Patents by Inventor Ken-ichi Asahi

Ken-ichi Asahi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for determining focus deviation amount in pattern exposure and pattern exposure method
    Patent number: 7474382
    Abstract: A plurality of first measurement patterns each including a protruding pattern formed of a resist film and a recessed pattern having a space with a shape corresponding to the protruding pattern are formed on a first substrate such that they have different focus values at a time of exposure, edge inclination amounts of the plurality of first measurement patterns are measured, and a focus dependence (17) of the edge inclination amounts is obtained based on correspondences (7) and (14) between the edge inclination amounts and the focus values. A second measurement pattern including the protruding pattern and the recessed pattern is formed on a second substrate so as to measure edge inclination amounts of the second measurement pattern, and a focus deviation amount deviating from a best focus at the time of exposure of the second measurement pattern is calculated from the edge inclination amounts of the second measurement pattern based on the focus dependence of the edge inclination amounts.
    Type: Grant
    Filed: May 28, 2004
    Date of Patent: January 6, 2009
    Assignee: Panasonic Corporation
    Inventors: Hirofumi Fukumoto, Naohiko Ujimaru, Ken-ichi Asahi, Fumio Iwamoto
  • Method for determining focus deviation amount in pattern exposure and pattern exposure method
    Publication number: 20060285098
    Abstract: A plurality of first measurement patterns each including a protruding pattern formed of a resist film and a recessed pattern having a space with a shape corresponding to the protruding pattern are formed on a first substrate such that they have different focus values at a time of exposure, edge inclination amounts of the plurality of first measurement patterns are measured, and a focus dependence (17) of the edge inclination amounts is obtained based on correspondences (7) and (14) between the edge inclination amounts and the focus values. A second measurement pattern including the protruding pattern and the recessed pattern is formed on a second substrate so as to measure edge inclination amounts of the second measurement pattern, and a focus deviation amount deviating from a best focus at the time of exposure of the second measurement pattern is calculated from the edge inclination amounts of the second measurement pattern based on the focus dependence of the edge inclination amounts.
    Type: Application
    Filed: May 28, 2004
    Publication date: December 21, 2006
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Hirofumi Fukumoto, Naohiko Ujimaru, Ken-ichi Asahi, Fumio Iwamoto