Patents by Inventor Ken KATANO

Ken KATANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, electronic circuit, and method of inspecting semiconductor device
    Patent number: 10746812
    Abstract: A semiconductor device includes a semiconductor chip having first, second and third pads, first and second external terminals to which a power supply potential or a reference potential is supplied, first and second wires connecting the first and second external terminals and the first and second pads, and a third wire connecting the second external terminal and the third pad. The semiconductor chip further includes a first internal wiring connected to the first and second pads, a second internal wiring connected to the third pad, and a detection circuit. The detection circuit includes: a current source for passing a current through the first and second internal wirings; first and second resistive elements connected between the current source and the first and second internal wirings; and an amplifier circuit for amplifying a relative potential difference generated between the first and second resistive elements and outputting a detection signal.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 18, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Kazuo Henmi, Ken Katano
  • SEMICONDUCTOR DEVICE, ELECTRONIC CIRCUIT, AND METHOD OF INSPECTING SEMICONDUCTOR DEVICE
    Publication number: 20200072891
    Abstract: A semiconductor device includes a semiconductor chip having first, second and third pads, first and second external terminals to which a power supply potential or a reference potential is supplied, first and second wires connecting the first and second external terminals and the first and second pads, and a third wire connecting the second external terminal and the third pad. The semiconductor chip further includes a first internal wiring connected to the first and second pads, a second internal wiring connected to the third pad, and a detection circuit. The detection circuit includes: a current source for passing a current through the first and second internal wirings; first and second resistive elements connected between the current source and the first and second internal wirings; and an amplifier circuit for amplifying a relative potential difference generated between the first and second resistive elements and outputting a detection signal.
    Type: Application
    Filed: August 7, 2019
    Publication date: March 5, 2020
    Inventors: Kazuo HENMI, Ken KATANO