Patents by Inventor Kenichi Ogawa
Kenichi Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978885Abstract: An electrode for nonaqueous electrolyte secondary batteries, provided with a collector and a positive electrode active material layer arranged on the collector and contains a positive electrode active material. The positive electrode active material contains compound particles which have a layered structure composed of two or more transition metals, and which have an average particle diameter DSEM of from 1 ?m to 7 ?m (inclusive) based on the observation with an electron microscope, a ratio of the 50% particle diameter D50 in a volume-based cumulative particle size distribution to the average particle diameter DSEM, namely D50/DSEM of from 1 to 4 (inclusive), and a ratio of the 90% particle diameter D90 in the volume-based cumulative particle size distribution to the 10% particle diameter D10 in the volume-based cumulative particle size distribution, namely D90/D10 of 4 or less. The positive electrode active material layer has a void fraction of 10-45%.Type: GrantFiled: October 5, 2021Date of Patent: May 7, 2024Assignees: HONDA MOTOR CO., LTD., NICHIA CORPORATIONInventors: Atsushi Ogawa, Toru Sukigara, Hiroto Maeyama, Soshi Kawamura, Kenichi Kobayashi
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Patent number: 11968777Abstract: This wiring board includes a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate.Type: GrantFiled: February 15, 2022Date of Patent: April 23, 2024Assignees: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYOInventors: Kenichi Ogawa, Takao Someya
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Publication number: 20240126195Abstract: A fixing apparatus to fix a toner image to a printing material while nipping and conveying the printing material at a fixing nip includes a film, a guide member, a nip-forming member in a recess of the guide member, a roller, a support member, and a moving mechanism. The guide member in an inner space of the film guides film rotation. The roller is in contact with a film outer circumferential surface. The roller sandwiches the film with the nip-forming member to form the fixing nip. When disposed in the recess, the nip-forming member is movable in a direction parallel to a conveying direction of the printing material. The support member is fixed to an end of the nip-forming member in a longitudinal direction. The moving mechanism moves the support member relative to the guide member in the direction parallel to the conveying direction.Type: ApplicationFiled: October 16, 2023Publication date: April 18, 2024Inventors: FUYUKO KOYAMA, KENICHI OGAWA
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Patent number: 11945213Abstract: A liquid discharge apparatus includes a conveying part configured to convey a medium in a conveying direction. A discharge head is configured to discharge a droplet onto a medium carried by the conveying part. A heating part is arranged at the downstream of the discharge head and configured to heat a medium while contacting with the medium attached with a droplet discharged by the discharge head. The heating part is arranged at a position contacting with at least part of the droplet present on the surface of the medium.Type: GrantFiled: February 2, 2023Date of Patent: April 2, 2024Assignee: Canon Kabushiki KaishaInventors: Takuya Hamada, Kenichi Ogawa
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Publication number: 20230376002Abstract: A machine learning device has an input data acquisition unit that acquires input data including an arbitrary machining condition for an arbitrary workpiece to be machined by an arbitrary machine tool, a cleaning condition for cleaning, by an arbitrary cleaning device, the inside of a machine by which the workpiece was machined under the machining condition and state information indicating a degree of dirtiness of the inside of the machine before the machining under the machining condition. The device also has a label acquisition unit that acquires, as label data, state information about the inside of the machine after machining under the machining condition and cleaning under the cleaning condition included in the input data, and a learning unit that executes supervised learning using the input data and the label data, so as to generate a learned model.Type: ApplicationFiled: November 2, 2021Publication date: November 23, 2023Inventors: Kenichi OGAWA, Takashi NAGATOMI
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Patent number: 11778737Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.Type: GrantFiled: July 29, 2021Date of Patent: October 3, 2023Assignees: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYOInventors: Naoko Okimoto, Kenichi Ogawa, Takao Someya
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Patent number: 11744011Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.Type: GrantFiled: October 31, 2019Date of Patent: August 29, 2023Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Kenichi Ogawa, Naoko Okimoto, Mitsutaka Nagae, Makiko Sakata, Toru Miyoshi
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Publication number: 20230173827Abstract: A liquid discharge apparatus includes a conveying part configured to convey a medium in a conveying direction. A discharge head is configured to discharge a droplet onto a medium carried by the conveying part. A heating part is arranged at the downstream of the discharge head and configured to heat a medium while contacting with the medium attached with a droplet discharged by the discharge head. The heating part is arranged at a position contacting with at least part of the droplet present on the surface of the medium.Type: ApplicationFiled: February 2, 2023Publication date: June 8, 2023Inventors: Takuya Hamada, Kenichi Ogawa
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Patent number: 11653444Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.Type: GrantFiled: March 19, 2020Date of Patent: May 16, 2023Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Naoko Okimoto, Mitsutaka Nagae, Kenichi Ogawa, Makiko Sakata, Toru Miyoshi
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Patent number: 11612054Abstract: A substrate that is stretchable; wiring positioned on a first surface side of the substrate, the wiring having a meandering shape section including peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The substrate has a component region and a wiring region adjacent to the component region. The component region includes a component-fixing region overlapping an electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate and a component-surrounding region positioned around the component-fixing region. The stretching control mechanism is positioned in the component-surrounding region and at least includes a stretching control part that spreads to the border between the component-surrounding region and the component-fixing region.Type: GrantFiled: October 12, 2018Date of Patent: March 21, 2023Assignees: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYOInventors: Naoko Okimoto, Kenichi Ogawa, Takao Someya
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Patent number: 11584143Abstract: A liquid discharge apparatus includes a conveying part configured to convey a medium in a conveying direction. A discharge head is configured to discharge a droplet onto a medium carried by the conveying part. A heating part is arranged at the downstream of the discharge head and configured to heat a medium while contacting with the medium attached with a droplet discharged by the discharge head. The heating part is arranged at a position contacting with at least part of the droplet present on the surface of the medium.Type: GrantFiled: February 4, 2021Date of Patent: February 21, 2023Assignee: Canon Kabushiki KaishaInventors: Takuya Hamada, Kenichi Ogawa
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Patent number: 11535044Abstract: A printing apparatus includes a conveyance unit, a printing unit, and a heating unit provided on a downstream side with respect to the printing unit in the conveyance direction, and a control unit. The conveyance unit conveys a printing medium along a conveyance direction. The printing unit ejects ink onto the printing medium conveyed by the conveyance unit. The heating unit heats the printing medium on which ink has been ejected by the printing unit while being in contact therewith. The control unit controls the printing apparatus such that a first surface of the printing medium passes through the same heating unit a plurality of times, wherein the first surface includes ink having been ejected by the printing unit onto the first surface.Type: GrantFiled: September 25, 2020Date of Patent: December 27, 2022Assignee: Canon Kabushiki KaishaInventors: Takuya Hamada, Kenichi Ogawa
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Patent number: 11515034Abstract: A nurse call system that enables a call for a nurse from anywhere in a hospital ward while a patient carries a mobile phone is provided. The nurse call system includes a plurality of patient mobile phones 10 are carried by hospitalized patients and connected to a controller 8 via a base station 12 as with nurse mobile phones 9, and each patient mobile phone 10 has a hospital room ID and a nurse call slave device ID registered therein for recognizing a bed location of the patient carrying the patient mobile phone 10, thus enabling a nurse call operation for transmitting a call signal with the hospital room ID and the slave device ID added thereto, to the nurse call master device 7 and at least one of the nurse mobile phones 9, through a predetermined operation.Type: GrantFiled: April 27, 2020Date of Patent: November 29, 2022Assignee: Aiphone Co., Ltd.Inventor: Kenichi Ogawa
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Patent number: 11395404Abstract: A wiring board includes a first substrate having stretchability, wiring disposed adjacent to a first surface of the first substrate and extending in a first direction, and a stopper disposed adjacent to the first surface or second surface of the first substrate. While stretch length of the wiring board is being increased in the first direction, electrical resistance of the wiring exhibits a first turning point at a first stretch length and tension applied to the wiring board exhibits a second turning point at a second stretch length smaller than the first stretch length. The first turning point is a point at which an increase in electrical resistance per unit stretch length changes. The second turning point is a point at which an increase in tension per unit stretch length changes.Type: GrantFiled: October 31, 2019Date of Patent: July 19, 2022Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Naoko Okimoto, Kenichi Ogawa, Mitsutaka Nagae, Makiko Sakata, Toru Miyoshi
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Patent number: 11393383Abstract: A display control device includes: a circle setting unit that sets a reference circle that serves as the reference for a scale mark layout; a scale mark position determining unit that determines the position of a scale mark on the reference circle; a rectangle setting unit that sets a number display rectangle of the size corresponding to the number of digits of the indication number indicating the value corresponding to the scale mark; a rectangle position determining unit that determines the layout position of the number display rectangle from the position of the scale mark, using a calculating formula that has been set on the basis of the size of the reference circle and the size of the number display rectangle; and a number display unit that displays a number in the number display rectangle, and the calculating formula is designed so that, in a case where a straight line extending through the center of the reference circle on a display screen is set as a symmetrical axis, number display rectangles for dispType: GrantFiled: November 13, 2020Date of Patent: July 19, 2022Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Hirohiko Higuchi, Kenichi Ogawa, Keiko Imamura
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Publication number: 20220210912Abstract: This wiring board includes a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate.Type: ApplicationFiled: February 15, 2022Publication date: June 30, 2022Applicants: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYOInventors: Kenichi OGAWA, Takao SOMEYA
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Publication number: 20220183150Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.Type: ApplicationFiled: March 19, 2020Publication date: June 9, 2022Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Naoko OKIMOTO, Mitsutaka NAGAE, Kenichi OGAWA, Makiko SAKATA, Toru MIYOSHI
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Patent number: 11284507Abstract: A wiring board includes: a substrate first elastic modulus including a first surface and second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member second elastic modulus greater than the first elastic modulus and including a first reinforcing part positioned on the first surface side of the substrate or on the second surface side of the substrate and partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate. The wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface including pluralities of peaks and valleys aligned along a planar direction of the first surface of the substrate.Type: GrantFiled: October 12, 2018Date of Patent: March 22, 2022Assignees: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYOInventors: Kenichi Ogawa, Takao Someya
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Publication number: 20220015228Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.Type: ApplicationFiled: July 29, 2021Publication date: January 13, 2022Applicants: DAI NIPPON PRINTING CO., LTD., THE UNIVERSITY OF TOKYOInventors: Naoko OKIMOTO, Kenichi OGAWA, Takao SOMEYA
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Publication number: 20220015227Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.Type: ApplicationFiled: October 31, 2019Publication date: January 13, 2022Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Kenichi OGAWA, Naoko OKIMOTO, Mitsutaka NAGAE, Makiko SAKATA, Toru MIYOSHI