Abstract: A device includes a diffraction-based overlay (DBO) mark having an upper-layer pattern disposed over a lower-layer pattern, and having smallest dimension greater than about 5 micrometers. The device further includes a calibration mark having an upper-layer pattern disposed over a lower-layer pattern, positioned substantially at a center of the DBO mark, and having smallest dimension less than about ? the size of the smallest dimension of the DBO mark.

Abstract: A muscle fitness relaxation device includes at least two roller units spaced apart from each other along a longitudinal direction, and at least one connecting unit connected between the roller units. Each of the roller units extends along an axis perpendicular to the longitudinal direction, and has an outer peripheral surface extending around the axis.

Abstract: According to one embodiment, a semiconductor device is provided. The semiconductor device includes a first semiconductor module, a redistribution layer (RDL) module and a second semiconductor module. The RDL module is disposed on the first semiconductor module. The RDL module includes a plurality of polymer layers and a plurality of vias. The polymer layers are stacked on the first semiconductor module. The vias are disposed within the polymer layers. The second semiconductor module is disposed on the RDL module. A height difference of a top surface of at least one of the polymer layers ranges from 0 um to 1 um; or an angle between a sidewall and a bottom surface of at least one of the vias ranges from 90° to 95°; or a glass transition temperature (Tg) of at least one of the polymer layers is larger than 260° C.

Abstract: A muscle fitness relaxation device includes at least two roller units spaced apart from each other along a longitudinal direction, and at least one connecting unit connected between the roller units. Each of the roller units extends along an axis perpendicular to the longitudinal direction, and has an outer peripheral surface extending around the axis.

Abstract: A device includes a diffraction-based overlay (DBO) mark having an upper-layer pattern disposed over a lower-layer pattern, and having smallest dimension greater than about 5 micrometers. The device further includes a calibration mark having an upper-layer pattern disposed over a lower-layer pattern, positioned substantially at a center of the DBO mark, and having smallest dimension less than about 1/5 the size of the smallest dimension of the DBO mark.

Abstract: A direct-type light source module including N-stage light sources and an optical sheet is provided. The optical sheet is disposed above the N-stage light sources, and an optical distance between the i-th-stage light source and the optical sheet is smaller than an optical distance between the i+1-th-stage light source and the optical sheet, where 1?i<N, and N is a positive integer greater than 1. A display device is also provided.

Abstract: Semiconductor processing apparatuses and methods are provided in which a semiconductor wafer is flipped and then rotated between patterning of front and back sides of the semiconductor wafer by first and second reticles, respectively. In some embodiments, a method includes patterning, by a first reticle, a first layer on a first side of a semiconductor wafer while the first side of the semiconductor wafer is facing a first direction. The semiconductor wafer is then flipped. A second side of the semiconductor wafer that is opposite the first side faces the first direction after the flipping the semiconductor wafer. The semiconductor wafer is then rotated about a rotational axis extending along the first direction, and a second layer on the second side of the semiconductor wafer is patterned by a second reticle.

Abstract: Semiconductor processing apparatuses and methods are provided in which a semiconductor wafer is flipped and then rotated between patterning of front and back sides of the semiconductor wafer by first and second reticles, respectively. In some embodiments, a method includes patterning, by a first reticle, a first layer on a first side of a semiconductor wafer while the first side of the semiconductor wafer is facing a first direction. The semiconductor wafer is then flipped. A second side of the semiconductor wafer that is opposite the first side faces the first direction after the flipping the semiconductor wafer. The semiconductor wafer is then rotated about a rotational axis extending along the first direction, and a second layer on the second side of the semiconductor wafer is patterned by a second reticle.

Abstract: A design application allows an end-user to define an engineering problem, and then synthesizes a spectrum of design options that solve the engineering problem. The design application then generates various tools to allow the end-user to explore that spectrum of design options. The design application allows the end-user to compare various attributes of each design option, and to filter the spectrum of design options based on those attributes. In response to end-user selections of certain design options, the design application identifies other similar design options, and then displays these design options to the end-user.

Abstract: A contact interface includes a first contact member including a first contact surface with a first material subsurface and a second material subsurface. The second material subsurface protrudes transversely above the first material subsurface. A second contact member includes a second contact surface to slide in contact with the first contact surface. The first material subsurface comprises a first material. The second material subsurface comprises a second material. The second material has a lower hardness than the first material.

Abstract: A contact interface includes a first contact member including a first contact surface with a first material subsurface and a second material subsurface. The second material subsurface protrudes transversely above the first material subsurface. A second contact member includes a second contact surface to slide in contact with the first contact surface. The first material subsurface comprises a first material. The second material subsurface comprises a second material. The second material has a lower hardness than the first material.

Abstract: A method of culturing Antrodia cinnamomea and obtaining Antrodia cinnamomea with improved contents of antcin C and zhankuic acid C is disclosed in the invention. The method comprises: providing a wood segment of Cinnamomum kanehirai; inoculating a strain of Antrodia cinnamomea to the wood segment, to obtain the wood segment inoculated with the strain of Antrodia cinnamomea with 0.162 g dry weight of hyphae and mycelia of the strain of Antrodia cinnamomea per kg wood segment; and irradiating the wood segment inoculated with the strain of Antrodia cinnamomea by a light of wavelength of 600-700 nm to obtain a fruit body; wherein an irradiation time of the wood segment inoculated with the strain of Antrodia cinnamomea is 8-12 hours per day for 30-40 days.

Abstract: A method of culturing Antrodia cinnamomea and obtaining Antrodia cinnamomea with improved contents of antcin C and zhankuic acid C is disclosed in the invention. The method comprises: providing a wood segment of Cinnamomum kanehirai; inoculating a strain of Antrodia cinnamomea to the wood segment, to obtain the wood segment inoculated with the strain of Antrodia cinnamomea with 0.162 g dry weight of hyphae and mycelia of the strain of Antrodia cinnamomea per kg wood segment; and irradiating the wood segment inoculated with the strain of Antrodia cinnamomea by a light of wavelength of 600-700 nm to obtain a fruit body; wherein an irradiation time of the wood segment inoculated with the strain of Antrodia cinnamomea is 8-12 hours per day for 30-40 days.

Abstract: A design application allows an end-user to define an engineering problem, and then synthesizes a spectrum of design options that solve the engineering problem. The design application then generates various tools to allow the end-user to explore that spectrum of design options. The design application allows the end-user to compare various attributes of each design option, and to filter the spectrum of design options based on those attributes. In response to end-user selections of certain design options, the design application identifies other similar design options, and then displays these design options to the end-user.

Abstract: A method of culturing Antrodia cinnamomea and obtaining Antrodia cinnamomea with improved contents of antcin C and zhankuic acid C is disclosed in the invention. The method comprises: providing a wood segment of Cinnamomum kanehirai; inoculating a strain of Antrodia cinnamomea to the wood segment, to obtain the wood segment inoculated with the strain of Antrodia cinnamomea with 0.162 g dry weight of hyphae and mycelia of the strain of Antrodia cinnamomea per kg wood segment; and irradiating the wood segment inoculated with the strain of Antrodia cinnamomea by a light of wavelength of 600-700 nm to obtain a fruit body; wherein an irradiation time of the wood segment inoculated with the strain of Antrodia cinnamomea is 8-12 hours per day for 30-40 days.

Abstract: A light plate includes a light guide plate and four light source modules. The light source modules are disposed around the light guide plate. Each of the light source modules includes a first white light emitting element and a second white light emitting element. The first white light emitting element is capable of emitting a first white beam. The second white light emitting element disposed beside the first white light emitting element is capable of emitting a second white beam. The first white light emitting elements of the light source modules are mirror-symmetrical with respect to a first reference plane and a second reference plane. The second white light emitting elements of the light source modules are mirror-symmetrical with respect to the first reference plane and the second reference plane. The correlated color temperature (CCT) of the first white beam is greater than the CCT of the second white beam.

Abstract: A backlight module includes at least one light emitting device capable of emitting a light beam, a light guide plate, and a thermal insulation light guide element. The light guide plate has two surfaces opposite to each other and a side surface connecting the two surfaces. The light emitting device is disposed beside the side surface. The light beam enters the light guide plate through the side surface. The thermal insulation light guide element has a light incident surface and a light emitting surface. The light incident surface having at least one first recess is located in a transmission path of the light beam and between the light emitting device and the side surface. The light emitting surface is disposed between the light incident surface and the side surface. The glass transition temperature of the thermal insulation light guide element is higher than that of the light guide plate.

Abstract: A display apparatus and a backlight module are provided. The display apparatus includes a liquid crystal panel and a backlight module. The backlight module includes a frame, a plurality of latch members, and a backlight source. The frame has a receiving slot. The liquid crystal panel is disposed in the receiving slot. The latch members are disposed on the frame and located at an inner wall of the receiving slot. The latch members support the liquid crystal panel. A material of each latch member is a debris-resistant material. The backlight source is disposed on the frame and located at one side of the liquid crystal panel. The invention may prevent the producing of debris when the latch members and the liquid crystal panel are rubbed against each other.

Abstract: A backlight module includes at least one light emitting device capable of emitting a light beam, a light guide plate, and a thermal insulation light guide element. The light guide plate has two surfaces opposite to each other and a side surface connecting the two surfaces. The light emitting device is disposed beside the side surface. The light beam enters the light guide plate through the side surface. The thermal insulation light guide element has a light incident surface and a light emitting surface. The light incident surface having at least one first recess is located in a transmission path of the light beam and between the light emitting device and the side surface. The light emitting surface is disposed between the light incident surface and the side surface. The glass transition temperature of the thermal insulation light guide element is higher than that of the light guide plate.

Abstract: A light plate includes a light guide plate and four light source modules. The light source modules are disposed around the light guide plate. Each of the light source modules includes a first white light emitting element and a second white light emitting element. The first white light emitting element is capable of emitting a first white beam. The second white light emitting element disposed beside the first white light emitting element is capable of emitting a second white beam. The first white light emitting elements of the light source modules are mirror-symmetrical with respect to a first reference plane and a second reference plane. The second white light emitting elements of the light source modules are mirror-symmetrical with respect to the first reference plane and the second reference plane. The correlated colour temperature (CCT) of the first white beam is greater than the CCT of the second white beam.