Patents by Inventor KEN DANG

KEN DANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8749967
    Abstract: The present invention relates to amounting structure for Mini PCI-E equipment is provided. The mounting structure comprises a Mini PCI-E slot and a fixing bracket, wherein the Mini PCI-E slot is welded on surface of a motherboard with an opening upward and perpendicular to the motherboard, the fixing bracket is close to the Mini PCI-E slot and fixed vertically on the motherboard. The fixing bracket includes a first fixing device which includes at least two mounting holes at the same height. The present invention also disclosed a computer using the above mounting structure. The mounting structure of the present invention could significantly reduce the area on the motherboard occupied by the Mini PCI-E equipment via setting the Mini PCI-E slots and the mounting bracket perpendicular to the motherboard. The above mounting structure could also improve the performance of heat dissipation of the Mini PCI-E equipment.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: June 10, 2014
    Assignee: PC Partner (Dongguan) Limited
    Inventor: Ken Dang
  • Publication number: 20110228462
    Abstract: The present invention relates to amounting structure for Mini PCI-E equipment is provided. The mounting structure comprises a Mini PCI-E slot and a fixing bracket, wherein the Mini PCI-E slot is welded on surface of a motherboard with an opening upward and perpendicular to the motherboard, the fixing bracket is close to the Mini PCI-E slot and fixed vertically on the motherboard. The fixing bracket includes a first fixing device which includes at least two mounting holes at the same height. The present invention also disclosed a computer using the above mounting structure. The mounting structure of the present invention could significantly reduce the area on the motherboard occupied by the Mini PCI-E equipment via setting the Mini PCI-E slots and the mounting bracket perpendicular to the motherboard. The above mounting structure could also improve the performance of heat dissipation of the Mini PCI-E equipment.
    Type: Application
    Filed: March 7, 2011
    Publication date: September 22, 2011
    Applicant: PC Partner (Dongguan) Limited
    Inventor: KEN DANG