Patents by Inventor Ken Holcomb

Ken Holcomb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias
    Patent number: 9003648
    Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: April 14, 2015
    Assignee: Ormet Circuits, Inc.
    Inventor: Ken Holcomb
  • METHODS TO PRODUCE HIGH DENSITY, MULTILAYER PRINTED WIRING BOARDS FROM PARALLEL-FABRICATED CIRCUITS AND FILLED VIAS
    Publication number: 20100230145
    Abstract: The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.
    Type: Application
    Filed: December 28, 2007
    Publication date: September 16, 2010
    Applicant: ORMET CIRCUITS, INC.
    Inventor: Ken Holcomb