Patents by Inventor Ken Cadien

Ken Cadien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to improve precursor utilization in pulsed atomic layer processes
    Patent number: 10619243
    Abstract: A method and system is provided to improve precursor utilization in pulsed atomic layer processes. The system integrates a chiller with a precursor ampoule to lower the temperature of the precursor ampoule, and thereby reduce the precursor vapor pressure. By lowering the ampoule temperature, the loss of excess unreacted precursor molecules is reduced, in order to improve precursor utilization efficiency in atomic layer processes.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: April 14, 2020
    Inventors: Triratna P. Muneshwar, Ken Cadien
  • METHOD TO IMPROVE PRECURSOR UTILIZATION IN PULSED ATOMIC LAYER PROCESSES
    Publication number: 20180023195
    Abstract: A method and system is provided to improve precursor utilization in pulsed atomic layer processes. The system integrates a chiller with a precursor ampoule to lower the temperature of the precursor ampoule, and thereby reduce the precursor vapor pressure. By lowering the ampoule temperature, the loss of excess unreacted precursor molecules is reduced, in order to improve precursor utilization efficiency in atomic layer processes.
    Type: Application
    Filed: July 20, 2017
    Publication date: January 25, 2018
    Inventors: Triratna P. Muneshwar, Ken Cadien
  • Low temperature chemical mechanical polishing of dielectric materials
    Patent number: 6726529
    Abstract: The present invention is an improved apparatus and process for chemical mechanical polishing layers which have a low dielectric constant (K). The present invention lowers the temperature of the material having a low dielectric constant and then polishes that material at the lower temperature. By lowering the temperature of the low K material the hardness or stiffness of the material is improved making it easier to polish and resulting in a more planar surface.
    Type: Grant
    Filed: February 14, 2000
    Date of Patent: April 27, 2004
    Assignee: Intel Corporation
    Inventors: Gerald Marcyk, Ken Cadien
  • Low temperature chemical mechanical polishing of dielectric materials
    Publication number: 20010039170
    Abstract: The present invention is an improved apparatus and process for chemical mechanical polishing layers which have a low dielectric constant (K). The present invention lowers the temperature of the material having a low dielectric constant and then polishes that material at the lower temperature. By lowering the temperature of the low K material the hardness or stiffness of the material is improved making it easier to polish and resulting in a more planar surface.
    Type: Application
    Filed: February 14, 2000
    Publication date: November 8, 2001
    Applicant: MARCYK
    Inventors: Gerald Marcyk, Ken Cadien
  • Low temperature chemical mechanical polishing of dielectric materials
    Patent number: 6121144
    Abstract: The present invention is an improved apparatus and process for chemical mechanical polishing layers which have a low dielectric constant (K). The present invention lowers the temperature of the material having a low dielectric constant and then polishes that material at the lower temperature. By lowering the temperature of the low K material the hardness or stiffness of the material is improved making it easier to polish and resulting in a more planar surface.
    Type: Grant
    Filed: December 29, 1997
    Date of Patent: September 19, 2000
    Assignee: Intel Corporation
    Inventors: Gerald Marcyk, Ken Cadien