Patents by Inventor Kelvin Tam Aik Boo

Kelvin Tam Aik Boo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN OPEN AREA THAT EXPOSES WIRE BOND PADS AT A SURFACE OF THE INNER LAYER
    Publication number: 20220181307
    Abstract: An apparatus includes a substrate for mounting an integrated circuit. The substrate includes a primary layer including a first surface that is a first external surface of the substrate. The substrate includes an inner layer that is located below the primary layer and including a second surface. A portion of the second surface of the inner layer is exposed via an open area associated with the primary layer. The inner layer includes a first multiple of wire bond pads that are exposed via the open area associated with the primary layer.
    Type: Application
    Filed: February 28, 2022
    Publication date: June 9, 2022
    Inventors: Kelvin Tam Aik Boo, Chin-Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem P. Takiar