Patents by Inventor Ken Morita
Ken Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105758Abstract: The present technology relates to a light source apparatus that makes it possible to provide a widely applicable light source apparatus. A light source apparatus includes a transmissive board that transmits light emitted by a light-emitting element, a circuit board that drives the light-emitting element and is joined to the transmissive board, and a light-emitting board that has the light-emitting element and is connected to the circuit board via a first bump. Further, in the light source apparatus, the circuit board and an organic board are configured to be connected by sandwiching the light-emitting board via second bumps. The present technology can be applied to a light source apparatus that emits light.Type: ApplicationFiled: October 22, 2020Publication date: March 28, 2024Inventors: HIIZU OHTORII, HIROSHI MORITA, YUSUKE OYAMA, EIJI OTANI, KEN KIKUCHI
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Publication number: 20240107677Abstract: The present technology relates to an electronic circuit board, a base member, electronic equipment, an electronic equipment manufacturing method and an electronic circuit board manufacturing method that make it possible to mount an electronic circuit board easily on a curved surface, for example. An electronic circuit board has a deformable wiring board having a plurality of areas that is long in one direction and is formed to be partially continuous with each other, and the plurality of areas of the wiring board is provided with deformable plate-like plate members that are more rigid than the wiring board. For example, the present technology can be applied to an electronic circuit board on which various devices are mounted.Type: ApplicationFiled: October 22, 2020Publication date: March 28, 2024Inventors: HIIZU OHTORII, HIROSHI MORITA, YUSUKE OYAMA, EIJI OTANI, KEN KIKUCHI
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Publication number: 20230154683Abstract: An electronic component includes an element body, a plurality of external electrodes on the element body, and an electrical insulator on the element body. Each of the plurality of external electrodes includes a conductive resin layer. The electrical insulator includes an electrical insulating portion located at least on a region between the plurality of external electrodes on a surface of the element body.Type: ApplicationFiled: September 16, 2022Publication date: May 18, 2023Applicant: TDK CORPORATIONInventors: Kyohei TAKATA, Shinya ONODERA, Ken MORITA
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Publication number: 20230095767Abstract: Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.Type: ApplicationFiled: September 7, 2022Publication date: March 30, 2023Applicant: TDK CorporationInventors: Yuichi NAGAI, Natsumi KATO, Akitoshi YOSHII, Ken MORITA, Takehisa TAMURA, Atsushi TAKEDA
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Patent number: 11289271Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.Type: GrantFiled: August 6, 2020Date of Patent: March 29, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
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Publication number: 20220062291Abstract: Disclosed are compositions and methods of treating cancers by constitutively activating protein phosphatase 2A (PP2A) without blocking signaling through the dopamine D2 receptor, that entail administering a therapeutically effective amount of an analog of perphenazine (PPZ) of formula (I) or (II), or a related PPZ analog lacking dopamine receptor D2 inhibitory activity, or a pharmaceutically acceptable salt thereof.Type: ApplicationFiled: December 19, 2019Publication date: March 3, 2022Applicant: DANA-FARBER CANCER INSTITUTE, INC.Inventors: Alfred T. Look, Ken Morita, Eric S. Fischer, Nathanael S. Gray, Shuning He
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Patent number: 11264171Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.Type: GrantFiled: August 6, 2020Date of Patent: March 1, 2022Assignee: TDK CORPORATIONInventors: Yuichi Nagai, Takehisa Tamura, Shinya Onodera, Ken Morita, Atsushi Takeda
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Patent number: 11094465Abstract: An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.Type: GrantFiled: January 17, 2019Date of Patent: August 17, 2021Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Ken Morita
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Patent number: 11011310Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the first direction is smaller than a length of the conductive resin layer in the third direction.Type: GrantFiled: January 17, 2019Date of Patent: May 18, 2021Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Ken Morita
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Patent number: 10971306Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed on the element body. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. A length of the conductive resin layer in the third direction is smaller than a length of the conductive resin layer in the first direction.Type: GrantFiled: January 17, 2019Date of Patent: April 6, 2021Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Ken Morita
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Patent number: 10937596Abstract: An electronic component includes an element body including a plurality of side surfaces adjacent to each other, and an external electrode disposed on the plurality of side surfaces. The external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer. A clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body. The conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces. An existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.Type: GrantFiled: January 23, 2020Date of Patent: March 2, 2021Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Ken Morita
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Publication number: 20210043378Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1>0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.Type: ApplicationFiled: August 6, 2020Publication date: February 11, 2021Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Takehisa TAMURA, Shinya ONODERA, Ken MORITA, Atsushi TAKEDA
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Publication number: 20210043385Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (?m) and a maximum thickness of the second region is T2 (?m), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1?0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.Type: ApplicationFiled: August 6, 2020Publication date: February 11, 2021Applicant: TDK CORPORATIONInventors: Yuichi NAGAI, Takehisa TAMURA, Shinya ONODERA, Ken MORITA, Atsushi TAKEDA
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Patent number: 10818431Abstract: An element body of a rectangular parallelepiped shape includes a first principle surface arranged to constitute a mounting surface, a second principle surface opposing the first principle surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer formed on the end surface. A thickness of the conductive resin layer gradually increases from the second principle surface toward the first principle surface in the first direction. The conductive resin layer includes a thickest portion at a position near the first principle surface in the first direction.Type: GrantFiled: September 26, 2018Date of Patent: October 27, 2020Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita
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Patent number: 10790091Abstract: An element body includes first and second end surfaces opposing each other in a first direction, first and second side surfaces opposing each other in a second direction, and first and second principal surfaces opposing each other in a third direction. The length of the element body in the second direction is shorter than that of the element body in the first direction, and the length of the element body in the third direction is shorter than that of the element body in the second direction. A pair of first external electrodes is disposed at both ends of the element body in the first direction. A second external electrode is disposed on the element body and positioned between the pair of first external electrodes. The second external electrode includes a first conductor part disposed on the first side surface. A depression is formed in the first conductor part.Type: GrantFiled: September 13, 2017Date of Patent: September 29, 2020Assignee: TDK CORPORATIONInventors: Fumiaki Satoh, Takehisa Tamura, Yuma Hattori, Toru Onoue, Daisuke Himeta, Ken Morita, Takuto Okamoto
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Patent number: 10763042Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.Type: GrantFiled: October 22, 2018Date of Patent: September 1, 2020Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita
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Patent number: 10755859Abstract: An element body of a rectangular parallelepiped shape includes a pair of principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed on an end portion of the element body in the third direction. When viewed from the third direction, a width of the element body in the second direction is the largest at a central position in the first direction, and gradually decreases from the central portion in the first direction. When viewed from the third direction, a position in which a length from one end to another end of the conductive resin layer in the second direction is the largest is located closer to the one principal surface than the central position.Type: GrantFiled: November 13, 2018Date of Patent: August 25, 2020Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Ken Morita, Atsushi Takeda
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Publication number: 20200251283Abstract: An electronic component includes an element body including a plurality of side surfaces adjacent to each other, and an external electrode disposed on the plurality of side surfaces. The external electrode includes a conductive resin layer in which a plurality of gaps exists and a plating layer disposed on the conductive resin layer. A clearance communicating with the plurality of gaps exists between an end edge of the plating layer and the element body. The conductive resin layer includes a first portion located on one side surface of the plurality of side surfaces and a second portion located on another side surface of the plurality of side surfaces. An existence ratio of the gaps in the first portion is greater than an existence ratio of the gaps in the second portion.Type: ApplicationFiled: January 23, 2020Publication date: August 6, 2020Applicant: TDK CORPORATIONInventors: Shinya ONODERA, Takehisa TAMURA, Ken MORITA
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Patent number: 10622150Abstract: An element body of a rectangular parallelepiped shape includes first and second principal surfaces opposing each other in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode disposed at an end portion of the element body in the third direction. The external electrode includes a first conductive resin layer and a second conductive resin layer. The first conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces. The second conductive resin layer is separated from the first conductive resin layer, and continuously covers one part of the second principal surface, one part of the end surface, and one part of each of the pair of side surfaces.Type: GrantFiled: October 22, 2018Date of Patent: April 14, 2020Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita
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Patent number: 10600570Abstract: An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. The external electrode includes a conductive resin layer. The external electrode includes a plating layer including a first portion covering the first principal surface and a pair of second portions covering the pair of side surfaces. A thickness of the first portion is smaller than each thickness of the pair of second portions.Type: GrantFiled: October 22, 2018Date of Patent: March 24, 2020Assignee: TDK CORPORATIONInventors: Shinya Onodera, Takehisa Tamura, Atsushi Takeda, Ken Morita