Abstract: A method produces a semiconductor device, the method having a step of transferring an underlayer by employing a resist underlayer film-forming composition containing a hydrolysis condensate prepared through hydrolysis and condensation of a hydrolyzable silane in a non-alcoholic solvent in the presence of a strong acid, followed by a step (G) of removing the patterned resist film, the patterned resist underlayer film, and/or particles with a sulfuric acid-hydrogen peroxide mixture (SPM) prepared by mixing of aqueous hydrogen peroxide with sulfuric acid and/or an ammonia-hydrogen peroxide mixture (SC1) prepared by mixing of aqueous hydrogen peroxide with aqueous ammonia, wherein: the hydrolyzable silane contains a hydrolyzable silane of the following Formula (1): R1aR2bSi(R3)4?(a+b)??Formula (1) (wherein R1 is an organic group having a primary amino group, a secondary amino group, or a tertiary amino group and is bonded to a silicon atom via an Si—C bond).

Abstract: An information processing system, which determines a partial area used in an erectness determination which determines whether a determination target image is erect based on a determination feature in the partial area in an image having a predetermined format and a position of the partial area in a state in which the image having the predetermined format is erect, includes processor to receive input of a plurality of learning images having the predetermined format, extract area common to the plurality of learning images in an erect state as a candidate for the partial area, determine common area reliability indicative of a degree to which the candidate for the partial area is suitable as the partial area used in the erectness determination, and determine the partial area used in the erectness determination from the candidate for the partial area, based on the common area reliability.

Abstract: The exposure system comprises a projection optical system that irradiates exposure light emitted from a mask onto a substrate, a first support member that supports the projection optical system, and a support structure that supports the first support member, wherein the support member supports the first support member at a position that is higher than the position at which the first support member supports the projection optical system.

Abstract: The exposure system comprises a projection optical system that irradiates exposure light emitted from a mask onto a substrate, a first support member that supports the projection optical system, and a support structure that supports the first support member, wherein the support member supports the first support member at a position that is higher than the position at which the first support member supports the projection optical system.

Abstract: The apparatus comprises a substrate stage (WST) to mount a substrate (W) and a substrate carriage system (100) to carry a substrate to the substrate stage. The substrate carriage system includes a rotation table (42) that holds and moves the substrate in the X direction and a control system that detects the positional deviation of the substrate W rotating together with the rotation table (42) by using sensors (48) while moving in the X direction. Since the detection of the positional deviation of the substrate overlaps with the time the substrate is being carried, it improves the throughput, as well as improves the space efficiency since exclusive space for detection of the positional deviation is not required. Accordingly, this can reduce the manufacturing cost of devices such as semiconductor devices.

Abstract: An exposure apparatus comprises a container-mount, on which a holder container that can contain a substrate holder in a sealed manner and that has a door is mounted, the door being able to open and close; an open-close mechanism that opens and closes the door in a manner that the inside of the container mounted on the container-mount is isolated from the outside; and a transport system that exchanges such a holder on a stage with another holder in the container when the open-close mechanism has opened the door. Therefore, the transport system can exchange such holders in a short time in a manner that the inside of the apparatus is isolated from the outside. Accordingly, the down time of the apparatus can be shortened, and the cleanliness of the holders can be maintained all the time. As a result, the productivity of devices such as semiconductor devices can be improved.

Abstract: A laser unit is arranged in an area of a floor surface, the width of which area is defined by maintenance areas, on both sides of an exposure-apparatus main body, inclusive. Furthermore, the exposure-apparatus main body and the laser unit are arranged on the floor surface such that maintenance areas of the both overlap each other at least partially. Moreover, a C/D is connected in-line with the front surface of the exposure-apparatus main body, and in the side of the exposure-apparatus main body, which side is in front of the optical axis of the projection optical system and which is connected with the C/D, a housing is provided which has a delivery port into and from which a mask container is loaded and unloaded by a ceiling-transport system that moves along a rail.

Abstract: A method and an apparatus for monitoring and fault-analyzing a network which includes a plurality of LANs. LAN-to-LAN connectors are provided between LANs. The apparatus includes a monitor fault analyzer. A terminal is connected to a LAN, to issue a command which stores specific packets or transfers stored packets, from a command transmitter to LAN-to-LAN connectors. Upon receiving a command, a command holder of a routing unit (router) of the LAN-to-LAN connector holds the command. The router carries out the usual routing process to pass or block packets transferred from the LAN interfaces according to the addressee. A unit for detecting and copying the specified packets compares the address of each received packet with the addresses stored in the command holder, and if they agree with each other, copies the packet. A data storage unit stores the copy in the storage unit and the time of reception of the packet is measured by the timer and added to the packet.

Abstract: The ablation threshold of a laser fluence with respect to the surface of a sample manufactured in a high vacuum chamber is determined by using the sample. The quantity of vacancy-type defects is determined by radiating a laser beam having a fluence slightly higher than the ablation threshold on the surface. At the same time, the quantities of adatom-type and kink-type defects are determined by radiating a pulsed laser beam having a fluence slightly lower than the ablation threshold on the surface repeatedly to obtain the relation between an emission yield and the number of laser pulses. The quantity of the adatom-type defects is obtained by determining the area (total quantity of emitted atoms) of a rapidly decreasing portion of the relation. The quantity of kink-type defects is obtained by determining a magnitude of an emission yield of a slowly decreasing portion of the relation.

Abstract: A basic sample having a surface is set in an ultrahigh vacuum chamber. Atoms constituting the sample are deposited on the surface of the sample to remove vacancy-type defects. A laser beam having a predetermined wavelength and a predetermined fluence is radiated on the sample to remove adatom-type and kink-type defects, thereby producing a defect-free surface. In addition, the same material as that for a basic sample is deposited on a defect-free surface to produce a defect-free thin film.

Abstract: Prior to a periphery exposing operation, a light emitting unit and a light receiving unit are retracted to a position separate from a wafer, and a calibrating operation is conducted in the retracted position utilizing a light shield plate different from the wafer to be exposed, thereby obtaining a servo control reference signal for the exposure. At the exposure of the periphery portion of the wafer, the exposure width is controlled according to the reference signal. It is therefore rendered possible to achieve exact peripheral exposure, including the intensity and intensity distribution of the exposing light beam immediately before the irradiation of the peripheral portion of the wafer.

Abstract: An exposing apparatus for exposing the periphery portion of a substrate on which resist is uniformly applied while rotating the substrate by a rotating device around a substantially central portion of the substrate, comprising: an irradiating device capable of irradiating a light beam, which is not sensed by the resist, toward the periphery portion of the resist; a light receiving device disposed to confront the irradiating device, receiving the light beam and outputting a light receipt signal in accordance with the quantity of received light; a detection device for detecting the rotational angle of the resist and outputting an angular signal; a moving device for relatively moving the light beam irradiated and the substrate in a radial direction; and a control device, wherein the substrate is disposed between the irradiating device and the light receiving device so as to shield a portion of the light beam and a control device controls the moving device in accordance with the light receipt signal and the angul

Abstract: A device for positioning a circular substrate having a cut portion, comprising: a first rotational stage which is finely rotated around the origin of a rectangular coordinate system; an X-Y stage on the first rotational stage which is two-dimensionally moved in the coordinate system; a second rotational stage on the X-Y stage which is rotated while holding the substrate; a first detecting device for detecting information about the displacement change of the periphery of the substrate from the rotational center during the rotation of the second rotational stage; a first positioning controlling device for controlling the rotation of the second rotational stage in accordance with information detected by the first detecting device so that the cut portion is placed in a predetermined direction on the coordinate system; a second detecting device having three or more detecting points in the coordinate system so as to detect the three or more positions of the periphery, the second detecting device generating informat

Abstract: An exposure apparatus for selectively exposing the peripheral portion of a circular substrate such as wafer for integrated circuit manufacturing purposes. In this exposure apparatus, the spot of an exposure light beam from a projecting system is projected onto the peripheral portion of a resist-coated surface of a substantially circular substrate in such a manner that a part of the spot projects from the peripheral edge of the substrate. The portion of the spot projecting from the peripheral edge of the substrate is received by a detector arranged opposite to the projecting system through the intermediary of the substrate peripheral portion so that the position of the substrate peripheral edge in the projected spot is detected in accordance with the contour position of the received spot portion.