Patents by Inventor Kelvin Wai Kwok Yeung

Kelvin Wai Kwok Yeung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200397818
    Abstract: Compositions and methods are provided in which magnesium, copper, zinc, and strontium are provided to enhance osteogenesis, improve bone growth, and/or improve bone density. Magnesium, copper, zinc, and strontium are provided in a defined molar ratio providing synergistic effects that permit the use of small amounts of individual metal species, and without the need for supplemental calcium.
    Type: Application
    Filed: July 31, 2017
    Publication date: December 24, 2020
    Inventors: Kelvin Wai Kwok YEUNG, Hoi Man WONG, Johnson Yiu-Nam LAU, Kenneth Man Chee CHEUNG
  • Patent number: 8444682
    Abstract: A mechanism to connect the supporting portions of orthopaedic implants such as in the head, spine, upper limb and lower limb and thereby prevent loosening and fretting at the implant interface of an orthopaedic implant construct has been developed based on shape memory effect and super-elasticity of shape memory materials such as nickel-titanium (nitinol or NiTi) shape-memory-alloy, without the use of typical threaded fastening technique. Advantages are conferred by making the entire device, not just connecting pieces, out of shape memory alloy and having shape memory effect and super-elasticity. Heating the memory head of the device will compress the connection portion without the use of an auxiliary device (e.g. coupling member) so that the connection portion can be completely clamped down by the memory head.
    Type: Grant
    Filed: September 11, 2007
    Date of Patent: May 21, 2013
    Assignee: The University of Hong Kong
    Inventors: Kelvin Wai Kwok Yeung, William Weijia Lu, Keith Dip Kei Luk, Kenneth Man Chee Cheung
  • Publication number: 20110166251
    Abstract: Novel hybrid materials and fabrication methods thereof are provided. The novel hybrid materials can include a biodegradable polymer and a biodegradable metallic material. The hybrid material can also include a coupling agent between the biodegradable metallic material and the biodegradable polymer. A method of fabricating a hybrid material can include performing a surface treatment process on the biodegradable metallic material, and then either performing a solvent formation method or a thermal formation method.
    Type: Application
    Filed: July 14, 2010
    Publication date: July 7, 2011
    Inventors: Karen Hoi Man Wong, Kelvin Wai Kwok Yeung, Kenneth Man Chee Cheung, Keith Dip Kei Luk, John Kin On Lam, Paul Kim Ho Chu
  • Publication number: 20110046747
    Abstract: This invention involves a plasma treated and controllable release antimicrobial peptide coated titanium alloy for surgical implantation, where the alloy with antimicrobial properties is fabricated using surface techniques without adversely compromising its biocompatibility and original mechanical properties. The surface techniques form antimicrobial layers on the alloy capable of resisting microbial adhesion and proliferation, while allowing mammalian cell adhesion and proliferation when the alloy is implanted to human body. In one embodiment, PIII&D is applied to incorporate ions, electrons, free radicals, atoms or molecules on a titanium alloy substrate. A pressurized hydrothermal treatment can be carried out to establish reactive functional groups for antimicrobial purpose or for connecting the substrate and external antimicrobial molecules.
    Type: Application
    Filed: February 16, 2010
    Publication date: February 24, 2011
    Inventors: Kelvin Wai Kwok Yeung, Kenneth Man Chee Cheung, Keith Dip Kei Luk, Che Yan Yeung, Richard Yi Tsun Kao, Paul Kim Ho Chu
  • Patent number: 7306683
    Abstract: The present invention relates generally to a shape memory and/or super-elastic material, such as a nickel titanium alloy. Additionally or alternatively, the present invention relates to a super-elastic or pseudo-elastic material that has an initial transition temperature Af above a body temperature. The shape memory material can have a super-elasticity or pseudo-elasticity property at a temperature below the initial transition temperature Af of the material. For example, the shape memory material can have its workable temperature for producing super-elasticity or pseudo-elasticity of about 0° C. to 15° C. below the initial transition temperature Af. The shape memory material can be malleable at a room temperature, and become super-elastic or pseudo-elastic at a body temperature. In addition, the present invention relates to a method of making a shape memory or a super-elastic material.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: December 11, 2007
    Assignees: Versitech Limited, The City University of Hong Kong
    Inventors: Kenneth Man Chee Cheung, Kelvin Wai Kwok Yeung, William Weijia Lu, Chl Yuen Chung
  • Publication number: 20040265614
    Abstract: The present invention relates generally to a shape memory and/or super-elastic material, such as a nickel titanium alloy. Additionally or alternatively, the present invention relates to a super-elastic or pseudo-elastic material that has an initial transition temperature Af above a body temperature. The shape memory material can have a super-elasticity or pseudo-elasticity property at a temperature below the initial transition temperature Af of the material. For example, the shape memory material can have its workable temperature for producing super-elasticity or pseudo-elasticity of about 0° C. to 15° C. below the initial transition temperature Af. The shape memory material can be malleable at a room temperature, and become super-elastic or pseudo-elastic at a body temperature. In addition, the present invention relates to a method of making a shape memory or a super-elastic material.
    Type: Application
    Filed: April 19, 2004
    Publication date: December 30, 2004
    Inventors: Kenneth Man Chee Cheung, Kelvin Wai Kwok Yeung, William Weijia Lu, C.Y. Chung