Patents by Inventor Kelvin Tai

Kelvin Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240068086
    Abstract: Target assemblies for PVD chambers are provided herein. In some embodiments, a target assembly for a PVD chamber includes: a backing plate; and a target coupled to the backing plate and having a substrate facing surface opposite the backing plate, wherein a peripheral portion of the target includes an angled surface extending radially outward and toward the backing plate, wherein an annular portion of the angled surface has a surface roughness greater than a surface roughness of a remainder of the substrate facing surface of the target.
    Type: Application
    Filed: December 2, 2022
    Publication date: February 29, 2024
    Inventors: Sundarapandian Ramalinga Vijayalakshmi REDDY, Kirankumar Neelasandra SAVANDAIAH, Junqi WEI, Bridger Earl HOERNER, Kelvin Tai Ming BOH, Madan Kumar SHIMOGA MYLARAPPA
  • Publication number: 20210335581
    Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to the central recess; a plurality of holes disposed through the top plate from a bottom surface of the recess to a lower surface of the top plate; a cover plate configured to be coupled to the top plate and to form a seal along a periphery of the central recess such that the covered recess forms a plenum within the top plate; and a tubular body extending down from the lower surface of the top plate and surrounding the plurality of holes, the tubular body further configured to surround a substrate support.
    Type: Application
    Filed: April 22, 2020
    Publication date: October 28, 2021
    Inventors: Sarath BABU, Ananthkrishna JUPUDI, Yueh Sheng OW, Junqi WEI, Kelvin Tai Ming BOH, Kang ZHANG, Yuichi WADA
  • Patent number: 8921145
    Abstract: A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: December 30, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Pao Shu, Kelvin Tai, Calvin Hung, Benior Chen
  • Publication number: 20140186986
    Abstract: A micro-electro-mechanical systems (MEMS) device and method for forming a MEMS device is provided. A proof mass is suspended a distance above a surface of a substrate by a fulcrum. A pair of sensing plates are positioned on the substrate on opposing sides of the fulcrum. Metal bumps are associated with each sensing plate and positioned near a respective distal end of the proof mass. Each metal bump extends from the surface of the substrate and generally inhibits charge-induced stiction associated with the proof mass. Oxide bumps are associated with each of the pair of sensing plates and positioned between the respective sensing plate and the fulcrum. Each oxide bump extends from the first surface of the substrate a greater distance than the metal bumps and acts as a shock absorber by preventing the distal ends of the proof mass from contacting the metal bumps during shock loading.
    Type: Application
    Filed: March 7, 2014
    Publication date: July 3, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Pao Shu, Kelvin Tai, Calvin Hung, Benior Chen
  • Patent number: D973609
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: December 27, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sarath Babu, Ananthkrishna Jupudi, Yueh Sheng Ow, Junqi Wei, Kelvin Tai Ming Boh, Kang Zhang, Yuichi Wada