Abstract: A turbomachine seal plate includes a substrate with a first material that defines a surface having a substrate width. The substrate includes a first terminus extension that is raised and extends from a terminus portion of the substrate. The first terminus extension extends outwardly relative to the surface up to a terminus extension height. The turbomachine seal plate also includes a coating having a second material that covers the surface of the substrate and defines a coating width. The coating abuts a side of the first terminus extension. The coating width can be substantially equal to the terminus extension height.

Abstract: A turbomachine seal plate includes a substrate with a first material that defines a surface having a substrate width. The substrate includes a first terminus extension that is raised and extends from a terminus portion of the substrate. The first terminus extension extends outwardly relative to the surface up to a terminus extension height. The turbomachine seal plate also includes a coating having a second material that covers the surface of the substrate and defines a coating width. The coating abuts a side of the first terminus extension. The coating width can be substantially equal to the terminus extension height.

Abstract: A system for measuring thin film stress, anisotropic or isotropic, such as from thin film deposition onto semiconductor substrates found in semiconductor manufacturing. The system uses resettled volume difference, V2?V1, of the surface of a material to calculate stress. The system includes a means to collect 3D surface points, a method to calculate volume and a method to calculate thin film stress from resettled volume difference. Calculating stress from resettled volume difference, V2?V1, eliminates the inaccuracy of calculating stress from the change in surface curvature or surface radius with equations such as ( 1 R 2 - 1 R 1 ) . The inaccuracy of stress calculated from surface curvature is from the non-spherical deformation of anisotropic materials, such as semiconductor substrates, eg: silicon wafers in semiconductor manufacturing.

Abstract: A system for measuring thin film stress (anisotropic or isotropic), such as from thin film deposition onto semiconductor substrates found in semiconductor manufacturing. The system uses resettled volume difference (V2?V1) of the surface of a material to calculate stress. The system includes A) A means to collect 3D surface point positions of a body by reflecting an image or light from the material surface into a sensor. B) A method to calculate volume from 3D surface points. C) A method to calculate thin film stress from resettled volume difference (V2?V1). D) A 3D Integrated Magnification Environment (3D-IME) to analyze 3D models of a body with a single axis (the height axis) magnified in an effort to observe the effects of stress on the body, before and after stress is applied, such as from film deposition).

Abstract: The invention provides low protein and protein-free creamer compositions, and processes for making them. The creamer composition includes an emulsifying component of at least one emulsifier; a buffer system of at least one buffering agent; and a chelating system of at least one chelating agent of an organic acid or organic acid salt. The creamer optionally contains a whitening agent in an amount sufficient to provide additional whitening to an aqueous media to which the creamer is added. The composition has a fat or oil content of about 0.5% to about 50% by weight and a protein content of no more than 3% by weight. The creamer composition can be in the form of liquid, liquid concentrate or powder, and provides high whitening capacity and a pleasant mouth-feel with no discernable feathering or fat separation when added to aqueous media of beverages at different pHs, hardnesses and temperatures.

Abstract: A method is provided of predicting changes in market share, in the form of Preference Shares, in a market associated with proposed performance changes. The initial step is to provide a set of market research data suitable for CVA, including current market share data. The next step is to perform a CVA analysis through regression analysis in order to determine WWP parameters, so that for the market as a whole, a set of coefficients determining relative importance of each value driver to WWP, and for each market participant, a set of performance scores for each value driver, and an overall WWP value. The method continues by postulating a changed value in the performance score for one or more value drivers for a selected market participant. The postulated changed value is used to determine a predicted WWP value through relative impacts of the components associated with the WWP model.

Abstract: Polystyrene baler for extreme compaction of expanded polystyrene or other similar materials where a ram forcibly acts to compress the expanded polystyrene material into a narrowing chamber where the narrowing chamber walls further act to compress the expanded polystyrene material to allow for air or gases trapped in the polystyrene material to escape so that a densely packed polystyrene bale is formed. A continuous bale is formed which can be broken or cut into desired lengths or weights. Vertically aligned walls of the bale chamber can be hydraulically actuated to accommodate the degree of compaction desired.