Patents by Inventor Ken Nakao
Ken Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6885814Abstract: A carbon wire heating element sealing heater is provided. Therein, a carbon wire heating element using carbon fibers is sealed in a quartz glass member, wherein absorption water quantity of the carbon wire heating element is 2×10?3 g/cm3 or less.Type: GrantFiled: March 25, 2003Date of Patent: April 26, 2005Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Takanori Saito, Hiroshi Mori, Akira Otsu, Norihiko Saito, Hiroyuki Honma, Eiichi Toya, Tomio Konn, Tomohiro Nagata, Ken Nakao, Kazutoshi Miura, Harunari Hasegawa, George Hoshi, Katsutoshi Ishi, Sunao Seko
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Publication number: 20030184696Abstract: It is provided that a reflection plate of semiconductor heat treatment, which is resistant to cracks or deformations by controlling the adsorption of foreign materials and the production of reaction. Said reflection plate 1 for semiconductor heat treatment is composed of a disk-shaped or ring-shaped plate of optically transmissible material and a plate 2 of inorganic material hermetically enclosed in said disk-shaped or ring-shaped plate, in which said plate of inorganic material has at least one side in contact with said plate of optically transmissible material, said at least one side 2a having a surface roughness of Ra 0.1 to 10.0 &mgr;m, said at least one side 2a formed grooves 2c therein.Type: ApplicationFiled: March 20, 2003Publication date: October 2, 2003Applicants: TOSHIBA CERAMICS CO., LTD., TOKYO ELECTRON LIMITEDInventors: Kazuhiko Shimanuki, Hiroyuki Honma, Norihiko Saito, Hideyuki Yokoyama, Takanori Saito, Ken Nakao
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Publication number: 20030180034Abstract: A carbon wire heating element sealing heater is provided. Therein, a carbon wire heating element using carbon fibers is sealed in a quartz glass member, wherein absorption water quantity of the carbon wire heating element is 2×10−3 g/cm3 or less.Type: ApplicationFiled: March 25, 2003Publication date: September 25, 2003Applicants: TOSHIBA CERAMICS CO., LTD., TOKYO ELECTRON LIMITEDInventors: Takanori Saito, Hiroshi Mori, Akira Otsu, Norihiko Saito, Hiroyuki Honma, Eiichi Toya, Tomio Konn, Tomohiro Nagata, Ken Nakao, Kazutoshi Miura, Harunari Hasegawa, George Hoshi, Katsutoshi Ishi, Sunao Seko
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Patent number: 6584279Abstract: A heater sealed with carbon wire heating element has a carbon wire heating element sealed with a quartz glass member, the carbon wire being prepared by knitting carbon single fibers into a knitted cord of a braid, each wire having a crystal structure with a interlayer spacing d (002) thereof being 0.343 or less and crystallite size Lc (002) thereof being 4.0 nm or more.Type: GrantFiled: May 25, 2001Date of Patent: June 24, 2003Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Sunao Seko, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Hideyuki Yokoyama, Masakazu Kobayashi, Takanori Saito, Ken Nakao
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Patent number: 6582649Abstract: A forced exhaust pipe is connected to an exhaust pipe connected with a cross head so that a negative pressure may be formed within an air passage so as to effect rapid control of air pressure (amount) within a parison, thereby stabilizing the air pressure within the parison. A parison stabilizing method and a system therefor for use in a hollow formation molding machine, according to the present invention, are so formed that a forced air-discharge is carried out through an exhaust pipe connected with the air passage formed within the cross head, so that a negative pressure is formed within the air passage. In this way, the above-mentioned system can effect quick control of an air pressure (amount) within the prison during a pre-blowing treatment, shorten a time period necessary for determining molding conditions, without having to increase the inner diameter of the air passage.Type: GrantFiled: November 13, 2000Date of Patent: June 24, 2003Assignee: The Japan Steel Works, Ltd.Inventors: Shigeaki Sano, Ken Nakao, Sohei Masaki, Kunihiro Hijikata
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Patent number: 6515264Abstract: A rod-shaped heater provided is composed of a carbon wire heating element 2 sealed in a small or large diameter quartz glass tube, a small diameter quartz glass tube portions 3a and 3b charged with compressed wire carbon members at opposite ends thereof; a sealed terminal section 10 having connection lines 11a and 11b for power supply held between the compressed wire carbon members charged in the small diameter quartz glass tube. The connection lines and the carbon wire heating element are electrically connected by way of the wire carbon members. This rod-shaped heater using the carbon wire heating element is suitable for readily raising the temperature of the agent in the storage tank of the wet etching agent or the grinding agent.Type: GrantFiled: June 14, 2002Date of Patent: February 4, 2003Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Shigeru Yamamura, Ken Nakao, Takanori Saito, Hisaei Osanai, Toshiyuki Makiya
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Publication number: 20020162835Abstract: A rod-shaped heater provided is composed of a carbon wire heating element 2 sealed in a small or large diameter quartz glass tube, a small diameter quartz glass tube portions 3a and 3b charged with compressed wire carbon members at opposite ends thereof; a sealed terminal section 10 having connection lines 11a and 11b for power supply held between the compressed wire carbon members charged in the small diameter quartz glass tube. The connection lines and the carbon wire heating element are electrically connected by way of the wire carbon members. This rod-shaped heater using the carbon wire heating element is suitable for readily raising the temperature of the agent in the storage tank of the wet etching agent or the grinding agent.Type: ApplicationFiled: June 14, 2002Publication date: November 7, 2002Applicant: TOSHIBA CERAMICS CO., LTDInventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Shigeru Yamamura, Ken Nakao, Takanori Saito, Hisaei Osanai, Toshiyuki Makiya
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Patent number: 6407371Abstract: A rod-shaped heater provided is composed of a carbon wire heating element 2 sealed in a small or large diameter quartz glass tube, a small diameter quartz glass tube portions 3a and 3b charged with compressed wire carbon members at opposite ends thereof; a sealed terminal section 10 having connection lines 11a and 11b for power supply held between the compressed wire carbon members charged in the small diameter quartz glass tube. The connection lines and the carbon wire heating element are electrically connected by way of the wire carbon members. This rod-shaped heater using the carbon wire heating element is suitable for readily raising the temperature of the agent in the storage tank of the wet etching agent or the grinding agent.Type: GrantFiled: December 1, 1999Date of Patent: June 18, 2002Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Shigeru Yamamura, Ken Nakao, Takanori Saito, Hisaei Osanai, Toshiyuki Makiya
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Publication number: 20020001460Abstract: The heater sealed with a carbon wire heating element of the present invention has a carbon wire heating element sealed within a quartz glass member, said carbon wire being prepared by knitting carbon single fibers into a knitted cord or a braid, each wire having a crystal structure with a interlayer spacing d (002) thereof being 0.343 or less and a crystallite size Lc (002) thereof being 4.0 nm or more.Type: ApplicationFiled: May 25, 2001Publication date: January 3, 2002Applicant: TOSHIBA CERAMICS CO., LTD. & TOKYO ELECTRON LIMITEDInventors: Sunao Seko, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Hideyuki Yokoyama, Masakazu Kobayashi, Takanori Saito, Ken Nakao
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Patent number: 6204488Abstract: A sealing terminal includes internal connection lines which are connected to heating elements and external connection lines via which power is supplied. A quartz glass body includes a plurality of grooves in its outer surface to retain the internal and external connection lines in place. Conductive foils are used to connect the internal and external lines which are housed in a quartz glass tube so that the ends of the lines project out of the respective ends thereof. A plug is disposed in the lower end of the tube to close the same. Spark generation is prevented while a low electrical resistance sealed terminal which is simple in structure and quick and easy to assemble, results.Type: GrantFiled: November 30, 1999Date of Patent: March 20, 2001Assignees: Toshiba Ceramics Co., Ltd, Tokyo Electron LimitedInventors: Eiichi Toya, Tomio Konn, Tomohiro Nagata, Norihiko Saito, Sunao Seko, Hideyuki Yokoyama, Ken Nakao, Takanori Saito, Hisaei Osanai, Toshiyuki Makiya
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Patent number: 6062853Abstract: An heat-treating ring boat (20) for semiconductor wafers (W) has a top plate (21), a bottom plate (22), six columns (23-28), and 63 ring trays (31). The trays (31) are mounted in grooves (20a) of the columns (23-28). To fix the trays (31), a fixing rod (33) is detachably mounted between the top plate (21) and bottom plate (22). A through hole (21a) and a recessed portion (22a) to mount the fixing rod (33) therein are formed in the top plate (21) and bottom plate (22). Notches (34) to engage with the fixing rod (33) are formed in the trays (31). A notch (32) to engage with the fixing rod (33) is formed in the column (23). A projection (41) is formed on each tray (31) to abut against the side surface of the column (24).Type: GrantFiled: August 31, 1998Date of Patent: May 16, 2000Assignee: Tokyo Electron LimitedInventors: Tomohisa Shimazu, Ken Nakao
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Patent number: 6043468Abstract: A carbon heater comprising heater members (11, 111, 121 . . . 161, 212, 222, 315, 325 . . . 345, 411, 515, 612) in which a plurality of carbon fiber bundles having a plurality of carbon fibers whose diameter is 5 to 15 .mu.m bundled are woven into a longitudinally elongated shape such as a wire shape or a tape shape and the impurity content is less than 10 ppm in ashes.Type: GrantFiled: July 31, 1998Date of Patent: March 28, 2000Assignees: Toshiba Ceramics Co., Ltd., Tokyo Electron LimitedInventors: Eiichi Toya, Masahiko Ichishima, Tomio Konn, Tomohiro Nagata, Shigeru Yamamura, Norihiko Saito, Kouji Teraoka, Takeshi Inaba, Hiroyuki Honma, Ken Nakao, Takanori Saito, Hisaei Osanai, Toshiyuki Makiya
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Patent number: 6008477Abstract: A helical heating wire is disposed so as to surround a reaction tube, and is held by a heat insulating structure. Support members are arranged at predetermined pitches on the inner circumference of the heat insulating structure to support the heating wire on the inner circumference of the heat insulating structure so as to enable the heating wire to make thermal expansion and thermal contraction. Fixing means are attached to one loop out of every suitable number of loops of the helical heating wire to fix the heating wire to the heat insulating structure.Type: GrantFiled: February 13, 1998Date of Patent: December 28, 1999Assignee: Tokyo Electron LimitedInventors: Ken Nakao, Makoto Kobayashi, Hisaei Osanai
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Patent number: 5813851Abstract: When a wafer boat having wafers, objects to be treated, placed thereon is loaded into a reaction tube, which is then raised in temperature by a heating section at a speed of 50.degree. C./min or more, a pressure reduction degree of the reaction tube is lowered or a hydrogen gas is supplied. A surface roughness of a portion in contact with the wafers on the wafer boat is 50 .mu.m or less. Thereby, a heat transfer coefficient relative to the wafers is improved to suppress an in-plane temperature difference smaller. Accordingly, when the objects to be treated are raised in temperature in the reaction tube for heat treatment, it is possible to suppress the in-plane temperature difference of the substances to be smaller to prevent an occurrence of a slip or warp which leads to the lowering of a yield.Type: GrantFiled: September 5, 1996Date of Patent: September 29, 1998Assignee: Tokyo Electron, Ltd.Inventor: Ken Nakao
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Patent number: 5645419Abstract: A heat treatment device including a handling chamber that has a carriers feed in/out opening for carriers holding plural sheets of objects to be treated parallelly vertical, a vertical heat treatment furnace for heat treating the objects and a posture changer for swinging the carriers near the carriers feed in/out opening of the handling chamber on a rotational center into a territory of lower sides of the carriers to change the posture of the objects to be treated from the vertical position to the horizontal position. The heat treatment device also has a carriers storage unit disposed above the posture changing means for storing a plural number of posture changed carriers, conveying device for conveying the carriers between the storage unit and the posture changing device and the heat treatment furnace side. Also, provided is a transferrer for transferring the objects-to-be-treated to/from an objects-to-be-treated holder for loading and unloading into/out of the heat treatment furnace side.Type: GrantFiled: March 23, 1995Date of Patent: July 8, 1997Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki KaishaInventors: Tetsu Ohsawa, Hiroyuki Iwai, Hisashi Kikuchi, Shingo Watanabe, Keiji Takano, Tsutomu Haraoka, Ken Nakao
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Patent number: 5500388Abstract: In order to form a film on a surface of a semiconductor wafer, a multiplicity of wafers are individually mounted on ring-shaped mounts of a wafer boat, while the temperature within a reaction tube is set at, e.g., 400.degree. C. under a nitrogen gas atmosphere. After loading the wafer boat into the reaction tube, the temperature within the reaction tube is raised up to, e.g., 620.degree. C. at a rate of, e.g., 100.degree. C./min, and SiH.sub.4 gas is supplied onto the surface of a silicon substrate to form a polysilicon film. After film formation, air is forced to flow along the internal surface of the heating section to forcibly cool the interior of the reaction tube. In the case of forming a metal silicon film using a wafer having a silicon substrate and a metal film formed on the surface of the silicon substrate, the temperature within the reaction tube is set at, e.g. 100.degree. C. for loading the wafers.Type: GrantFiled: February 28, 1994Date of Patent: March 19, 1996Assignees: Tokyo Electron Kabushiki Kaisha, Tokyo Electron Tohoku Kabushiki KaishaInventors: Reiji Niino, Tomoyuki Ohbu, Hiroaki Ikegawa, Ken Nakao, Yoshiyuki Fujita, Tsutomu Haraoka, Makoto Kobayashi, Naoya Kaneda, Hiroshi Kumada
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Patent number: 5431561Abstract: A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.Type: GrantFiled: December 14, 1993Date of Patent: July 11, 1995Assignees: Kabushiki Kaisha Toshiba, Tokyo Electron Sagami LimitedInventors: Kikuo Yamabe, Keitaro Imai, Katsuya Okumura, Ken Nakao, Seikou Ueno
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Patent number: 5324920Abstract: The heat treatment apparatus according to the invention comprising a process tube for holding a plurality of semiconductor wafers, a heating resistive element made mainly of molybdenum silicide and surrounding the process tube, a heat insulating member surrounding the heating resistive element and having a layer which made of material inert to silicon dioxide and faces the surface of the heating resistive element, and a securing member securing the heating resistive element to the heat insulating member, and made of material inert to silicon dioxide.Type: GrantFiled: October 18, 1991Date of Patent: June 28, 1994Assignee: Tokyo Electron Sagami LimitedInventor: Ken Nakao
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Patent number: 5323484Abstract: A heating apparatus including a process tube in which the target objects are arranged in an internal heating area and a multilayer insulating structure arranged so to enclose the process tube. At the inner face of an inorganic molded structure of bulk density 0.3-0.8 g/cm.sup.3, an inorganic insulating layer of bulk density 1.0-2.0 g/cm.sup.3 covered on the inner face or all faces thereof by inorganic cloth is provided to form the multilayer insulating structure. The inner face of the inorganic insulating layer is used to support a heat generating means. A cooling means is also provided for cooling the flat heating area of the process tube. As a result, a heating apparatus of the present invention is provided that features excellent endurance against spalling, deterioration and chemical reaction, and which is capable of long term stability with respect to temperature increase and decrease.Type: GrantFiled: January 28, 1993Date of Patent: June 21, 1994Assignee: Tokyo Electron Sagami Kabushiki KaishaInventors: Ken Nakao, Seiji Sakurai, Yoshihisa Miyahara, Yoshiyuki Motoyoshi
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Patent number: 5297956Abstract: A method and an apparatus for heat treating in a heat treating apparatus having a heating chamber to be introduced with predetermined gas, a heater disposed around the heating chamber, and jigs disposed in the heating chamber for supporting wafers of a plurality of substrates to be treated in parallel with each other, wherein in order to make the temperature distribution of the wafers of the substrates to be treated in the radial direction uniform in the heat treatment, the jigs are formed to determine the sizes and the shape thereof in predetermined ranges having a gradient according to the heat treating method having a predetermined shape determining procedure so that the jigs are formed in ring-shaped trays (i.e. support-ring) for holding at the peripheries the substrates to be treated and the thickness of the tray is constant or such that the outer peripheral side thereof is thicker than the inner peripheral side thereof.Type: GrantFiled: November 29, 1991Date of Patent: March 29, 1994Assignees: Kabushiki Kaisha Toshiba, Tokyo Electron Sagami LimitedInventors: Kikuo Yamabe, Keitaro Imai, Katsuya Okumura, Ken Nakao, Seikou Ueno