Abstract: An engineered AAV capsid is provided, in which at least one protein on the capsid is modified to include a n-mer motif, which promotes transduction of the capsid into the central nervous system (CNS) through interaction with the Transferrin receptor. Further embodiments provide a vector system comprising one or more vectors encoding AAV capsids and a method of delivering cargo to the CNS. The method comprises administering, in vivo or in vitro, a AAV capsid according to embodiments described herein and the AVV capsid comprises one or more cargo molecules.

Abstract: An engineered AAV capsid is provided, in which at least one protein on the capsid is modified to include a n-mer motif, which promotes transduction of the capsid into the central nervous system (CNS). Further embodiments provide a vector system comprising one or more vectors encoding AAV capsids and a method of delivering cargo to the CNS. The method comprises administering, in vivo or in vitro, a AAV capsid according to embodiments described herein and the AVV capsid comprises one or more cargo molecules.

Abstract: Highly selective targeting moieties and compositions comprising the targeting moieties are described herein to efficiently transduce endothelial cell of the central nervous system vasculature. Embodiments include use and delivery of the targeting moieties and compositions to selectively direct delivery of cargo.

Abstract: Distributed API accounting is disclosed, including: receiving from respective ones of a plurality of agents, a plurality of local counter values corresponding to an application programming interface (API) service counter identifier; logging the plurality of local counter values corresponding to the API service counter identifier; receiving a request for an aggregated counter value associated with the API service counter identifier; combining at least some of the logged plurality of local counter values associated with the API service counter identifier to determine the aggregated counter value corresponding to the API service counter identifier; and storing the aggregated counter value corresponding to the API service counter identifier.

Abstract: The various embodiments of the present inventions provide stabilization devices and methods for use of the stabilization devices with minimally invasive gynecological procedures such as methods of preventing pregnancy by inserting intrafallopian contraceptive devices into the fallopian tubes.

Abstract: In various embodiments, the present application teaches methods and kits for clearing and optionally subsequently visualizing tissue containing bone. In some embodiments, the method includes serially incubating cleared bone in refractive index matching solutions with progressively higher refractive indexes. In some embodiments, the methods teach immunolabeling and/or staining tissue containing bone and optionally visualizing the immunolabeled and/or stained tissue containing bone.

Abstract: The various embodiments of the present inventions provide stabilization devices and methods for use of the stabilization devices with minimally invasive gynecological procedures such as methods of preventing pregnancy by inserting intrafallopian contraceptive devices into the fallopian tubes.

Abstract: The various embodiments of the present inventions provide stabilization devices and methods for use of the stabilization devices with minimally invasive gynecological procedures such as methods of preventing pregnancy by inserting intrafallopian contraceptive devices into the fallopian tubes.

Abstract: The various embodiments of the present inventions provide stabilization devices and methods for use of the stabilization devices with minimally invasive gynecological procedures such as methods of preventing pregnancy by inserting intrafallopian contraceptive devices into the fallopian tubes.

Abstract: The various embodiments of the present inventions provide stabilization devices and methods for use of the stabilization devices with minimally invasive gynecological procedures such as methods of preventing pregnancy by inserting intrafallopian contraceptive devices into the fallopian tubes.

Abstract: Systems and methods of chip design and package implementation for attenuating noise in timing circuits, including phase-locked-loops (PLL) and delay-locked-loops (DLL), are disclosed. Embodiments of the present invention attenuate coupled noise, such as the effects of ground current surges, or power supply noise coupling through electro-static discharge (ESD) structures. In known systems, the ground supplies for the timing circuits are designed with power and ground supplies, separate from the core power and ground; although the ground supplies are connected via common VSSsubstrate, they are separated from pad ring output driver power and ground supplies. In embodiments of the present invention, the PLL or DLL and core supplies are kept separate from the output driver power and ground supplies, providing for improved systems and methods that attenuate the effects of ground current surges from chip output drivers as they switch from logic highs to logic lows.

Abstract: The various embodiments of the present inventions provide stabilization devices and methods for use of the stabilization devices with minimally invasive gynecological procedures such as methods of preventing pregnancy by inserting intrafallopian contraceptive devices into the fallopian tubes.

Abstract: Systems and methods of chip design and package implementation for attenuating noise in timing circuits, including phase-locked-loops (PLL) and delay-locked-loops (DLL), are disclosed. Embodiments of the present invention attenuate coupled noise, such as the effects of ground current surges, or power supply noise coupling through electro-static discharge (ESD) structures. In known systems, the ground supplies for the timing circuits are designed with power and ground supplies, separate from the core power and ground; although the ground supplies are connected via common VSSsubstrate, they are separated from pad ring output driver power and ground supplies. In embodiments of the present invention, the PLL or DLL and core supplies are kept separate from the output driver power and ground supplies, providing for improved systems and methods that attenuate the effects of ground current surges from chip output drivers as they switch from logic highs to logic lows.

Abstract: Analysis of networks and testing and analyzing intelligent, network connected devices. An instantaneous network utilization value is assigned for the worst surviving ping instance of between 90% and 99% (determined proportionately from the ratio of dropped test samples to surviving test samples), and then used to solve for average network message size and average utilization of the network. A plurality transactions of different types are transmitted across the network to intelligent end systems and the results mathematically evaluated to determine the portion of the total response time contributed by the network and by the end processors; the utilization of the end processor processing subsystems and of the end processor I/O subsystems; and the utilization of the end system as a whole; and of the network and end processors considered as a unitary entity.

Abstract: Analysis of networks and testing and analyzing intelligent, network connected devices. An instantaneous network utilization value is assigned for the worst surviving ping instance of between 90% and 99% (determined proportionately from the ratio of dropped test samples to surviving test samples), and then used to solve for average network message size and average utilization of the network. A plurality transactions of different types are transmitted across the network to intelligent end systems and the results mathematically evaluated to determine the portion of the total response time contributed by the network and by the end processors; the utilization of the end processor processing subsystems and of the end processor I/O subsystems; and the utilization of the end system as a whole; and of the network and end processors considered as a unitary entity.

Abstract: Development assistance for a program comprising code in more than one language, is provided appropriately for each language in an integrated development environment. The assistance can include syntax highlighting, structure analysis, error reporting, completion assistance and/or context-sensitive help. The language of the subject element of code is determined and the appropriate assistance processes are applied. If the code is in a supplementary language, routines associated with the supplementary language are invoked to provide the assistance. When needed, information from other parts of the program file is provided to determine the appropriate assistance for the element of code.

Abstract: Development assistance for a program comprising code in more than one language, is provided appropriately for each language in an integrated development environment. The assistance can include syntax highlighting, structure analysis, error reporting, completion assistance and/or context-sensitive help. The language of the subject element of code is determined and the appropriate assistance processes are applied. If the code is in a supplementary language, routines associated with the supplementary language are invoked to provide the assistance. When needed, information from other parts of the program file is provided to determine the appropriate assistance for the element of code.

Abstract: Chip capacitors are attached to an integrated circuit package. Strips of synthetic tape are placed between pairs of chip capacitor pads on the integrated circuit package. The strips of synthetic tape each have a height extending above height of the pairs of chip capacitor pads. In the preferred embodiment, the strips of synthetic tape are strips of polyimide tape. The height of the strips of synthetic tape is selected so that the chip capacitors will be installed at a sufficient distance from the integrated circuit package so that solder balls will not be of sufficient diameter to wedge between the integrated circuit package and the chip capacitors. The chip capacitors are installed over the pairs of chip capacitor pads. The chip capacitors rest on the strips of synthetic tape. For example, the chip capacitors are permanently attached to the pairs of chip capacitors using a solder process. A reflow solder process is then performed.