Abstract: A liquid handling apparatus includes a substrate that includes a groove which is a channel through which a liquid can be moved on the basis of a capillary phenomenon, and a film that is bonded to the substrate to cover the opening of the groove, in which the channel has a main channel and a guide channel, the groove has a main groove that is the main channel by the film being bonded to the substrate, and a guide groove that is the guide channel by the film being bonded to the substrate, opens on a lateral surface of the main groove, and has a width narrower than the width of the main groove, and the guide groove is placed in an area on a film side of the lateral surface of the main groove and shallower than the main groove.

Abstract: Chip body 130 in which a through hole or concave is formed, intermediate film 140, on one surface of which adhesive layer 150? is formed and lower film 170, on one surface of which transfer function layer 160 is formed, are prepared. Intermediate film 140 and lower film 170 are bonded together such that transfer function layer 160 is embedded in adhesive layer 150? to form a laminated body. The laminated body and chip body 130 are bonded together by thermocompression to manufacture micro-chip 100.