Abstract: The object is to provide a liquid container that can prevent foreign substances from flowing into a liquid ejection apparatus with a simple configuration. The liquid container for containing liquid to be ejected by a liquid ejection apparatus includes: a bag body configured to contain the liquid inside; and a flow path for supplying the liquid contained inside the bag body to the liquid ejection apparatus, wherein, inside a peripheral wall of the flow path, a first capturing unit extending in an anti-gravitational direction and a second capturing unit extending in a gravitational direction are arranged at different positions with respect to a direction in which the liquid flows.

Abstract: Disclosed herein is an apparatus that includes: first and second memory groups including a plurality of first and second memory cells, respectively; a first buffer circuit configured to receive a plurality of first data bits from the first memory group; a second buffer circuit configured to receive a plurality of second data bits from the second memory group; a first error correction circuit configured to correct at least one of the plurality of first data bits; and a second error correction circuit configured to correct at least one of the plurality of second data bits. The first error correction circuit is arranged between the first and second buffer groups of the first buffer circuit in physical layout. The second error correction circuit is arranged between the third and fourth buffer groups of the second buffer circuit in physical layout.

Abstract: Microelectronic devices may include first bond pads located proximate to, and distributed along, a first side of the microelectronic device. Other bond pads may be located proximate to, and distributed along, another side of the microelectronic device perpendicular to the first side. A first pitch of the first bond pads may be greater than another pitch of the other bond pads. When microelectronic devices are placed side by side, the bond pads on sides of the microelectronic devices proximate to one another may be interposed between one another in the direction parallel to the first shortest distance between adjacent first bond pads.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: Disclosed herein is an apparatus that includes: a first conductive layer having a first common pattern and a plurality of first branch patterns arranged in a first direction, one end of each of the first branch patterns being connected to the first common pattern; a second conductive layer having a second common pattern and a plurality of second branch patterns arranged in the first direction, one end of at least one of the second branch patterns being connected to the second common pattern; an insulating layer formed between the first and second conductive layers; and a plurality of via electrodes penetrating through the insulating layer, other end of each of the first branch patterns being connected to an associated one of other end of each of the second branch patterns.

Abstract: Disclosed herein is an apparatus that includes: a first conductive layer having a first common pattern and a plurality of first branch patterns arranged in a first direction, one end of each of the first branch patterns being connected to the first common pattern; a second conductive layer having a second common pattern and a plurality of second branch patterns arranged in the first direction, one end of at least one of the second branch patterns being connected to the second common pattern; an insulating layer formed between the first and second conductive layers; and a plurality of via electrodes penetrating through the insulating layer, other end of each of the first branch patterns being connected to an associated one of other end of each of the second branch patterns.

Abstract: Provided are a curdlan-containing composition which is unlikely to aggregate when dispersed or dissolved in water and with which a curdlan dispersion or solution can be easily prepared, and a food product and any other products containing the curdlan-containing composition. The curdlan-containing composition contains curdlan and an alkali salt, and the curdlan and the alkali salt are granulated.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for arranging configurable logic circuits such that the configurable logic circuit may be configured to form one or more of several logic circuits by coupling a combination of nodes included in the logic circuit. Configuring the configurable logic circuit may include modification of a single wiring layer.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for arranging configurable logic circuits such that the configurable logic circuit may be configured to form one or more of several logic circuits by coupling a combination of nodes included in the logic circuit. Configuring the configurable logic circuit may include modification of a single wiring layer.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: Provided are a curdlan-containing composition which is unlikely to aggregate when dispersed or dissolved in water and with which a curdlan dispersion or solution can be easily prepared, and a food product and any other products containing the curdlan-containing composition. The curdlan-containing composition contains curdlan and an alkali salt, and the curdlan and the alkali salt are granulated.

Abstract: Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a connection wiring of a ring-shape having comprising a hole and a conductive layer surrounding the hole, the conductive layer including a first connection point and a second connection point that are located so that a straight line between the first connection point and the second connection point crosses over the hole; an external terminal coupled to the first connection point of the conductive layer of the connection wiring; and an internal circuit coupled to the second connection point of the conductive layer of the connection wiring.

Abstract: A golf swing analysis device includes a joint force calculation section and a torque extraction section. The joint force calculation section generates a double pendulum model that includes a first link that corresponds to an upper part of a body of a golfer, a second link that corresponds to a golf club, and a joint that links the first link and the second link, and calculates a joint force applied to the joint along with a swing motion using an acceleration measured by an inertial sensor attached to the golf club. The torque extraction section extracts a torque that causes the second link to make a rotational motion around a first axis from the joint force.

Abstract: An aspect of the invention relates to a golf swing analyzing apparatus, comprising: an arithmetic section operating to use the output of an inertial sensor to calculate bending moment acting on the golf club, the inertial sensor being attached to the golf club.

Abstract: An aspect of the invention relates to a golf swing analyzing apparatus, comprising: a first arithmetic section operating to use an output from a first inertial sensor and an output from a second inertial sensor to calculate a first energy amount, the first inertial sensor being attached to a portion of an upper body of a golfer, the second inertial sensor being attached to a golf club, the first energy amount being generated in the upper body of the golfer; a second arithmetic section operating to use the output from the first inertial sensor and the output from the second inertial sensor to calculate a second energy amount transferred to the golf club from the upper body of the golfer; and a processing section calculating an energy transferring ratio of an energy transferred from the upper body of the golfer to the golf club based on a ratio of the second energy amount to the first energy amount.

Abstract: An aspect of the invention relates to a golf swing analyzing apparatus, comprising: an arithmetic section operating to process the output of a first inertial sensor and the output of a second inertial sensor to calculate a relative angle between a forearm of a golfer and a golf club, the first inertial sensor being attached to a portion of the upper body of the golfer, the second inertial sensor being attached to the golf club.

Abstract: An output circuit includes first, second and third transistors. The first transistor includes first and second diffusion layers. The third transistor includes third and fourth diffusion layers. The first transistor shares the second diffusion layer with the second transistor and the third transistor shares the third diffusion layer with the second transistor. The second transistor is rendered conductive responsive to an activation of a first signal and non-conductive responsive to an inactivation of the first signal. The first and third transistors are rendered conductive responsive to an activation of a second signal that is different from the first signal and rendered non-conductive responsive to an in activation of the second signal.