Patents by Inventor Ken Kiat Ng

Ken Kiat Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOUND SLOT
    Publication number: 20150367639
    Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.
    Type: Application
    Filed: August 27, 2015
    Publication date: December 24, 2015
    Inventors: Ning Ge, Bee Ling Peh, Trudy Benjamin, Ken Kiat Ng, Jianhui Gu
  • Compound slot
    Patent number: 9144984
    Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: September 29, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ning Ge, Bee Ling Peh, Trudy Benjamin, Ken Kiat Ng, Jianhui Gu
  • COMPOUND SLOT
    Publication number: 20140362146
    Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.
    Type: Application
    Filed: April 27, 2012
    Publication date: December 11, 2014
    Applicant: Hewlett-Packard Development Company, LP.
    Inventors: Ning Ge, Bee Ling Peh, Trudy Benjamin, Ken Kiat Ng, Jianhui Gu