Patents by Inventor Ken HAYASHII

Ken HAYASHII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180366241
    Abstract: The present invention provides an insulated wire having a heat-resistant insulating layer, wherein heat-resistant particles are contained in the insulating layer, and the heat-resistant particles are densely dispersed in a surface region of the insulating layer. For example, the concentration of heat-resistant particles included in a layer thick portion of 0.5 ?m from the surface of the insulating layer is two times the concentration of heat-resistant particles included in a central portion of the insulating layer. An electrodeposition liquid used to form the insulating layer is formed by dispersing the heat-resistant particles in a suspension in which resin particles are dispersed, the viscosity is 100 cP or less, and the turbidity is 1 mg/L or more.
    Type: Application
    Filed: December 16, 2015
    Publication date: December 20, 2018
    Inventors: Shintaro IIDA, Reiko IZUMI, Hideaki SAKURAI, Ken HAYASHII, Keiko ASHIDA
  • Publication number: 20170278595
    Abstract: This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic acid is attached onto the surface of the insulating coating. In addition, this method for manufacturing an insulated wire includes a surface treatment step of attaching the dicarboxylic acid onto a surface of an insulating coating which becomes the soldered portion, and a soldering step of performing the solder plating by immersing the surface treated portion of the insulating coating in a heated solder melt.
    Type: Application
    Filed: September 28, 2015
    Publication date: September 28, 2017
    Applicants: Mitsubishi Materials Corporation, Mitsubishi Cable Industries, Ltd.
    Inventors: Reiko IZUMI, Shintaro IIDA, Hideaki SAKURAI, Takeshi IKEDA, Ken HAYASHII