Patents by Inventor Ken Deng
Ken Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12072350Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.Type: GrantFiled: June 23, 2022Date of Patent: August 27, 2024Assignee: Knowles Electronics, LLCInventors: Faisal Zaman, Shubham Shubham, Ken Deng
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Publication number: 20240208800Abstract: A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.Type: ApplicationFiled: December 22, 2022Publication date: June 27, 2024Inventors: Ken Deng, Bing Yu, Michael Pedersen, Nicholas Palcheck, Jeremy Johnson, Richard Li-Chen Chen
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Publication number: 20230417793Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.Type: ApplicationFiled: June 23, 2022Publication date: December 28, 2023Inventors: Faisal Zaman, Shubham Shubham, Ken Deng
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Patent number: 11772961Abstract: A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.Type: GrantFiled: August 26, 2021Date of Patent: October 3, 2023Assignee: KNOWLES ELECTRONICS, LLCInventors: Michael Kuntzman, Ken Deng, Faisal Zaman, Bing Yu, Vahid Naderyan, Peter V. Loeppert
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Publication number: 20230192475Abstract: A vibration sensor/accelerometer includes, in various implementations, a MEMS die that includes a plate having an aperture, an anchor disposed within the aperture, a plurality of arms (e.g., rigid arms) extending from the anchor, and a plurality of resilient members (e.g., looped or folded springs with a carefully designed spring stiffness), each resilient member connecting the plate to an arm of the plurality of arms. The plate may be made from a solid layer in which the resilient members are etched from the same layer. The MEMS die may also include top and bottom wafers, and travel stoppers extending from the top and bottom wafers as well as through the plate.Type: ApplicationFiled: July 21, 2022Publication date: June 22, 2023Inventors: Ken Deng, Michael Pedersen, Richard Li-Chen Chen, Shubham Shubham, Faisal Zaman
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Patent number: 11609091Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.Type: GrantFiled: December 31, 2020Date of Patent: March 21, 2023Assignee: Knowles Electronics, LLCInventors: Ken Deng, Michael Pedersen, Jeremy Johnson, Kevin Meneou
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Publication number: 20230062556Abstract: A microelectromechanical systems (MEMS) die includes a first diaphragm and a second diaphragm, wherein the first diaphragm and the second diaphragm bound a sealed chamber. A stationary electrode is disposed within the sealed chamber between the first diaphragm and the second diaphragm. A tunnel passes through the first diaphragm and the second diaphragm without passing through the stationary electrode, wherein the tunnel is sealed off from the chamber. The MEMS die further includes a substrate having an opening formed therethrough, wherein the tunnel provides fluid communication from the opening, through the second diaphragm, and through the first diaphragm.Type: ApplicationFiled: August 26, 2021Publication date: March 2, 2023Inventors: Michael Kuntzman, Ken Deng, Faisal Zaman, Bing Yu, Vahid Naderyan, Peter V. Loeppert
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Patent number: 11475317Abstract: The present invention provides a microalloyed steel mechanical property prediction method based on globally additive model, including the following steps: determining some influencing factors of the microalloyed steel mechanical property prediction model; calculating the components and contents of carbonitride precipitation in a microalloyed steel rolling process; expressing the microalloyed steel mechanical property prediction model as an additive form of several submodels according to generalized additive model; estimating the microalloyed steel mechanical property prediction model; and verifying reliability of the submodels. The microalloyed steel property prediction models obtained in the foregoing solution have advantages such as high prediction precision and a wide adaptation range, and may be used for design of new products and steel grade component optimization, so as to reduce the quantity of physical tests, shorten the product research and development cycle, and reduce costs.Type: GrantFiled: December 27, 2017Date of Patent: October 18, 2022Assignee: WUHAN UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Weigang Li, Ken Deng, Wei Yang, Chao Liu
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Publication number: 20220155073Abstract: A MEMS device can include a substrate having a first side and a second side, the substrate including an aperture extending from the first side through the substrate to the second side. The device can include a support structure coupled to the substrate the first side. The device can include a resilient structure coupled to the support structure. The device can include a rigid movable plate coupled to the support structure via the resilient structure and positioned over the aperture. The device can include a proof mass coupled to the movable plate, the proof mass extending into the aperture. The device can include an electrode located on an opposite side of the movable plate from the proof mass.Type: ApplicationFiled: December 31, 2020Publication date: May 19, 2022Inventors: Ken Deng, Michael Pedersen, Jeremy Johnson, Kevin Meneou
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Publication number: 20190370156Abstract: The present disclosure describes methods and systems directed towards providing code coverage during software development. Implementation of code coverage assist developers in visualizing what portions of new code being developed can be tested via available tests as well as evaluating those portions of new code. The testing of the new code in this manner allows developers to understand whether portions of the new code have been developed properly. When the new code is determined to be satisfactory, via the tests and coverage, the new code can be incorporated into the master code branch. By testing the new code before merging, interruptions and downtime associated with the master code branch can be minimized.Type: ApplicationFiled: May 29, 2018Publication date: December 5, 2019Inventors: John Afsal Elias Kuner, Jun Yu, Ken Deng
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Publication number: 20180260717Abstract: The present invention provides a microalloyed steel mechanical property prediction method based on globally additive model, including the following steps: determining some influencing factors of the microalloyed steel mechanical property prediction model; calculating the components and contents of carbonitride precipitation in a microalloyed steel rolling process; expressing the microalloyed steel mechanical property prediction model as an additive form of several submodels according to generalized additive model; estimating the microalloyed steel mechanical property prediction model; and verifying reliability of the submodels. The microalloyed steel property prediction models obtained in the foregoing solution have advantages such as high prediction precision and a wide adaptation range, and may be used for design of new products and steel grade component optimization, so as to reduce the quantity of physical tests, shorten the product research and development cycle, and reduce costs.Type: ApplicationFiled: December 27, 2017Publication date: September 13, 2018Applicant: WUHAN UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Weigang LI, Ken Deng, Wei Yang, Chao Liu
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Publication number: 20070119259Abstract: A piezoelectric flexural sensing structure having increased sensitivity and decreased noise, without sacrifice of the sensor bandwidth. The structure is made up of a proof mass, a beam with a base and optionally having castellated bonding surfaces and two <011> poled bending mode relaxor piezoelectric crystal plates mounted on the beam.Type: ApplicationFiled: September 1, 2006Publication date: May 31, 2007Inventors: Lichun Zou, Ken Deng
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Publication number: 20050132816Abstract: A piezoelectric flexural sensing structure having increased sensitivity and decreased noise, without sacrifice of the sensor bandwidth. The structure is made up of a proof mass, a beam with a base and optionally having castellated bonding surfaces and two <011> poled bonding mode PMN-PT crystal plates mounted on the beam.Type: ApplicationFiled: December 15, 2004Publication date: June 23, 2005Inventors: Lichun Zou, Ken Deng
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Publication number: 20050134149Abstract: A piezoelectric vibration energy harvesting device which is made up of a first mass, a second, a first spring coupled to the first mass, and a second spring coupled to the second mass.Type: ApplicationFiled: January 11, 2005Publication date: June 23, 2005Inventors: Ken Deng, Kikmet Andic
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Publication number: 20050057123Abstract: A piezoelectric vibration energy harvesting device which is made up of a base, a proof mass, and a cymbal stack disposed between the base and the proof mass. The cymbal stack has a piezoelectric element disposed between the base and the proof mass, a first cymbal-shaped cap disposed between the proof mass and the piezoelectric crystal, and a second cymbal-shaped cap disposed between the piezoelectric crystal and the base.Type: ApplicationFiled: July 9, 2004Publication date: March 17, 2005Inventor: Ken Deng
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Publication number: 20050034519Abstract: The present invention is directed to an acoustic vector sensor, specifically an underwater acoustic vector sensor. The acoustic vector sensor contains three piezoelectric sensors orthogonally mounted inside a rigid housing, where each of the piezoelectric sensors measures acoustic energy from one of the three different, orthogonal, axial directions (X, Y, and Z). The piezoelectric sensor contains a proof mass, a base, and a piezoelectric crystal sandwiched therebetween. The bonding surfaces of the proof mass and the base are preferably castellated; and the piezoelectric crystal is preferably a shear mode (d15) relaxor single crystal.Type: ApplicationFiled: July 9, 2004Publication date: February 17, 2005Inventor: Ken Deng
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Patent number: D1042779Type: GrantFiled: April 26, 2022Date of Patent: September 17, 2024Assignee: JUNSKY APPLIANCES LIMITEDInventor: Ken Deng