Abstract: An apparatus for the separation and fractionation of differentially expressed gene fragments includes a separating means including a capillary filled with a separation medium to separate DNA fragments by electrophoresis, a sampling means including sampling vessels to fractionate and sample the separated DNA fragments, according to their size, a transferring means to transfer buffer solution containing the separated DNA fragments to the sampling means, and a control means to control the sampling means based on a signal gained by detecting means, wherein a voltage for the electrophoresis and a length of the capillary are adjusted such that a spread in time of the separated DNA fragments caused by the transferring means during the transfer of the separated DNA fragments to the sampling vessels is smaller than a difference in separation time of the DNA fragments in the separating means.

Abstract: An electron beam which can transmit through part of a specimen and can reach a portion not exposing to the electron beam is irradiated and a scanning image is obtained on the basis of a signal secondarily generated from a portion irradiated with the electron beam. Dimension-measuring start and end points are set on the scanning image and a dimension therebetween is measured. A cubic model is assumed, the cubic model is modified so as to match the scanning image, and dimension measurement is carried out on the basis of a modified cubic model.

Abstract: An electron beam which can transmit through part of a specimen and can reach a portion not exposing to the electron beam is irradiated and a scanning image is obtained on the basis of a signal secondarily generated from a portion irradiated with the electron beam. Dimension-measuring start and end points are set on the scanning image and a dimension therebetween is measured. A cubic model is assumed, the cubic model is modified so as to match the scanning image, and dimension measurement is carried out on the basis of a modified cubic model.

Abstract: An X-ray analyzing method for inspecting opening states of fine holes comprises the steps of: irradiating a finely converged electron beam into a first fine hole, observing an X-ray emitted from the inside of said first fine hole in order to obtain an first X-ray analysis data about the residue substance existing at the bottom of said first fine hole; irradiating a finely converged electron beam into a second fine hole, observing an X-ray emitted from the inside of said second fine hole in order to obtain an second X-ray analysis data about the residue substance existing at the bottom of said second fine hole; and comparing said first X-ray analysis data with said second X-ray analysis data, forming a judgment as to whether or not a difference between said first and second analysis data is smaller than a predetermined threshold value and using an outcome of said judgment to determine the opening states of said first and second fine holes.

Abstract: An electron beam which can transmit through part of a specimen and can reach a portion not exposing to the electron beam is irradiated and a scanning image is obtained on the basis of a signal secondarily generated from a portion irradiated with the electron beam. Dimension-measuring start and end points are set on the scanning image and a dimension therebetween is measured. A cubic model is assumed, the cubic model is modified so as to match the scanning image, and dimension measurement is carried out on the basis of a modified cubic model.

Abstract: An X-ray analyzing method includes the steps of applying an irradiated electron beam, converged by a condenser lens and an objective lens into a thin beam, to the inside of a fine hole existing on the surface of a sample; observing X-rays generated from a residual substance existing inside the fine hole; and performing a qualitative and quantitative analysis of the residual substance. The X-rays are observed by an X-ray detector installed in an internal space of the condenser lens, an internal space of the objective lens, or between the condenser lens and the objective lens, by detecting only the X-rays radiated within the angular range -.theta. to +.theta., where .theta. is an angle formed with a center axis of the electron beam, and so defined that tan .theta. is substantially equal to a/d, where a and d are the radius and the depth of the fine hole, respectively.

Abstract: An electron beam, which can transmit through part of a specimen and can reach a portion that is not exposed to the electron beam, is irradiated, and a scanning image is obtained on the basis of a signal secondarily generated from a portion irradiated with the electron beam. Dimension-measuring start and end points are set on the scanning image and a dimension therebetween is measured. A three-dimensional model is assumed, the three-dimensional model is modified so as to match the scanning image, and dimension measurement is carried out on the basis of a modified three-dimensional model.

Abstract: A surface analysis method and an apparatus for carrying out the samein which the method involves the detection of fluorescence X-rays emitted from the surface of a sample in response to a finely focused electron beam irradiated thereto, whereby residues on the sample surface are analyzed qualitatively and quantitatively. An electron beam (1) is irradiated through a hole (9) at the center of an X-ray detector (8) into a fine hole (h) on the surface of a sample (2). In response, fluorescence X-rays are emitted from inside the fine hole (h) and are detected by an annular X-ray detector (8) having an energy analysis function near the axis of the electron beam (1) (preferably within 20 degrees with respect to the center axis of the electron beam). This arrangement allows the fluorescence X-rays from the fine hole (h) to reach the X-ray detector (8) without being absorbed by the substance of the material.

Abstract: A technique for displaying a scanned specimen image permits non-destructive observation of a surface structure having large or precipitous unevenness, an internal structure of a specimen or a specific structure of a defect or foreign matter, which non-destructive observation has hitherto been considered to be difficult to achieve. The technique can be applied to inspection and measurement so as to economically provide devices and parts of high quality and high reliability. Thus, secondary information such as secondary electrons resulting from interaction of primary information with a specimen, the primary information being generated as a result of interaction of a scanning electron beam with the specimen, is utilized as an image signal to form an image.

Abstract: A first beam of light having a wavelength ranging from a soft X-ray to a vacuum ultraviolet region is focused into a thin beam of light and irradiated upon a surface of a specimen, and physical information obtained as a result of such irradiation is detected to obtain information of the surface of the specimen. A second beam of light is focused into a thin beam of light and irradiated at the irradiation spot of the first beam of light upon the surface of the specimen, and the position of the irradiation spot of the second beam of light on the surface of the specimen is visually observed to located the position of the irradiation point of the first beam of light on the surface of the specimen.

Abstract: Described is a surface analysis method for analyzing energy of particles such as photoelectrons which are emitted from a sample surface by the irradiation of light with wavelengths ranging from the soft x-ray region to the vacuum ultraviolet region using an optical system including a reflective optical element to the sample surface so as to obtain chemical state information about the sample surface, wherein the beam diameter of the light on the sample surface is reduced to 1 .mu.m or less in terms of full width at half maximum of the beam intensity profile on the sample surface so that the chemical state information about the sample surface can be obtained with high sensitivity and high resolution, and an apparatus for implementing this method.

Abstract: A surface measuring method and apparatus utilizes a low energy neutral particle (neutral atom, neutral molecule) controlled to be equal to or lower than 1 eV, which is caused to collide against the surface of a specimen. A neutral particle reflected at the specimen surface is detected, and its energy is measured to non-destructively measure the chemical bonding state of the specimen surface.

Abstract: Surface treatment is applied to a substrate by supplying thereto excited molecules in which the vibrational energy level is excited. SF.sub.6, O.sub.2, N.sub.2, etc., are used as the excited molecules and supplied to the substrate as beams. This method is particularly suitable for the surface treatment in the production of semiconductor devices.

Abstract: A method of and an apparatus for analyzing a surface are disclosed, in which the intensity profile of a probe beam at the surface of a sample is measured, the intensity distribution of a detection signal along the surface of the sample is measured by scanning the surface of the sample with the probe beam, and mathematical transformation is carried out for each of the measured intensity profile and the measured signal-intensity distribution, to make surface analysis with high resolution.

Abstract: Surface analysis method capable of obtaining depth profiles of elements and chemical bonds in a nondestructive manner and with high accuracy, which comprises irradiating light to a sample surface to be analyzed with changing its energy, detecting electrons emitted from the surface of the above sample and corresponding to a certain binding energy, and subjecting the resultant detected signal to integration transform; and constitution of a device for carrying out the method.

Abstract: A surface treatment apparatus comprising a vacuum chamber, means for introducing a gas into the vacuum chamber, a gas furnace for heating and activating the gas while it is being introduced, apertures for injecting the heated gas, and a substrate stage for holding a substrate of which the surface is to be treated by the injected gas. The gas that is heated and activated is blown onto the surface of the substrate to treat the surface without causing the surface to be damaged. Therefore, the apparatus can be employed very effectively for a process for producing semiconductor elements.

Abstract: A plasma which is formed by the contact between a microwave and a reaction gas is brought into contact with an article to be etched which is AC-biased, thereby effecting etching of an exposed region of the article. The etching is carried out in a state wherein the self-bias formed between the plasma and the article is minimized, whereby it is possible to effect etching which provides high selectivity and which enables a substantially vertical side wall to be formed.

Abstract: Disclosed is a method for microwave plasma processing characterized by providing a plasma processing period of time having no radio-frequency voltage applied to the sample stage. Particularly, if the present invention is used for the shaping by etching of the conductive material layer provided on an underlying insulation material, effects such as shortening of processing time and improvement of etching accuracy can be obtained in the case that the radio-frequency voltage is applied only for the period of time for removing the surface oxide film of the portion to be etched, or in the case that the radio-frequency voltage is further applied until nearly the time to initiate over-etching, and, the latter case is also effective for making the side wall of the portion to be etched vertical.

Abstract: An ion source equipped with an ion beam exit slit for extracting ions from plasma generated in feed gas introduced into a discharge chamber, and with gas inlet or inlets for introducing the feed gas into the discharge chamber in close proximity of the ion beam exit slit. Ion extraction can be made stably without any deposit on the ion beam exit slit even when a boron halide is used as the feed gas. The effect of the ion source can be further enhanced by adding oxygen, hydrogen or gas of an oxygen-containing compound to the feed gas, and by using a microwave.

Abstract: In a dry-processing apparatus adapted for vapor phase deposition or vapor phase etching, the processing space in its processing chamber is covered with a cooled member provided for trapping reflecting active particles and preventing degassing, thereby permitting processing with gas of high purity substantially free from impurities. The active particles are incident upon a workpiece in a unidirectional flow. Means for uniformalyzing the direction of movement of active particles may be further provided. The apparatus is especially useful for vertical etching of a semiconductor substrate with neutral radicals.