Patents by Inventor Ken Madarame

Ken Madarame has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
    Patent number: 7592250
    Abstract: A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: September 22, 2009
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Yasushi Shimada, Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama, Ken Madarame, Etsuo Mizushima, Yuusuke Kondou, Kazunori Yamamoto
  • Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
    Patent number: 7239013
    Abstract: A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: July 3, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasushi Shimada, Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama, Ken Madarame, Etsuo Mizushima, Yuusuke Kondou, Kazunori Yamamoto
  • Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device
    Publication number: 20070108588
    Abstract: A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a wireless electronic device mounting the semiconductor device.
    Type: Application
    Filed: January 16, 2007
    Publication date: May 17, 2007
    Inventors: Yasushi Shimada, Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama, Ken Madarame, Etsuo Mizushima, Yuusuke Kondou, Kazunori Yamamoto
  • Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
    Publication number: 20060063367
    Abstract: A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.
    Type: Application
    Filed: May 30, 2003
    Publication date: March 23, 2006
    Applicant: Hitachi Chemical Co., Ltd.
    Inventors: Yasushi Shimada, Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi, Yuichi Shimayama, Ken Madarame, Etsuo Mizushima, Yuusuke Kondou, Kazumori Yamamoto
  • Thermosetting resin composition of low thermal expansibility and resin film
    Publication number: 20050065275
    Abstract: The invention relates to a thermosetting resin composition comprising: a binder containing a thermosetting resin having a storage elastic modulus of 1,000 MPa or less at 20° C. and an elongation of 10% or more at 20° C.; and an inorganic filler in an amount of 100 to 2,000 parts by weight with respect to 100 parts by weight of the binder. According to the invention, it provides a thermosetting resin composition and resin film which have a low thermal expansion coefficient and able to possess a low elastic modulus, a high extensibility, and a low thermal expansion coefficient.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 24, 2005
    Applicant: Hitachi Chemical Co., LTD
    Inventors: Atsushi Takahashi, Hideo Baba, Ken Madarame, Hideo Nakako, Nozomu Takano
  • Method of producing a naphthol-modified phenolic resin of highly increased molecular weight
    Patent number: 5206333
    Abstract: A copolycondensation of a phenol, a naphthol and formaldehyde proceeds smoothly in the presence of an acid and a metallic element selected from the group consisting of transition metallic elements and metallic elements of Group IIa, Group IIIa, Group IVa, Group Va and Group VIa of the Periodic Table, and a naphthol-modified phenolic resin which has a large molecular weight and does not gel is obtained.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: April 27, 1993
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Haruaki Sue, Ken Nanaumi, Takuji Itou, Ken Madarame, Shinsuke Hagiwara