Patents by Inventor Ken Maruyama
Ken Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230027151Abstract: A method for producing a film includes: coating a surface of a substrate with a composition containing a polymer having a structural unit represented by formula (1) and having a number average molecular weight of 13000 or more and a solvent, heating a coating film formed by the coating, and removing, with a rinsing liquid, a part of the coating film after the heating, wherein the rinsing liquid to be used contains a basic compound. In the formula (1), Y1 is a single bond, —CO—NR2—, a divalent aromatic ring group, a divalent group containing —O—, or a divalent group containing —CO—NR2—. A1 is a single bond, —O—, —S—, or —NR3—. R1 is a hydrogen atom, a monovalent hydrocarbon group, a monovalent halogenated hydrocarbon group, or a monovalent group having a heterocyclic structure.Type: ApplicationFiled: June 23, 2022Publication date: January 26, 2023Applicant: JSR CORPORATIONInventors: Ryo KUMEGAWA, Sosuke Osawa, Miki Tamada, Ken Maruyama, Motohiro Shiratani
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Publication number: 20220382152Abstract: A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.Type: ApplicationFiled: July 19, 2022Publication date: December 1, 2022Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20220334481Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicant: JSR CORPORATIONInventors: Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Hayato NAMAI, Kazuya KIRIYAMA, Ken MARUYAMA
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Publication number: 20220299875Abstract: A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); and a solvent containing propylene glycol monomethyl ether and alkyl lactate. The solvent does not contain propylene glycol monomethyl ether acetate or contains propylene glycol monomethyl ether acetate in a content of 5% by mass or less in the solvent. The radiation-sensitive resin composition further includes a radiation-sensitive acid generator, or the resin further includes a structural unit having a radiation-sensitive acid generating structure. In the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group. RX is a monovalent hydrocarbon group having 1 to 20 carbon atoms. Cy represents an alicyclic structure having 3 to 20 ring members formed together with the carbon atom to which Cy is bonded.Type: ApplicationFiled: February 22, 2022Publication date: September 22, 2022Applicant: JSR CORPORATIONInventor: Ken MARUYAMA
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Publication number: 20220269172Abstract: Provided are: a radiation-sensitive resin composition, a method of forming a resist pattern, and a polymer which enable forming a resist pattern with favorable sensitivity to exposure light and superiority in terms of CDU performance and resolution. The radiation-sensitive resin composition contains: a polymer having: a first structural unit represented by formula (1), and a second structural unit derived from a (meth)acrylic acid ester including an acid-labile group; and a radiation-sensitive acid generator.Type: ApplicationFiled: February 17, 2022Publication date: August 25, 2022Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20220252978Abstract: A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X), where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.Type: ApplicationFiled: April 28, 2022Publication date: August 11, 2022Applicant: JSR CORPORATIONInventor: Ken MARUYAMA
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Patent number: 11319388Abstract: A radiation-sensitive resin composition contains: a polymer having a first structural unit represented by formula (1), and a second structural unit represented by formula (2) and having an acid-labile group. A first acid, to be generated from the first acid generating agent, disassociates the acid labile group in the polymer upon heating under a condition involving a temperature of no less than 80° C. and no greater than 140° C. for a time period of 1 minute, and the second acid, to be generated from the second acid generating agent, does not substantially disassociate the acid-labile group under the condition. The polymer is synthesized by RAFT, ATRP, or NMP, and a RAFT agent is at least one selected from the group consisting of a mercaptocarboxylic acid ester, a disulfide, a dithioester, a xanthate, a dithiocarbamate, and a trithiocarbonate.Type: GrantFiled: September 7, 2020Date of Patent: May 3, 2022Assignee: JSR CORPORATIONInventors: Ken Maruyama, Yoshiki Nonoyama, Takuo Sone, Motohiro Shiratani
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Publication number: 20220043350Abstract: A radiation-sensitive resin composition includes a resin having a partial structure represented by formula (1). R1 and R2 each independently represent a substituted or unsubstituted chain aliphatic hydrocarbon group having 1 to 6 carbon atoms or a substituted or unsubstituted alicyclic hydrocarbon group having 3 to 6 carbon atoms, or R1 and R2 are bonded to each other to form a part of a 3- to 6-membered cyclic structure together with the carbon atom to which R1 and R2 are bonded; R3 represents a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms and containing a fluorine atom. No fluorine atom is bonded to carbon atoms located at ?-, ?- and ?-positions of the carbon atom to which R1 and R2 are bonded; and No fluorine atom is bonded to carbon atoms located at ?- and ?-positions of the carbon atom to which R3 is bonded.Type: ApplicationFiled: October 22, 2021Publication date: February 10, 2022Applicant: JSR CORPORATIONInventors: Kazuya Kiriyama, Katsuaki Nishikori, Takuhiro Taniguchi, Ryuichi Nemoto, Ken Maruyama
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Patent number: 11204552Abstract: A radiation-sensitive composition includes: a first polymer having a first structural unit that includes an acid-labile group; and a first compound including a metal cation and a first anion that is a conjugate base of an acid. The acid has a pKa of no greater than 0. The acid is preferably sulfonic acid, nitric acid, organic azinic acid, disulfonylimidic acid or a combination thereof. The first compound is preferably represented by formula (1). In the formula (1), M represents a metal cation; A represents the first anion; x is an integer of 1 to 6; R1 represents a ? ligand; and y is an integer of 0 to 5, and a sum: x+y is no greater than 6. The van der Waals volume of the acid is preferably no less than 2.5×10?28 m3.Type: GrantFiled: May 24, 2018Date of Patent: December 21, 2021Assignee: JSR CORPORATIONInventors: Tomoki Nagai, Takehiko Naruoka, Ken Maruyama, Motohiro Shiratani, Hisashi Nakagawa
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Publication number: 20210389667Abstract: A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R1, R2, and R3 represents a fluorine atom or the like; and R4 and R5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R6s represents a fluorine atom or the like; and R8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.Type: ApplicationFiled: October 27, 2020Publication date: December 16, 2021Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20210318613Abstract: A radiation-sensitive resin composition includes a polymer, a radiation-sensitive acid generator, and a compound represented by formula (2). The polymer includes a first structural unit including a phenolic hydroxyl group, a second structural unit including a group represented by formula (1), and a third structural unit including an acid-labile group. In the formula (1), R1, R2, R3, R4, R5, and R6 each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R1, R2, R3, R4, R5, and R6 represents a fluorine atom or a fluorinated hydrocarbon group; RA represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and * denotes a binding site to a part other than the group represented by the formula (1).Type: ApplicationFiled: June 10, 2020Publication date: October 14, 2021Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Ken MARUYAMA, Kazuki KASAHARA, Tsuyoshi FURUKAWA, Natsuko KINOSHITA
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Publication number: 20210263413Abstract: A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.Type: ApplicationFiled: March 11, 2020Publication date: August 26, 2021Applicant: JSR CORPORATIONInventors: Kazuya KIRIYAMA, Katsuaki Nishikori, Takuhiro Taniguchi, Ken Maruyama
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Publication number: 20210124263Abstract: A radiation-sensitive resin composition includes a polymer including a phenolic hydroxyl group, a compound represented by formula (1-1) or formula (1-2), and a compound represented by formula (2). In the formula (1-1), a sum of a, b, and c is no less than 1; at least one of R1, R2, and R3 represents a fluorine atom or the like; and R4 and R5 each independently represent a hydrogen atom, a fluorine atom, or the like. In the formula (1-2), in a case in which d is 1, R6 represents a fluorine atom or the like, and in a case in which d is no less than 2, at least one of the plurality of R6s represents a fluorine atom or the like; and R8 represents a single bond or a divalent organic group having 1 to 20 carbon atoms.Type: ApplicationFiled: October 27, 2020Publication date: April 29, 2021Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
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Publication number: 20200407476Abstract: An object of the present invention is to provide a radiation-sensitive resin composition being superior in each of an inhibitory ability of defects, LWR performance, and sensitivity. An aspect of the present invention is a radiation-sensitive resin composition containing: a polymer having a first structural unit represented by the following formula (1), and a second structural unit represented by the following formula (2) and having an acid-labile group; a first acid generating agent which generates a first acid upon irradiation with a radioactive ray; and a second acid generating agent which generates a second acid upon irradiation with a radioactive ray, wherein the first acid, to be generated from the first acid generating agent, disassociates the acid labile group in the polymer upon heating under a condition involving a temperature of no less than 80° C. and no greater than 140° C.Type: ApplicationFiled: September 7, 2020Publication date: December 31, 2020Applicant: JSR CORPORATIONInventors: Ken MARUYAMA, Yoshiki Nonoyama, Takuo Sone, Motohiro Shiratani
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Publication number: 20200393761Abstract: A radiation-sensitive resin composition includes a polymer, a radiation-sensitive acid generator, and a compound represented by formula (2). The polymer includes a first structural unit including a phenolic hydroxyl group, a second structural unit including a group represented by formula (1), and a third structural unit including an acid-labile group. In the formula (1), R1, R2, R3, R4, R5, and R6 each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R1, R2, R3, R4, R5, and R6 represents a fluorine atom or a fluorinated hydrocarbon group; RA represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and * denotes a binding site to a part other than the group represented by the formula (1).Type: ApplicationFiled: June 10, 2020Publication date: December 17, 2020Applicant: JSR CORPORATIONInventors: Katsuaki NISHIKORI, Ken MARUYAMA, Kazuki KASAHARA, Tsuyoshi FURUKAWA, Natsuko KINOSHITA
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Publication number: 20200341376Abstract: A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; and a radiation-sensitive acid generating agent. The radiation-sensitive acid generating agent includes a sulfonate anion and a radiation-sensitive cation. The sulfonate anion includes two or more rings, and an iodine atom and a monovalent group having 0 to 10 carbon atoms which includes at least one of an oxygen atom and a nitrogen atom bond to at least one of the two or more rings. The ring is preferably an aromatic ring. The radiation-sensitive acid generating agent is preferably a compound represented by formula (1). In the formula (1), A1 represents a group obtained from a compound which includes a ring having 3 to 20 ring atoms by removing (p+q+r+1) hydrogen atoms on the ring.Type: ApplicationFiled: March 11, 2020Publication date: October 29, 2020Applicant: JSR CORPORATIONInventors: Kazuya KIRIYAMA, Katsuaki Nishikori, Takuhiro Taniguchi, Ken Maruyama
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Publication number: 20200333707Abstract: A resist pattern-forming method includes applying a radiation-sensitive composition directly or indirectly on a substrate to form a resist film. The resist film is exposed to an extreme ultraviolet ray or an electron beam. The resist film is developed after the exposing. The radiation-sensitive composition includes a first complex, a compound and a second complex. The first complex includes a metal atom and a first ligand coordinating to the metal atom. The compound gives a second ligand that differs from the first ligand. The second complex includes the metal atom and the second ligand coordinating to the metal atom.Type: ApplicationFiled: April 21, 2020Publication date: October 22, 2020Applicant: JSR CORPORATIONInventors: Miki Tamada, Sousuke Oosawa, Ken Maruyama
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Publication number: 20200132012Abstract: A solenoid valve drive control circuit includes: a timing generator circuit that outputs a timing signal for controlling a driver circuit, in accordance with a solenoid valve opening and closing instruction signal; and a valve closing detector circuit that detects a valve closing timing after the timing generator circuit outputs the timing signal for instructing a solenoid valve to close, by monitoring a solenoid valve outflow terminal voltage in the solenoid valve as a signal voltage. The valve closing detector circuit includes a measurement circuit that (i) detects each timing signal reaching a threshold voltage sequentially outputted from a threshold voltage selector circuit, and (ii) outputs a signal indicating the valve closing timing when a change in a measurement value that is obtained through measurement of a time interval of each timing satisfies a predetermined condition.Type: ApplicationFiled: December 23, 2019Publication date: April 30, 2020Inventors: Keisuke KURODA, Makoto KAWAJIRI, Ken MARUYAMA, Takashi RYU, Atsushi OGAWA, Motoaki KATO, Kengo NOMURA
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Publication number: 20200041902Abstract: A radiation-sensitive composition includes: a first polymer having a first structural unit that includes an acid-labile group; and a first compound including a metal cation and a first anion that is a conjugate base of an acid. The acid has a pKa of no greater than 0. The acid is preferably sulfonic acid, nitric acid, organic azinic acid, disulfonylimidic acid or a combination thereof. The first compound is preferably represented by formula (1). In the formula (1), M represents a metal cation; A represents the first anion; x is an integer of 1 to 6; R1 represents a ? ligand; and y is an integer of 0 to 5, and a sum: x+y is no greater than 6. The van der Waals volume of the acid is preferably no less than 2.5×10?28 m3.Type: ApplicationFiled: May 24, 2018Publication date: February 6, 2020Applicant: JSR CORPORATIONInventors: Tomoki NAGAI, Takehiko Naruoka, Ken Maruyama, Motohiro Shiratani, Hisashi Nakagawa
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Publication number: 20200026188Abstract: A radiation-sensitive composition contains: a polymer having a first structural unit that includes an acid-labile group; a first compound that generates a first acid upon an irradiation with a radioactive ray; and a second compound that generates a second acid upon an irradiation with a radioactive ray. The first acid does not substantially dissociate the acid-labile group under a condition of a temperature of 110° C. and a time period of 1 min, and the second acid dissociates the acid-labile group under a condition of a temperature of 110° C. and a time period of 1 min. The radiation-sensitive composition satisfies at least one of requirements (1) and (2): (1) the polymer includes a monovalent iodine atom; and (2) the radiation-sensitive composition further contains a third compound that is other than the first compound or the second compound, and that includes a monovalent iodine atom.Type: ApplicationFiled: September 30, 2019Publication date: January 23, 2020Applicant: JSR CorporationInventor: Ken MARUYAMA