Patents by Inventor Ken-ichi Umekita

Ken-ichi Umekita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040077512
    Abstract: This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same.
    Type: Application
    Filed: October 14, 2003
    Publication date: April 22, 2004
    Applicant: WAKO PURE CHEMICAL INDUSTRIES, LTD.
    Inventors: Masahiko Kakizawa, Ken-Ichi Umekita, Ichiro Hayashida
  • Patent number: 6716803
    Abstract: This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. The said cleaning agent and the method have made it possible to control a speed of etching on silicone oxide so as to remove impurities adsorbed on copper wirings and silicone oxide on a surface of a semi-conductor substrate having copper wirings on its surface, such as copper oxides and particles, without causing corrosion or oxidation of copper wirings nor causing roughness on the surface.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: April 6, 2004
    Assignee: Wako Pure Chemcial Industries, Ltd.
    Inventors: Masahiko Kakizawa, Ken-ichi Umekita, Ichiro Hayashida
  • Patent number: 6534458
    Abstract: This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. The said cleaning agent and the method have made it possible to control a speed of etching on silicone oxide so as to remove impurities adsorbed on copper wirings and silicone oxide on a surface of a semi-conductor substrate having copper wirings on its surface, such as copper oxides and particles, without causing corrosion or oxidation of copper wirings nor causing roughness on the surface.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: March 18, 2003
    Assignee: Wako Pure Chemical Industries, Ltd.
    Inventors: Masahiko Kakizawa, Ken-ichi Umekita, Ichiro Hayashida
  • Publication number: 20020016272
    Abstract: This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same.
    Type: Application
    Filed: August 8, 2001
    Publication date: February 7, 2002
    Applicant: WAKO PURE CHEMICAL INDUSTRIES, LTD.
    Inventors: Masahiko Kakizawa, Ken-Ichi Umekita, Ichiro Hayashida
  • Patent number: 6310019
    Abstract: This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. The said cleaning agent and the method have made it possible to control a speed of etching on silicone oxide so as to remove impurities adsorbed on copper wirings and silicone oxide on a surface of a semi-conductor substrate having copper wirings on its surface, such as copper oxides and particles, without causing corrosion or oxidation of copper wirings nor causing roughness on the surface.
    Type: Grant
    Filed: July 5, 2000
    Date of Patent: October 30, 2001
    Assignee: Wako Pure Chemical Industries, Ltd.
    Inventors: Masahiko Kakizawa, Ken-ichi Umekita, Ichiro Hayashida