frit is then deposited in a loop around the color filter, The deposited fit loop is then heated by electromagnetic energy to evaporate organic constituents and to sinter the fit in a pre-sintering step. An OLED device may then be assembled by positioning a second glass plate comprising an organic light emitting material deposited thereon in overlying registration with the first glass plate, with the color filer and the organic light emitting material positioned between the plates. The fit is then heated with a laser to form a hermetic seal between the first and second glass plates.

Abstract: A glass article having an anti-glare surface. The anti-glare surface has a distinctness-of-reflected image of less than 95, and a haze of less than or equal to 50%. In one embodiment, the glass article further includes a smudge-resistant surface disposed on the anti-glare surface. Methods of making the glass article and anti-glare surface are also described.

Abstract: A hermetically sealed package includes: a first plate including inside and outside surfaces; a second plate including inside and outside surfaces; frit material disposed on the inside surface of the second plate; and at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the frit material forms a hermetic seal against the dielectric layer in response to heating.

Abstract: A method of forming a pattern of electrical conductors on a receiving substrate (110) comprises forming metal nanoparticles of a conductive material. A donor substrate (45) is formed. A layer of release material (75) is deposited on a first side of the donor substrate. The metal nanoparticles are deposited on the release material. The metal nanoparticulate layer are placed in contact with the receiving substrate. A pattern is written on a sandwich formed by the donor substrate and the receiving substrate, causing metal nanoparticles from the nanoparticulate layer (90) to anneal and transfer to the receiving substrate to form the pattern of electrical conductors on the receiving substrate.

Abstract: A method of making an OLED device, including providing a substrate having a first electrode and a conductive bus line provided over the substrate and organic EL media provided over the first electrode and over the conductive bus line; forming a radiation absorbing structure associated with the conductive bus line; exposing the radiation absorbing structure to radiation to produce heat sufficient to ablate a portion of the organic EL media thereby forming an opening in the organic EL media; and forming a second electrode over the organic EL media, and through the opening in the organic EL media thereby forming an electrical connection between the second electrode to the conductive bus line.

Abstract: Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

Abstract: A method of transferring organic material from a donor element onto a substrate of an OLED device, includes providing a linear laser light beam which is moved relative to the donor element and substrate and which has a predetermined number of laser modulatable channels, each of which when activated causes laser light to illuminate the donor element which heats to a sufficient level to vaporize organic material and transfer such material onto a substrate; and selecting the pattern of activated laser modulatable channels such that only a portion of the OLED device receives organic material during a single relative motion pass of the linear laser light beam to the donor element and substrate.

Abstract: A hermetically sealed package includes: a first plate including inside and outside surfaces; a second plate including inside and outside surfaces; frit material disposed on the inside surface of the second plate; and at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the frit material forms a hermetic seal against the dielectric layer in response to heating.

Abstract: A multilayer optical compensation film comprises one or more optically anisotropic layers X and one or more optically anisotropic layers Z wherein, said each layer X has its optic axis tilted with respect to the plane of said multilayer compensation film, and said each layer Z comprises amorphous polymer with glass transition temperature Tg above 180C°, and satisfies particular relations. The film is readily manufactured and provides the required optical property for proper compensation of LCDs.

Abstract: A method of making micro-structure devices by coating a first layer of resist (12) on a substrate (10). A pattern is created on the substrate by radiation induced thermal removal of the resist.

Abstract: A method of transferring organic material from a donor element to a substrate includes providing a radiation source; and selecting the power of the radiation applied to the donor element by the radiation source to cause the transfer of organic material to the substrate wherein the time that one or more positions of the donor element receives radiation is greater than 1 millisecond.