Patents by Inventor Ken J. Hayworth
Ken J. Hayworth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7437253Abstract: Parametrically disciplined operation of a symmetric nearly degenerate mode vibratory gyroscope is disclosed. A parametrically-disciplined inertial wave gyroscope having a natural oscillation frequency in the neighborhood of a sub-harmonic of an external stable clock reference is produced by driving an electrostatic bias electrode at approximately twice this sub-harmonic frequency to achieve disciplined frequency and phase operation of the resonator. A nearly symmetric parametrically-disciplined inertial wave gyroscope that can oscillate in any transverse direction and has more than one bias electrostatic electrode that can be independently driven at twice its oscillation frequency at an amplitude and phase that disciplines its damping to zero in any vibration direction. In addition, operation of a parametrically-disciplined inertial wave gyroscope is taught in which the precession rate of the driven vibration pattern is digitally disciplined to a prescribed non-zero reference value.Type: GrantFiled: July 29, 2005Date of Patent: October 14, 2008Assignees: The Boeing Company, California Institute of TechnologyInventors: Kirill V. Shcheglov, Ken J. Hayworth, A. Dorian Challoner, Chris S. Peay
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Patent number: 7396478Abstract: A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.Type: GrantFiled: September 5, 2007Date of Patent: July 8, 2008Assignees: California Institute of Technology, The Boeing CompanyInventors: Ken J. Hayworth, Karl Y. Yee, Kirill V. Shcheglov, Youngsam Bae, Dean V. Wiberg, A. Dorian Challoner, Chris S. Peay
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Patent number: 7347095Abstract: The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.Type: GrantFiled: August 8, 2005Date of Patent: March 25, 2008Assignees: The Boeing Company, California Institute of TechnologyInventors: Kirill V. Shcheglov, A. Dorian Challoner, Ken J. Hayworth, Dean V. Wiberg, Karl Y. Yee
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Patent number: 7285844Abstract: A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.Type: GrantFiled: June 10, 2004Date of Patent: October 23, 2007Assignees: California Institute of Technology, The Boeing CompanyInventors: Ken J. Hayworth, Karl Y. Yee, Kirill V. Shcheglov, Youngsam Bae, Dean V. Wiberg, A. Dorian Challoner, Chris S. Peay
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Patent number: 6944931Abstract: The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.Type: GrantFiled: August 12, 2003Date of Patent: September 20, 2005Assignees: The Boeing Company, California Institute of TechnologyInventors: Kirill V. Shcheglov, A. Dorian Challoner, Ken J. Hayworth, Dean V. Wiberg, Karl Y. Yee
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Patent number: 6915215Abstract: Embodiments of the invention generally encompass a digital, application specific integrated circuit (ASIC) has been designed to perform excitation of a selected mode within a vibratory rate gyroscope, damping, or “force-rebalance,” of other modes within the sensor, and signal demodulation of the in-phase and quadrature components of the signal containing the angular rate information. The ASIC filters dedicated to each channel may be individually programmed to accommodate different rate sensor designs/technology or variations within the same class of sensors. The ASIC architecture employs a low-power design, making the ASIC, particularly suitable for use in power-sensitive applications.Type: GrantFiled: June 25, 2003Date of Patent: July 5, 2005Assignees: The Boeing Company, California Institute of Technology, The Regents of the University of CaliforniaInventors: Robert M'Closkey, A. Dorian Challoner, Eugene Grayver, Ken J. Hayworth
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Patent number: 6823734Abstract: The present invention discloses an isolated electrostatic biased resonator gyroscope. The gyroscope includes an isolated resonator having a first and a second differential vibration mode, a baseplate supporting the isolated resonator, a plurality of excitation affixed to the baseplate for exciting the first differential vibration mode, a plurality of sensing electrodes affixed to the baseplate for sensing movement of the gyroscope through the second differential vibration mode and a plurality of bias electrodes affixed to the baseplate for trimming isolation of the resonator and substantially minimizing frequency split between the first and second differential vibration modes. Typically, the isolated resonator comprises a proof mass and a counterbalancing plate with the bias electrodes disposed on the baseplate below.Type: GrantFiled: April 25, 2003Date of Patent: November 30, 2004Assignees: California Institute of Technology, The Boeing CompanyInventors: Ken J. Hayworth, Kirill V. Shcheglov, Todd E. Humphreys, A. Dorian Challoner
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Publication number: 20040226370Abstract: The present invention discloses an isolated electrostatic biased resonator gyroscope. The gyroscope includes an isolated resonator having a first and a second differential vibration mode, a baseplate supporting the isolated resonator, a plurality of excitation affixed to the baseplate for exciting the first differential vibration mode, a plurality of sensing electrodes affixed to the baseplate for sensing movement of the gyroscope through the second differential vibration mode and a plurality of bias electrodes affixed to the baseplate for trimming isolation of the resonator and substantially minimizing frequency split between the first and second differential vibration modes. Typically, the isolated resonator comprises a proof mass and a counterbalancing plate with the bias electrodes disposed on the baseplate below.Type: ApplicationFiled: April 25, 2003Publication date: November 18, 2004Applicants: California Institute of Technology, The Boeing CompanyInventors: Ken J. Hayworth, Kirill V. Shcheglov, Todd E. Humphreys, A. Dorian Challoner
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Patent number: 6796179Abstract: A split-resonator integrated-post vibratory microgyroscope may be fabricated using micro electrical mechanical systems (MEMS) fabrication techniques. The microgyroscope may include two gyroscope sections bonded together, each gyroscope section including resonator petals, electrodes, and an integrated half post. The half posts are aligned and bonded to act as a single post.Type: GrantFiled: May 16, 2003Date of Patent: September 28, 2004Assignee: California Institute of TechnologyInventors: Youngsam Bae, Ken J. Hayworth, Kirill V. Shcheglov
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Publication number: 20040088127Abstract: Embodiments of the invention generally encompass a digital, application specific integrated circuit (ASIC) has been designed to perform excitation of a selected mode within a vibratory rate gyroscope, damping, or “force-rebalance,” of other modes within the sensor, and signal demodulation of the in-phase and quadrature components of the signal containing the angular rate information. The ASIC filters dedicated to each channel may be individually programmed to accommodate different rate sensor designs/technology or variations within the same class of sensors. The ASIC architecture employs a low-power design, making the ASIC, particularly suitable for use in power-sensitive applications.Type: ApplicationFiled: June 25, 2003Publication date: May 6, 2004Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE BOEING COMPANY, CALIFORNIA INSTITUTE OF TECHNOLOGYInventors: Robert M'Closkey, A. Dorian Challoner, Eugene Grayver, Ken J. Hayworth
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Publication number: 20040055381Abstract: The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.Type: ApplicationFiled: August 12, 2003Publication date: March 25, 2004Inventors: Kirill V. Shcheglov, A. Dorian Challoner, Ken J. Hayworth, Dean V. Wiberg, Karl Y. Yee
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Publication number: 20040050160Abstract: A split-resonator integrated-post vibratory microgyroscope may be fabricated using micro electrical mechanical systems (MEMS) fabrication techniques. The microgyroscope may include two gyroscope sections bonded together, each gyroscope section including resonator petals, electrodes, and an integrated half post. The half posts are aligned and bonded to act as a single post.Type: ApplicationFiled: May 16, 2003Publication date: March 18, 2004Inventors: Youngsam Bae, Ken J. Hayworth, Kirill V. Shcheglov