Patents by Inventor Ken MASUTA

Ken MASUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of manufacturing the same
    Patent number: 8884447
    Abstract: To increase the manufacturing yield of semiconductor devices by improving a joint failure of a bump electrode. In a semiconductor device in which a plurality of boding pads 4 formed on a front surface of a semiconductor chip 3 and a plurality of leads 2 are connected via a plurality of bump electrodes 5, respectively, the upper surface of the leads 2 is formed into a semi-glossy surface having a roughness a maximum height (Ry) of which is in a range greater than 0 ?m and not greater than 20 ?m (0 ?m<maximum height (Ry)?20 ?m), not into a planar surface (maximum height (Ry) =0).
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: November 11, 2014
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroaki Narita, Ken Masuta, Toru Makanae
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20120292760
    Abstract: To increase the manufacturing yield of semiconductor devices by improving a joint failure of a bump electrode. In a semiconductor device in which a plurality of boding pads 4 formed on a front surface of a semiconductor chip 3 and a plurality of leads 2 are connected via a plurality of bump electrodes 5, respectively, the upper surface of the leads 2 is formed into a semi-glossy surface having a roughness a maximum height (Ry) of which is in a range greater than 0 ?m and not greater than 20 ?m (0 ?m<maximum height (Ry)?20 ?m), not into a planar surface (maximum height (Ry)=0).
    Type: Application
    Filed: May 15, 2012
    Publication date: November 22, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Hiroaki NARITA, Ken MASUTA, Toru MAKANAE