Patents by Inventor Ken Dai

Ken Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10122834
    Abstract: A method for operating an Internet Content Adaptation Protocol (ICAP) server is disclosed. The method comprises defining a message transmission policy for clients of the ICAP server according to a content type of messages for transmission to the ICAP server. The message transmission policy comprises a specification of messages for which a particular transmission method is to be applied, the transmission method comprising one of sending a message preview, sending the entire message or not sending the message. Also disclosed are a method for operating an ICAP client, an ICAP server node, an ICAP client node and a computer program product configured, when run on a computer, to carry out a method for operating an ICAP server or an ICAP client.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: November 6, 2018
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Kermit Qiu, Ken Dai
  • Publication number: 20170019540
    Abstract: There is provided a method in a node of a communications network, the method comprising logging packet information for network traffic related to a client. The method further comprises sending the logged packet information for network traffic related to the client from a network layer to an host layer within the node. The method further comprises identifying application level payloads for network traffic related to the client at the host layer within the node. The method further still comprises correlating the packet information with the application level payloads for network traffic related to the client.
    Type: Application
    Filed: March 17, 2014
    Publication date: January 19, 2017
    Inventors: Ken DAI, Niamh BARRETT, Thorsten HERBER, Johan KÖLHI
  • Publication number: 20160301780
    Abstract: A method for operating an Internet Content Adaptation Protocol (ICAP) server is disclosed. The method comprises defining a message transmission policy for clients of the ICAP server according to a content type of messages for transmission to the ICAP server. The message transmission policy comprises a specification of messages for which a particular transmission method is to be applied, the transmission method comprising one of sending a message preview, sending the entire message or not sending the message. Also disclosed are a method for operating an ICAP client, an ICAP server node, an ICAP client node and a computer program product configured, when run on a computer, to carry out a method for operating an ICAP server or an ICAP client.
    Type: Application
    Filed: November 15, 2013
    Publication date: October 13, 2016
    Inventors: Kermit QIU, Ken DAI
  • Publication number: 20040140420
    Abstract: An image sensor having increased number of pixels. The image sensor includes a substrate, a frame layer, a photosensitive chip, wires, an adhesive medium and a transparent layer. The substrate has an upper surface and a lower surface. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is arranged within the cavity and is mounted to the upper surface of the substrate. The wires electrically connect the photosensitive chip to the substrate. The adhesive medium is inside the cavity. The transparent layer is arranged on the frame layer to cover the image sensor. Thus, the particles inside the cavity fall down and are adhered to the adhesive medium without being distributed over the sensitive area of the photosensitive chip and the transparent layer. Therefore, the number of good pixels of the sensor may be increased.
    Type: Application
    Filed: January 16, 2003
    Publication date: July 22, 2004
    Inventors: Ken Dai, Swallow Lai
  • Patent number: 6753203
    Abstract: A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the cavity; providing a plurality of wires to electrically connect the photosensitive chip to the substrate; supplying an adhesive layer to the upper surface of the substrate and within the cavity; mounting a transparent layer to the frame layer to cover the photosensitive chip; and illuminating an electrostatic-charge eliminating light source on the transparent layer to let particles within the cavity fall down to the adhesive layer.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: June 22, 2004
    Assignee: Kingpak Technology Inc.
    Inventor: Ken Dai