Patents by Inventor Ken Han

Ken Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929314
    Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20200044989
    Abstract: An apparatus and method for queuing data to a memory buffer. The method includes selecting a queue from a plurality of queues; receiving a token of data from the selected queue and requesting, by a queue module, addresses and pointers from a buffer manager for addresses allocated by the buffer manager for storing the token of data. Subsequently, a memory list is accessed by the buffer manager and addresses and pointers are generated to allocated addresses in the memory list which comprises a plurality of linked memory lists for additional address allocation. The method further includes writing into the accessed memory list the pointers for the allocated address where the pointers link together allocated addresses; and migrating to other memory lists for additional address allocations upon receipt of subsequent tokens of data from the queue; and generating additional pointers linking together the allocated addresses in the other memory lists.
    Type: Application
    Filed: October 7, 2019
    Publication date: February 6, 2020
    Inventors: Vamsi PANCHAGNULA, Saurin PATEL, Ken HAN, Daniel TSAHI
  • Patent number: 6718334
    Abstract: An improved document and image management system (“DIM system”) is provided for use by a digital computer in combination with a video display or other suitable output means to provide an system that operates, preferably, under the Microsoft Windows® shell environment and which, further, is cross-platform capable and application independent. With respect to the data, document, or image to be managed, the invention operates independently of both the computer platform and the application software therein operating that was used to create the data, document, or image. The programming method of the present invention obtains the indices needed to create an image from the application running on the Windows® desktop; and, thereafter, electronically files, or otherwise processes, the image. Such functionality is provided by targeting a data stream that is refreshing the graphical user interface (“GUI”) of a screen running on the Windows® desktop.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: April 6, 2004
    Assignee: Inter American Data, L.L.C.
    Inventor: Ken Han
  • Patent number: 6299819
    Abstract: A double chamber vacuum resin transfer molding process is provided comprising the initial step of providing a double chamber vacuum resin transfer molding apparatus comprising a first mold portion and a second mold portion. The first mold portion and the second mold portion are configured such that, in an engaged state, the first mold portion and the second mold portion define a mold cavity and a brim cavity. The mold cavity is isolated from the brim cavity by a compressible seal. Either or both of the first mold portion and the second mold portion are further configured to define an injection gate in communication with the mold cavity, a mold cavity vacuum port in communication with the mold cavity, and a brim cavity vacuum port in communication with the brim cavity. The first mold portion, the second mold portion, and the compressible seal are arranged such that a decrease in brim cavity pressure below atmospheric pressure causes a corresponding decrease in mold cavity volume.
    Type: Grant
    Filed: June 18, 1999
    Date of Patent: October 9, 2001
    Assignee: The University of Dayton
    Inventor: Kerang Ken Han