Abstract: A method for processing a substrate includes receiving the substrate including a patterned mask disposed over a layer stack including a second layer disposed over a first layer, the patterned mask including a feature pattern, and etching the substrate to transfer the feature pattern to the second layer and form first openings that expose the first layer. The method further includes exposing a first sidewall of the first openings to a first focused beam at a first processing angle to extend the first openings in a first direction and form second openings, and etching the substrate to transfer the second openings through the first layer and form third openings. And the method further includes exposing the first sidewall of the third openings to a second focused beam at a second processing angle to form fourth openings.

Abstract: A substrate processing method includes: forming a photosensitive film on a surface of a substrate; accommodating the substrate with the formed photosensitive film in a first chamber and exposing the photosensitive film to exposure light in the first chamber; accommodating the substrate with the formed photosensitive film in a second chamber different from the first chamber and performing a pressure reduction process to reduce pressure inside the second chamber to a subatmospheric pressure; subjecting, after the pressure reduction process, the photosensitive film to a moisture-containing gas; and developing the photosensitive film of the substrate after exposing and subjecting.

Abstract: An etching method includes: preparing a workpiece including a metal multilayer film having a magnetic tunnel junction and a mask formed by an inorganic material on the metal multilayer film; and etching the metal multilayer film by plasma of a mixed gas of ethylene gas and oxygen gas using the mask.

Abstract: An etching method includes: preparing a workpiece including a metal multilayer film having a magnetic tunnel junction and a mask formed by an inorganic material on the metal multilayer film; and etching the metal multilayer film by plasma of a mixed gas of ethylene gas and oxygen gas using the mask.

Abstract: A substance which has a Cu--O plane containing crystal structure in its unit cell and which is called a Bi oxide superconductor consisting essentially of Bi, Sr, Ca, Cu, and O. Not only part of Bi but also part of Sr and/or Ca of the Bi oxide superconductor is substituted for Pb and rare earth elements (RE), respectively. The Pb substitution relaxes the structural modulation which is closely related to superconductivity of the Bi oxide superconductor and the RE substitution controls its carrier concentration. Accordingly, superconducting properties such as transition temperature and critical current density can be improved remarkably. In addition, not only oxide superconductors with excellent superconductivity can be prepared in a low oxygen content but also the surface condition of the prepared superconductors is stable.

Abstract: An insulating composition consisting of Bi, Sr, RE, Cu, O or of Tl, Ba, RE, Cu, O (wherein; RE is an element selected from a group consisting of Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and Y) aligns properly with a crystal face of an oxide superconductor because its crystal structure is the same as or similar to that of the oxide superconductor. An insulating composition in which a part of Bi is replaced by Pb is further near the oxide superconductor its construction, and the modulation structure in this insulating composition is mitigated or disappears.

Abstract: An insulating composition consisting of Bi, Sr, RE, Cu, O or of Tl, Ba, RE, Cu, O (wherein; RE is an element selected from a group consisting of Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and Y) aligns properly with a crystal face of an oxide superconductor because its crystal structure is the same as or similar to that of the oxide superconductor. An insulating composition in which a part of Bi is replaced by Pb is further near the oxide superconductor its construction, and the modulation structure in this insulating composition is mitigated or disappears.

Abstract: In a diesel engine exhaust gas recirculation system wherein an exhaust gas recirculation control valve operated by an operating air pressure controls the flow resistance of the exhaust gas recirculation passage according to variation of the operating air pressure effected by an operating air pressure control valve according to the load on the engine so as to replace most of the excess air part of the intake air by recirculated exhaust gases, an atmospheric pressure responsive air pressure control valve is provided so as to supply an air pressure which has been beforehand controlled so as to compensate for such changes of atmospheric pressure as caused by changes of altitude to the operating air pressure control valve as an operating air pressure source.

Abstract: A hot-melt adhesive composition containing a methoxymethylated terpolymer prepared from the corresponding terpolymer that is soluble in lower alcohols and contains a higher nylon salt or an .omega.-amino acid, or a lactam, each of which has more than 10 carbon atoms, and wherein the methoxymethylation ratio of the nylon copolymer is in the range of 10 to 30%.

Abstract: A hot stamp transfer press plate comprising a transfer medium on which a transfer layer has been applied in a desired pattern, said transfer layer consisting of hot stamp ink wherein there is employed, as the binder resin of the ink, methoxymethylated nylon copolymer obtained by N-methoxymethylation of an alcohol-soluble nylon copolymer containing a higher nylon salt, .omega.-amino acid or lactam, each of which has 10 or more carbon atoms.

Abstract: A thermoplastic hot melt adhesive composition for bonding metals which comprises a homogeneous mixture of (A) 60 to 90 percent by weight of a nylon material selected from the group consisting of homopolymers and copolymers of nylon monomer selected from the group consisting of nylon salts having at least 10 carbon atoms, nylon-forming .omega.-amino acids and nylon-forming lactams, and (B) 10 to 40 percent by weight of an ethylene/vinyl acetate copolymer containing 1 to 25 weight percent of vinyl acetate.