Patents by Inventor Ken Collins

Ken Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11760069
    Abstract: Systems and methods for using, configuring, and manufacturing self-obscuring tamper-evident labels can include producing labels that have adhesive and non-adhesive sides. The non-adhesive side can be configured to receive printing such as machine-readable codes. The labels typically have multiple layers which can be configured for various tasks. For example, one layer can be configured as an irreversible void material that generates indicia upon receiving a certain tension associated with removal from a surface. Another layer may be configured to ease the removal of the label from a surface while another generates deformations under tension. The indicia, deformations, and machine-readable code printed on the non-adhesive side can be configured such that when activated, the indicia render the machine-readable code unreadable via machine.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: September 19, 2023
    Assignee: Adcraft, Inc.
    Inventors: Ken Collins, Keith Mottram
  • Publication number: 20130284372
    Abstract: Embodiments include a base for an electrostatic chuck (ESC) assembly for supporting a workpiece during a manufacturing operation in a processing chamber, such as a plasma etch, clean, deposition system, or the like. Inner and outer fluid conduits are disposed in the base to conduct a heat transfer fluid. In embodiments, a counter-flow conduit configuration provides improved temperature uniformity. The conduit segments in each zone are interlaced so that fluid flows are in opposite directions in radially adjacent segments. In embodiments, each separate fluid conduit formed in the base comprises a channel formed in the base with a cap e-beam welded to a recessed lip of the channel to make a sealed conduit. To further improve the thermal uniformity, a compact, tri-fold channel segment is employed in each of the outer fluid loops. In further embodiments, the base includes a multi-contact fitting RF and DC connection, and thermal breaks.
    Type: Application
    Filed: April 10, 2013
    Publication date: October 31, 2013
    Inventors: Hamid TAVASSOLI, Kallol BERA, Douglas BUCHBERGER, James C. CARDUCCI, Shahid RAUF, Ken COLLINS
  • Publication number: 20100327873
    Abstract: Described herein is a method and apparatus for diagnosing processing equipment with a multi-diagnostic device. In one embodiment, a multi-diagnostic device is located in a plasma processing environment and includes an electronic circuitry. The device includes a first array of sensors and a second array of sensors. The circuitry is used to simultaneously (or nearly simultaneously) measure the distributions of ion saturation current and the potential at the device using the first array of sensors and to measure resistances of the second array of sensors to determine the distribution of the temperature at the surface of the device.
    Type: Application
    Filed: May 28, 2010
    Publication date: December 30, 2010
    Inventors: Leonid A. Dorf, Shahid Rauf, Kartik Ramaswamy, Ken Collins
  • Patent number: 7792796
    Abstract: Methods, systems, and computer program products for optimizing resource allocation in a host-based replication environment are disclosed. According to one aspect, the subject matter described herein includes a method for optimizing resource allocation in a host-based replication environment. The method includes assigning a weight to each of a multiple of file system entities to be replicated. The method also includes creating a list of available transfer agents for replicating file system entities, the list having first and second ends and the list including at least one entry representing each transfer agent.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: September 7, 2010
    Assignee: EMC Corporation
    Inventors: Dov Bulka, Neel Mehta, Shon Boggs, Ken Collins