Patents by Inventor Ken-Hsien Hsieh

Ken-Hsien Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8418111
    Abstract: A method and apparatus for achieving multiple patterning compliant technology design layouts is provided. An exemplary method includes providing a routing grid having routing tracks; designating each of the routing tracks one of at least two colors; applying a pattern layout having a plurality of features to the routing grid, wherein each of the plurality of features corresponds with at least one routing track; and applying a feature splitting constraint to determine whether the pattern layout is a multiple patterning compliant layout. If the pattern layout is not a multiple patterning compliant layout, the pattern layout may be modified until a multiple patterning compliant layout is achieved.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: April 9, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huang-Yu Chen, Fang-Yu Fan, Yuan-Te Hou, Lee-Chung Lu, Ru-Gun Liu, Ken-Hsien Hsieh, Lee Fung Song, Wen-Chun Huang, Li-Chun Tien
  • Patent number: 8365102
    Abstract: A method and system checks a double patterning layout and outputs a representation of G0-rule violations and critical G0-spaces. The method includes receiving layout data having patterns, determining whether each distance between adjacent pattern elements is a G0-space, find all G0-space forming a G0-rule violation, finding all G0-space that are critical G0-spaces, and outputting a representation of G0-rule violations and critical G0-spaces to an output device. By resolving G0-rule violations and critical G0-spaces, a design checker can effectively generate a double patterning technology (DPT) compliant layout.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: January 29, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Dio Wang, Ken-Hsien Hsieh, Huang-Yu Chen, Li-Chun Tien, Ru-Gun Liu, Lee-Chung Lu
  • Publication number: 20130024822
    Abstract: Provided is a method of fabricating a semiconductor device. The method includes providing an integrated circuit layout plan, the integrated circuit layout plan containing a plurality of semiconductor features. The method includes selecting a subset of the features for decomposition as part of a double patterning process. The method includes designating a relationship between at least a first feature and a second feature of the subset of the features. The relationship dictates whether the first and second features are assigned to a same photomask or separate photomasks. The designating is carried out using a pseudo feature that is part of the layout plan but does not appear on a photomask. The method may further include a double patterning conflict check process, which may include an odd-loop check process.
    Type: Application
    Filed: July 21, 2011
    Publication date: January 24, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ken-Hsien Hsieh, Huang-Yu Chen, Jhih-Jian Wang, Cheng Kun Tsai, Tsong-Hua Ou, Wen-Chun Huang, Ru-Gun Liu
  • Patent number: 8211807
    Abstract: A method of forming an integrated circuit structure includes forming a first and a second plurality of tracks parallel to a first direction and on a wafer representation. The first and the second plurality of tracks are allocated in an alternating pattern. A first plurality of patterns is laid out on the first plurality of tracks and not on the second plurality of tracks. A second plurality of patterns is laid out on the second plurality of tracks and not on the first plurality of tracks. The first plurality of patterns is extended in the first direction and in a second direction perpendicular to the first direction, so that each of the second plurality of patterns is surrounded by portions of the first plurality of patterns, and substantially none of neighboring ones of the first plurality of patterns on the wafer representation have spacings greater than a pre-determined spacing.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: July 3, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huang-Yu Chen, Ken-Hsien Hsieh, Tsong-Hua Ou, Fang-Yu Fan, Yuan-Te Hou, Ming-Feng Shieh, Ru-Gun Liu, Lee-Chung Lu
  • Publication number: 20120167021
    Abstract: A system and method for providing a cell layout for multiple patterning technology is provided. An area to be patterned is divided into alternating sites corresponding to the various masks. During a layout process, sites located along a boundary of a cell are limited to having patterns in the mask associated with the boundary site. When placed, the individual cells are arranged such that the adjoining cells alternate the sites allocated to the various masks. In this manner, the designer knows when designing each individual cell that the mask pattern for one cell will be too close to the mask pattern for an adjoining cell.
    Type: Application
    Filed: April 11, 2011
    Publication date: June 28, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huang-Yu Chen, Yuan-Te Hou, Ken-Hsien Hsieh, Ru-Gun Liu, Lee-Chung Lu
  • Publication number: 20120131528
    Abstract: A method and apparatus for achieving multiple patterning compliant technology design layouts is provided. An exemplary method includes providing a routing grid having routing tracks; designating each of the routing tracks one of at least two colors; applying a pattern layout having a plurality of features to the routing grid, wherein each of the plurality of features corresponds with at least one routing track; and applying a feature splitting constraint to determine whether the pattern layout is a multiple patterning compliant layout. If the pattern layout is not a multiple patterning compliant layout, the pattern layout may be modified until a multiple patterning compliant layout is achieved.
    Type: Application
    Filed: November 24, 2010
    Publication date: May 24, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Huang-Yu Chen, Fang-Yu Fan, Yuan-Te Hou, Lee-Chung Lu, Ru-Gun Liu, Ken-Hsien Hsieh, Lee Fung Song, Wen-Chun Huang, Li-Chun Tien
  • Publication number: 20120091592
    Abstract: A method of forming an integrated circuit structure includes forming a first and a second plurality of tracks parallel to a first direction and on a wafer representation. The first and the second plurality of tracks are allocated in an alternating pattern. A first plurality of patterns is laid out on the first plurality of tracks and not on the second plurality of tracks. A second plurality of patterns is laid out on the second plurality of tracks and not on the first plurality of tracks. The first plurality of patterns is extended in the first direction and in a second direction perpendicular to the first direction, so that each of the second plurality of patterns is surrounded by portions of the first plurality of patterns, and substantially none of neighboring ones of the first plurality of patterns on the wafer representation have spacings greater than a pre-determined spacing.
    Type: Application
    Filed: October 19, 2010
    Publication date: April 19, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Huang-Yu Chen, Ken-Hsien Hsieh, Tsong-Hua Ou, Fang-Yu Fan, Yuan-Te Hou, Ming-Feng Shieh, Ru-Gun Liu, Lee-Chung Lu
  • Publication number: 20120074400
    Abstract: Provided is an alignment mark having a plurality of sub-resolution elements. The sub-resolution elements each have a dimension that is less than a minimum resolution that can be detected by an alignment signal used in an alignment process. Also provided is a semiconductor wafer having first, second, and third patterns formed thereon. The first and second patterns extend in a first direction, and the third pattern extend in a second direction perpendicular to the first direction. The second pattern is separated from the first pattern by a first distance measured in the second direction. The third pattern is separated from the first pattern by a second distance measured in the first direction. The third pattern is separated from the second pattern by a third distance measured in the first direction. The first distance is approximately equal to the third distance. The second distance is less than twice the first distance.
    Type: Application
    Filed: September 28, 2010
    Publication date: March 29, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Feng Shieh, Ya Hui Chang, Ru-Gun Liu, Tsong-Hua Ou, Ken-Hsien Hsieh, Burn Jeng Lin
  • Publication number: 20110296360
    Abstract: A method and system checks a double patterning layout and outputs a representation of G0-rule violations and critical G0-spaces. The method includes receiving layout data having patterns, determining whether each distance between adjacent pattern elements is a G0-space, find all G0-space forming a G0-rule violation, finding all G0-space that are critical G0-spaces, and outputting a representation of G0-rule violations and critical G0-spaces to an output device. By resolving G0-rule violations and critical G0-spaces, a design checker can effectively generate a double patterning technology (DPT) compliant layout.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Dio WANG, Ken-Hsien HSIEH, Huang-Yu CHEN, Li-Chun TIEN, Ru-Gun LIU, Lee-Chung LU
  • Publication number: 20110197168
    Abstract: Various embodiments of the invention provide techniques to ensure a layout for an integrated circuit is split-able. In a method embodiment, a layout is generated in a customer site having a layout library as inputs wherein the library provides exemplary layouts that have been verified to be spit-able and that can be used and layouts that can cause conflicts to avoid. A real-time odd cycle checker is also provided in which the checker identifies in real time conflict areas and odd cycles as they arise during layout generation. To reduce memory usage layouts of various devices may be separated so that each individual layout or a small number of layouts, rather than a large layout for the whole application circuit, can be checked against conflicts. Once the layout is ready at the customer site, it is sent to the foundry site to be decomposed into two masks and taped-out. Other embodiments are also disclosed.
    Type: Application
    Filed: February 9, 2010
    Publication date: August 11, 2011
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pi-Tsung Chen, Ming-Hui Chih, Ken-Hsien Hsieh, Wei-Long Wang, Wen-Chun Huang, Ru-Gun Liu, Tsai-Sheng Gau, Wen-Ju Yang, Gwan Sin Chang, Yung-Sung Yen