Patents by Inventor Ken Frayn

Ken Frayn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENT COVER AND ARRANGEMENT
    Publication number: 20120224349
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Application
    Filed: August 30, 2011
    Publication date: September 6, 2012
    Applicant: NOVATEL WIRELESS, INC.
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • Electronic component cover and arrangement
    Patent number: 8009441
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: August 30, 2011
    Assignee: Novatel Wireless, Inc.
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • ELECTRONIC COMPONENT COVER AND ARRANGEMENT
    Publication number: 20100097774
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Application
    Filed: December 21, 2009
    Publication date: April 22, 2010
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • Electronic component cover and arrangement
    Patent number: 7636245
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: December 22, 2009
    Assignee: Novatel Wireless, Inc.
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein