Abstract: An electronic component package includes, a die pad on which an electronic component is mounted, a radiation plate disposed to be connected to part of the die pad and bent downward, a plurality of leads disposed side by side on a periphery of the die pad, each lead composed of an inner lead disposed on the die pad side and an outer lead connected to the inner lead and bent downward, and a resin portion composed of a lower resin portion formed under the die pad and the inner lead, and a frame-like resin portion formed in a ring shape to stand up on the lower resin portion so that a connection part of the inner lead and an upper surface of the die pad can be exposed, wherein the die pad, the radiation plate and the leads are supported by the resin portion and integrated with each other.

Abstract: A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

Abstract: A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

Abstract: A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them from the upper and lower surfaces thereof. The mold resin defines a chip mounting recess at an upper side on the first surfaces of the leads, so that a semiconductor chip is to be mounted in the recess. The upper surfaces of the leads are partially exposed in the recess so as to define internal connecting terminals to which the semiconductor chip is to be electrically connected. The mold resin is provided with a plurality of holes by which the lower surfaces of the leads are partially exposed to define external connecting terminals.

Abstract: The object of the present invention is to provide a premolded-type package for a semiconductor device which can be produced easily and exhibits a good airtightness, and to provide a method for effectively producing the same. A package for a semiconductor device has a wiring substrate 32 having a resin substrate 35 which is provided on its one surface with a wiring pattern 37, a chip-mounting portion 36 and a frame-like pattern 38 of a metal surrounding the wiring pattern 37 and the chip-mounting portion 36, and on the other surface with a plurality of terminals 41 electrically connected to the wiring pattern, and a frame-like molded portion 45 of thermosetting resin, molded on the frame-like pattern 38 on the wiring substrate 32.

Abstract: A lead frame for mounting thereon an optical semiconductor device includes a stage, a plurality of leads arranged in a peripheral region of the stage and a support member extended from said stage. An optical semiconductor device includes such a lead frame, a substrate mounted on the stage of the lead frame, an optical semiconductor chip mounted on the substrate and having electrodes which are electrically connected to the electrodes. An optical fiber has a leading end which is mounted on the substrate and an intermediate portion which is fixedly secured to the support member so that the leading end portion is located at a predetermined position with respect to the chip. An insulating sealing material hermetically seals the optical semiconductor chip, the leading end portion of the optical fiber and at least a part of the support member.

Abstract: A compression molding apparatus comprising a rotary compression molding means, a material feed means and an article carrying means.

Abstract: A compression molding apparatus comprising a rotary compression molding means, a material feed means and an article carrying means.