Patents by Inventor Ken Gilleo

Ken Gilleo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package with insert conductor array
    Publication number: 20050046016
    Abstract: A package for an electronic component includes an enclosure that defines a cavity and electrically conductive bodies that extend through a dielectric substrate that forms at least a portion of at least one side of the enclosure, each of the conductive bodies offering accessible electrical contact surfaces on opposite sides of the dielectric substrate. The dielectric material in the enclosed can be partially or entirely formed via injection molding.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 3, 2005
    Inventor: Ken Gilleo
  • Flip chip with integrated flux and underfill
    Patent number: 6265776
    Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: July 24, 2001
    Assignee: Fry's Metals, Inc.
    Inventor: Ken Gilleo
  • Flip chip with integrated flux and underfill
    Publication number: 20010000929
    Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.
    Type: Application
    Filed: December 21, 2000
    Publication date: May 10, 2001
    Inventor: Ken Gilleo
  • Snap cure adhesive based on anhydride/epoxy resins
    Patent number: 6096808
    Abstract: A two-stage accelerator for use in filled anhydride/epoxy systems is disclosed. In particular, the present invention makes use of a first accelerator to initiate curing of the epoxy while the filler becomes wetted, and a second, faster accelerator to complete the curing process.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: August 1, 2000
    Assignee: Alpha Metals, Inc..
    Inventor: Ken Gilleo
  • Color indicator for completion of polymerization for thermosets
    Patent number: 6017983
    Abstract: An indicator for complete polymerization and cure of base-catalyzed epoxy thermoset resin systems is disclosed. In particular, the present invention makes use of an diazo dye having amino groups which forms a salt or complex with hardeners used in various epoxy resin systems. Upon full polymerization and consumption of the hardener, a chromophoric shift of the dye can be observed.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: January 25, 2000
    Assignee: Alpha Metals, Inc.
    Inventor: Ken Gilleo