Abstract: Ultrasound devices that include and/or use a multi-dimensional and multi-frequency arrays of transducer elements for use with ultrasound and methods for using the same are disclosed. In some embodiments, an ultrasound device includes: an array having a center row of transducer elements of a first width that operate at a first frequency and two or more outer rows of transducer elements of a second or other widths that operate at a second or other frequencies different than the first frequency. A controller is configured to control the center row of transducer elements and two or more outer rows of transducer elements to operate at a same time or at different times.

Abstract: Ultrasound devices that include and/or use a multi-dimensional and multi-frequency arrays of transducer elements for use with ultrasound and methods for using the same are disclosed. In some embodiments, an ultrasound device includes: an array having a center row of transducer elements of a first width that operate at a first frequency and two or more outer rows of transducer elements of a second or other widths that operate at a second or other frequencies different than the first frequency. A controller is configured to control the center row of transducer elements and two or more outer rows of transducer elements to operate at a same time or at different times.

Abstract: Systems and methods for a multi-layer flexible array interconnect for an ultrasound transducer, and methods of manufacture are disclosed. The systems and methods described herein provide consistent and controllable alignment between the odd and even flex layers. Further, ground layers are added between the signal layers to improve crosstalk performance while simplifying the construction. In some implementations, vias are introduced at the interface of an electromechanical-array element (e.g., lead zirconate titanate (PZT) element) to increase the surface area of conductive material and thereby increase the quality of the electrical and physical connections. In addition, a machining alignment and verification aid is provided through strategic use of unused and discarded board area to enable (i) alignment check of the flex circuit with the machining equipment and (ii) adjustment of the flex circuit position relative to the machining equipment to avoid the flex circuit being machined to an unusable state.

Abstract: Ultrasound devices that include and/or use a multi-dimensional and multi-frequency arrays of transducer elements for use with ultrasound and methods for using the same are disclosed. In some embodiments, an ultrasound device includes: an array having a center row of transducer elements of a first width that operate at a first frequency and two or more outer rows of transducer elements of a second or other widths that operate at a second or other frequencies different than the first frequency. A controller is configured to control the center row of transducer elements and two or more outer rows of transducer elements to operate at a same time or at different times.