Abstract: An infrared transmissivity measurement method is for measuring an infrared transmissivity of a quartz glass crucible which includes a transparent layer made of quartz glass that does not contain bubbles, a bubble layer formed outside the transparent layer and made of quartz glass containing bubbles, and a semi-molten layer formed outside the bubble layer and made of raw material silica powder solidified in a semi-molten state. The infrared transmissivity measurement method includes processing an outer surface of the quartz glass crucible formed by the semi-molten layer to lower a surface roughness of the outer surface; and measuring an infrared transmissivity of the quartz glass crucible based on infrared light passing through the outer surface after processing the outer surface.

Abstract: The object is to provide a liquid container that can prevent foreign substances from flowing into a liquid ejection apparatus with a simple configuration. The liquid container for containing liquid to be ejected by a liquid ejection apparatus includes: a bag body configured to contain the liquid inside; and a flow path for supplying the liquid contained inside the bag body to the liquid ejection apparatus, wherein, inside a peripheral wall of the flow path, a first capturing unit extending in an anti-gravitational direction and a second capturing unit extending in a gravitational direction are arranged at different positions with respect to a direction in which the liquid flows.

Abstract: A quartz glass crucible 1 having a cylindrical side wall portion 10a, a bottom portion 10b, and a corner portion 10c includes a transparent layer 11 as an innermost layer made of quartz glass, a semi-molten layer 13 as an outermost layer made of raw material silica powder solidified in a semi-molten state, and a bubble layer 12 made of quartz glass interposed therebetween. An infrared transmissivity of the corner portion 10c in a state where the semi-molten layer 13 is removed is 25 to 51%, the infrared transmissivity of the corner portion 10c in the state where the semi-molten layer 13 is removed is lower than an infrared transmissivity of the side wall portion 10a, and the infrared transmissivity of the side wall portion 10a in the state where the semi-molten layer 13 is removed is lower than an infrared transmissivity of the bottom portion 10b.

Abstract: A semiconductor device includes a semiconductor chip having first, second and third pads, first and second external terminals to which a power supply potential or a reference potential is supplied, first and second wires connecting the first and second external terminals and the first and second pads, and a third wire connecting the second external terminal and the third pad. The semiconductor chip further includes a first internal wiring connected to the first and second pads, a second internal wiring connected to the third pad, and a detection circuit. The detection circuit includes: a current source for passing a current through the first and second internal wirings; first and second resistive elements connected between the current source and the first and second internal wirings; and an amplifier circuit for amplifying a relative potential difference generated between the first and second resistive elements and outputting a detection signal.

Abstract: A semiconductor device includes a semiconductor chip having first, second and third pads, first and second external terminals to which a power supply potential or a reference potential is supplied, first and second wires connecting the first and second external terminals and the first and second pads, and a third wire connecting the second external terminal and the third pad. The semiconductor chip further includes a first internal wiring connected to the first and second pads, a second internal wiring connected to the third pad, and a detection circuit. The detection circuit includes: a current source for passing a current through the first and second internal wirings; first and second resistive elements connected between the current source and the first and second internal wirings; and an amplifier circuit for amplifying a relative potential difference generated between the first and second resistive elements and outputting a detection signal.