Abstract: A system, method, and non-transitory computer-readable medium for identifying a cause of manufacturing defects are provided. The system includes a processing unit and an image capture unit electrically coupled to the processing unit. The system is configured to capture, by the image capture unit, a number N of images covering different portions of a semiconductor wafer, wherein each of the number N of images comprises a number M of geometric features. The system is further configured to specify a number M of serial numbers, each associated with one of the number M of geometric features. The system is further configured to calculate, by the processing unit, a geometric center for each of the geometric features of the number N of images. The system is further configured to calculate, based on the number N of images, a number M of average geometric centers associated with the number M of serial numbers.

Abstract: A method for identifying a cause of manufacturing defects is provided. The method includes capturing, by an image capture unit, a number N of images from a semiconductor wafer, wherein each of the s umber N of images comprises a number M of geometric features, calculating, by a processing unit, a geometric center for each of the geometric features of the number N of images, calculating, based on the number N of images, a number M of average geometric centers associated with the number M of geometric features, and calculating a shift amount for each geometric feature of the number N of images.

Abstract: A system, method, and non-transitory computer-readable medium for identifying a cause of manufacturing defects are provided. The system includes a processing unit and an image capture unit electrically coupled to the processing unit. The system is configured to capture, by the image capture unit, a number N of images covering different portions of a semiconductor wafer, wherein each of the number N of images comprises a number M of geometric features. The system is further configured to specify a number M of serial numbers, each associated with one of the number M of geometric features. The system is further configured to calculate, by the processing unit, a geometric center for each of the geometric features of the number N of images. The system is further configured to calculate, based on the number N of images, a number M of average geometric centers associated with the number M of serial numbers.

Abstract: A method for identifying a cause of manufacturing defects is provided. The method includes capturing, by an image capture unit, a number N of images from a semiconductor wafer, wherein each of the s umber N of images comprises a number M of geometric features, calculating, by a processing unit, a geometric center for each of the geometric features of the number N of images, calculating, based on the number N of images, a number M of average geometric centers associated with the number M of geometric features, and calculating a shift amount for each geometric feature of the number N of images.