Patents by Inventor Ken Morishita

Ken Morishita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8668850
    Abstract: A flame retarded foamed plastic composition comprises a polystyrene type resin; a brominated flame retardant having a Br content greater than 60% by weight and a 5 wt % loss temperature of 190-320° C.; a hindered amine of 4-hydroxy-2,2,6,6-tetramethylpiperidine carboxylate series, and a blowing agent.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: March 11, 2014
    Assignee: Dai-Ichi Kogyo Seiyaku Co., Ltd.
    Inventors: Hideaki Onishi, Ken Morishita
  • Publication number: 20130246994
    Abstract: The purpose of the present invention is to provide a wiring check device, a wiring check system, a wiring check method, a wiring check program, and a recording medium, which are capable of taking into account a difference in the shape of a slit to find a risk of the worsening of electromagnetic noise characteristics.
    Type: Application
    Filed: November 22, 2011
    Publication date: September 19, 2013
    Applicant: NEC CORPORATION
    Inventor: Ken Morishita
  • Publication number: 20130150506
    Abstract: Provided are a polylactic acid resin composition excellent in transparency, heat resistance, and migration resistance, and excellent in productivity at the time of the mold forming thereof, and a resin molded article thereof. The polylactic acid resin composition includes a polylactic acid; a reaction product of glycerin, an alkylene oxide mainly formed of ethylene oxide, and a fatty acid having 12 to 24 carbon atoms; and a fatty acid amide having a hydroxyl group.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 13, 2013
    Inventors: Hideaki Onishi, Ken Morishita
  • Publication number: 20130150505
    Abstract: Provided are a polylactic acid resin composition excellent in impact resistance, migration resistance, and heat resistance, and excellent in productivity at the time of the mold forming thereof, and a resin molded article thereof. The polylactic acid resin composition includes a polylactic acid; a reaction product of at least one of a polyol and a polyol dehydration condensate, an alkylene oxide mainly formed of ethylene oxide, and a fatty acid having 12 to 24 carbon atoms; and a fatty acid amide.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 13, 2013
    Inventors: Hideaki Onishi, Ken Morishita
  • Publication number: 20130150510
    Abstract: Provided are a polylactic acid resin composition excellent in transparency, heat resistance, and migration resistance, and excellent in productivity at the time of the mold forming thereof, and a resin molded article thereof. The polylactic acid resin composition includes a polylactic acid; a reaction product of at least one selected from the group consisting of sorbitol, mannitol, and dehydration condensates thereof, an alkylene oxide mainly formed of ethylene oxide, and a fatty acid having 8 to 24 carbon atoms; and a fatty acid amide having a hydroxyl group.
    Type: Application
    Filed: December 11, 2012
    Publication date: June 13, 2013
    Inventors: Hideaki Onishi, Ken Morishita
  • Publication number: 20110122041
    Abstract: The present device is equipped with a first dielectric layer (1) and a second dielectric layer (2), and an antenna conductor (4), a ground conductor (5), and pad conductors (6), which are provided so as to sandwich the first dielectric layer (1) and the second dielectric layer (2) in the lamination direction respectively. The first dielectric layer (1) is arranged between the antenna conductor (4) and the ground conductor (5). The second dielectric layer (2) is arranged between either the antenna conductor (4) or the ground conductor (5), and pad conductors (6). A connection conductor (7) for electrically connecting either the antenna conductor (4) or the ground conductor (5), whichever remains, and the pad conductors (6) is provided.
    Type: Application
    Filed: July 17, 2009
    Publication date: May 26, 2011
    Applicant: NEC CORPORATION
    Inventors: Ken Morishita, Naoki Kobayashi
  • Patent number: 7839135
    Abstract: A structure has a printed board carried by a metal chassis. A printed board carrying chassis analyzing system, a printed board carrying chassis analyzing method, a printed board carrying chassis structure, and a printed board carrying chassis analyzing program are provided to achieve a screw-fastened arrangement for predicting unnecessary radiation frequencies and for reducing unnecessary radiation. An equivalent circuit model including a printed board power and ground plane pair, a pair of confronting surfaces of a printed board and a chassis, and screw-fastened grounding posts is generated and analyzed to predict unnecessary radiation frequencies and unnecessary radiation reductions and to select a screw-fastened arrangement for reducing unnecessary radiation.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: November 23, 2010
    Assignee: NEC Corporation
    Inventors: Naoki Kobayashi, Ken Morishita, Takashi Harada
  • Publication number: 20100168263
    Abstract: Disclosed is a flame-retardant styrene resin composition. The composition comprises 100 parts by weight of a styrene resin, 0.5 to 10 parts by weight of a brominated flame-retarder which has a bromine content of 60% by weight or higher, and 0.005 to 0.5 part by weight of urea, thiourea or an N-substituted derivative thereof. By using an urea compound concomitantly, the amount of the brominated flame-retarder required for achieving a desired flame retardancy level can be reduced.
    Type: Application
    Filed: February 5, 2007
    Publication date: July 1, 2010
    Inventors: Hideaki Onishi, Ken Morishita
  • Publication number: 20070288873
    Abstract: A structure has a printed board carried by a metal chassis. A printed board carrying chassis analyzing system, a printed board carrying chassis analyzing method, a printed board carrying chassis structure, and a printed board carrying chassis analyzing program are provided to achieve a screw-fastened arrangement for predicting unnecessary radiation frequencies and for reducing unnecessary radiation. An equivalent circuit model including a printed board power and ground plane pair, a pair of confronting surfaces of a printed board and a chassis, and screw-fastened grounding posts is generated and analyzed to predict unnecessary radiation frequencies and unnecessary radiation reductions and to select a screw-fastened arrangement for reducing unnecessary radiation.
    Type: Application
    Filed: April 24, 2007
    Publication date: December 13, 2007
    Applicant: NEC CORPORATION
    Inventors: Naoki Kobayashi, Ken Morishita, Takeshi Harada
  • Publication number: 20060229372
    Abstract: A flame retarded foamed plastic composition comprises a polystyrene type resin; a brominated flame retardant having a Br content greater than 60% by weight and a 5 wt % loss temperature of 190-320° C.; a hindered amine of 4-hydroxy-2,2,6,6-tetramethylpiperidine carboxylate series, and a blowing agent.
    Type: Application
    Filed: April 6, 2006
    Publication date: October 12, 2006
    Inventors: Hideaki Onishi, Ken Morishita
  • Patent number: 4961877
    Abstract: A solid silicone defoaming agent which includes a mixture of silicone oil having a viscosity of at least 20 centistokes at 25 degrees Centigrade and microparticulate silica, a copolymer selected from the group consisting of polyoxyalkylene and polyoxyalkylene/polysiloxane copolymers, and a wax selected from the group consisting of a water-insoluble wax which is insoluble in water at room temperature and which has a melting point of at least 35 degrees Centigrade, and a water-soluble wax which dissolves and disperses in water at room temeprature and which has a melting point of at least 30 degrees Centigrade.
    Type: Grant
    Filed: August 30, 1988
    Date of Patent: October 9, 1990
    Assignee: Dow Corning K.K.
    Inventors: Hirofumi Shimizu, Ken Morishita