Abstract: A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter &xgr; less than approximately 10 such that the metal layer is of substantially uniform thickness. The polarization parameter &xgr; of less than approximately 10 for the electroplating bath can be achieved by numerous means, such as by providing a low metal ion concentration in the electroplating bath or by adding one or more additives to the electroplating bath. The present invention may be used with a variety of metals and resistive substrates.

Abstract: The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.

Abstract: Optical quality molds and mold inserts include an optically flat substrate, a layer of material applied to the substrate and one or more depressions in a predetermined pattern formed in the layer of material applied to the substrate. The depth of the depressions are precisely determined by the thickness of the layer applied to the substrate. By contacting the mold with resin in a fluid state, a component is fabricated having microfeatures formed monolithically thereon.

Abstract: A process for removing titanium from a device is disclosed. The titanium is etched at a controllable rate. The etchant oxidizes the titanium, and the oxidized titanium forms a complex in the etchant. When the concentration of this complex in the etchant nears its solubility limit, it precipitates and forms a film on the titanium metal surface. This film reduces the rate of the etch, enabling the amount of titanium removed by the etchant to be controlled.

Abstract: The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.