Abstract: The present utility model discloses a package assembly of a sensor, comprising: a redistribution layer having a first face and a second face that are opposite to each other, and a first via that penetrates the first face and the second face; a first die electrically connected to the first face of the redistribution layer; a sensing element electrically connected to the first face of the redistribution layer; a cover body located between the redistribution layer and the sensing element, wherein the cover body has a second via that penetrates the cover body, and the second via communicates with the first via; and a moulding compound comprising a third face and a fourth face that are opposite to each other, wherein the moulding compound encapsulates the first die and the sensing element on the side of the first face of the redistribution layer, and the third face of the moulding compound is combined with the first face of the redistribution layer.

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

Abstract: A sensor includes: a redistribution layer comprising a first face and a second face opposite to each other; a first die electrically connected to the first face of the redistribution layer; a molding compound comprising a third face and a fourth face opposite to each other, wherein the third face of the molding compound is combined with the first face of the redistribution layer, and the molding compound encapsulates the first die on the side of the first face of the redistribution layer; and a sensing element electrically connected to the redistribution layer. The package assembly of the sensor allows more elements to be packaged together, and provides a better structural support or provides a better heat distribution for the package assembly, and at the same time, reduces the volume and costs of the entire package assembly.

Abstract: The present utility model discloses a package assembly of a sensor, comprising: a redistribution layer having a first face and a second face that are opposite to each other, and a first via that penetrates the first face and the second face; a first die electrically connected to the first face of the redistribution layer; a sensing element electrically connected to the first face of the redistribution layer; a cover body located between the redistribution layer and the sensing element, wherein the cover body has a second via that penetrates the cover body, and the second via communicates with the first via; and a moulding compound comprising a third face and a fourth face that are opposite to each other, wherein the moulding compound encapsulates the first die and the sensing element on the side of the first face of the redistribution layer, and the third face of the moulding compound is combined with the first face of the redistribution layer.

Abstract: The present invention discloses a package assembly of a sensor, comprising: a redistribution layer comprising a first face and a second face opposite to each other; a first die electrically connected to the first face of the redistribution layer; a molding compound comprising a third face and a fourth face opposite to each other, wherein the third face of the molding compound is combined with the first face of the redistribution layer, and the molding compound encapsulates the first die on the side of the first face of the redistribution layer; and a sensing element electrically connected to the redistribution layer. The package assembly of the sensor allows more elements to be packaged together, and provides a better structural support or provides a better heat distribution for the package assembly, and at the same time, reduces the volume and costs of the entire package assembly.

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.

Abstract: A resistive liquid level/temperature sensor and transmitter including low voltage impedance measurement circuitry to convert three impedance values into indications of the temperature and the levels of two different liquids (e.g., oil and water) located within a storage tank. A resistive chain network including a plurality of series connected resistors and a corresponding plurality of reed switches extend longitudinally through a liquid level sensing probe that is dipped into the liquids in the tank. A pair of magnetic floats having different specific gravities surround the probe and rise to the two fluid levels. The magnetic floats close adjacent reed switches which create first and second current paths through the resistive chain network. The impedances of the first and second current paths are measured to provide an indication of the liquid levels. A resistive temperature device carried by the probe provides an indication of temperature.

Abstract: A disk drive includes a storage disk, a data transducer, an actuator assembly and a positioner. The actuator assembly supports the data transducer over the storage disk. The actuator assembly includes a rotatable actuator hub and a longitudinal axis. The positioner moves the actuator assembly to position the data transducer relative to the storage disk. During movement of the actuator assembly, the actuator hub is subject to a resultant force that causes track misregistration of the data transducer. The positioner includes a magnet assembly that generates a magnetic field, a first conductor region and a second conductor region. In one embodiment, the conductor regions cooperate with the magnet assembly to generate a first force and a second force that are each directed at an angle having an absolute value that is greater than zero degrees and less than approximately 45 degrees relative to the longitudinal axis of the actuator assembly.

Abstract: A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes at least a first coil array (80) and a second coil array (82) that are substantially co-planar. The control system (22) directs current to electrically excite the coil arrays (80) (82) to maintain a data transducer (50) on a target track (32) of a storage disk (28).

Abstract: A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes a coil array (78). The coil array includes a first portion (84) and a second portion (86) that are positioned substantially perpendicular to a longitudinal axis (43) of an E-block (16). The control system (22) directs current to electrically excite the first and second portions (84) (86) to generate a first force F1 and a second force F2 which are (i) parallel to the longitudinal axis (43) of the E-block (16), and (ii) equal in magnitude and directionally opposite to better position a data transducer (50) on a target track (32) of a storage disk (28).

Abstract: This invention relates to a heat-cured furan foundry binder system comprising a furan binder and a furan monomer or oligomer containing at least two terminal hydroxymethyl groups. The binders are particularly useful as warm-box binders, because they cure faster and foundry shapes (typically cores and molds) made with the binders exhibit higher tensile strengths than those made with conventional heat-cured furan binders.

Abstract: A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes at least a first coil array (80) and a second coil array (82) that are substantially co-planar. The control system (22) directs current to electrically excite the coil arrays (80) (82) to maintain a data transducer (50) on a target track (32) of a storage disk (28).

Abstract: A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes a coil array (78). The coil array includes a first portion (84) and a second portion (86) that are positioned substantially perpendicular to a longitudinal axis (90) of an E-block (16). The control system (22) directs current to electrically excite the first and second portions (84) (86) to generate a first force F1 and a second force F2 which are (i) parallel to the longitudinal axis (90) of the E-block (16), and (ii) equal in magnitude and directionally opposite to better position a data transducer (50) on a target track (32) of a storage disk (28).

Abstract: A positioner (20) for a disk drive (10) that includes a magnet assembly (52), a conductor assembly (54), and a control system (22) is provided herein. The magnet assembly (52) includes a pair of magnet arrays (56A) (56B) and a pair of spaced apart flux return plates (75A) (75B). The conductor assembly (54) includes at least a first coil array (80) and a second coil array (82) that are substantially coplanar. The control system (22) directs current to electrically excite the coil arrays (80) (82) to maintain a data transducer (50) on a target track (32) of a storage disk (28).