Patents by Inventor Ken E. Hirukawa

Ken E. Hirukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for removing contaminant from surface of mold die
    Patent number: 6086798
    Abstract: A removable plastic film is attached to the mold die whenever the mold dies needs to be cleaned. Using such a film, the problems with cleaning the mold dies are avoided because whenever the mold dies need cleaning, the film may simply be placed over the mold and simply peeled off to remove all contaminants from the mold. The contaminants stick to the peeled off film and so are removed from the mold.
    Type: Grant
    Filed: December 17, 1998
    Date of Patent: July 11, 2000
    Assignee: Abante Corporation
    Inventor: Ken E. Hirukawa