Patents by Inventor Ken Sakamoto

Ken Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200245234
    Abstract: A vehicle-mounted gateway apparatus according to an embodiment includes a communication device including an external communication interface for connection to the network outside the mobile body with each of a plurality of different external communication schemes and an internal communication interface for connection to each of the plurality of data sources within the mobile body; and a control device configured to transmit data collected from each of the data sources through the internal communication interface to the network outside the mobile body. The control device includes a communication channel selection section configured to select a communication channel from the plurality of external communication schemes for each of the data sources, and a monitoring control section configured to monitor data output from each of the data sources and to transmit the data to the network outside the mobile body over a selected one of the communication channels associated with the data source.
    Type: Application
    Filed: May 23, 2017
    Publication date: July 30, 2020
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Masayuki OMIYA, Kazuhiro GOTOU, Masashi UEMOTO, Daichi SOSHI, Kazunori HASHIMOTO, Hirokazu IKEYAMA, Yousuke OJIHARA, Satoru IWAHASHI, Akifumi OHNO, Kei SAKAMOTO, Ken ISHII, Shion ITOU
  • Publication number: 20200176273
    Abstract: A heat sink (4) having a step in a bottom surface corner and a rectangular planar shape is disposed in an interior of a cavity (5) of a metal mold (1) and a first pin (2) is caused to project from a bottom surface of the cavity (5) to position the heat sink (4). A second pin (3) projecting from the bottom surface of the cavity (5) is disposed at the step of the positioned heat sink (4). After the heat sink (4) is positioned, the first pin (2) is lowered to the bottom surface of the cavity (5) and the heat sink (4) is sealed with the mold resin (10) with the second pin (3) being left projecting.
    Type: Application
    Filed: August 23, 2017
    Publication date: June 4, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventor: Ken SAKAMOTO
  • Publication number: 20200158565
    Abstract: A material property inspection apparatus includes a conveyance unit, a light source, an irradiation unit, a light receiving unit, a signal detection unit, a material property value input unit, an inspection set value input unit, and a processing unit. The processing unit calculates a relation equation between the material property value from the material property values of the plurality of test pieces and the light intensity of the transmitted light or the reflected light of respective test pieces, calculates the material property value of the inspected object from the light intensity of the transmitted light or the reflected light detected by the signal detection unit and the relation equation, compares the calculated material property value of the inspected object with the inspection set value inputted from the inspection set value input unit, and determines the quality of the inspected object.
    Type: Application
    Filed: October 24, 2019
    Publication date: May 21, 2020
    Inventors: Masaaki FUSE, Ken SHIOIRI, Takao TANIMOTO, Hideyuki SAKAMOTO
  • Publication number: 20200138469
    Abstract: An ultrasonic vibration transmittable probe includes a probe body configured to transmit ultrasonic vibration generated by an ultrasonic transducer. A treatment section is provided on a distal end side of the probe body along its longitudinal axis and is configured to cut a treatment object with the ultrasonic vibration. The treatment section includes first to third cutting surfaces disposed at progressively proximal positions. A portion of the first cutting surface has a dimension along a first orthogonal direction orthogonal to the longitudinal axis that is smaller than a dimension of the second cutting surface along the first orthogonal direction.
    Type: Application
    Filed: January 2, 2020
    Publication date: May 7, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken FUJISAKI, Takamitsu SAKAMOTO, Ken YOKOYAMA, Hideto YOSHIMINE
  • Publication number: 20200138470
    Abstract: An ultrasonic vibration transmittable probe includes a probe body configured to transmit ultrasonic vibration generated by an ultrasonic transducer. A treatment section is provided on a distal end side of the probe body along its longitudinal axis. The treatment section includes multiple cutting surfaces having different dimensions in a first orthogonal direction orthogonal to the longitudinal axis.
    Type: Application
    Filed: January 2, 2020
    Publication date: May 7, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken FUJISAKI, Takamitsu SAKAMOTO, Ken YOKOYAMA, Hideto YOSHIMINE
  • Publication number: 20200138471
    Abstract: An ultrasonic vibration transmittable probe includes a probe body configured to transmit ultrasonic vibration generated by an ultrasonic transducer. A treatment section is provided on a distal end side of the probe body along its longitudinal axis and is configured to cut a treatment object with the ultrasonic vibration. The treatment section includes at least two cutting surfaces and an edge portion having a different shape than an outermost edge of the treatment section.
    Type: Application
    Filed: January 2, 2020
    Publication date: May 7, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken FUJISAKI, Takamitsu SAKAMOTO, Ken YOKOYAMA, Hideto YOSHIMINE
  • Publication number: 20200113595
    Abstract: The disclosed technology is directed to an ultrasonic probe comprises a probe main portion configured to transmit ultrasonic vibration generated by an ultrasonic transducer. A treatment portion is configured on a distal side of the probe main portion along a longitudinal axis thereof. The treatment portion includes first direction surfaces disposed in a first direction intersecting the longitudinal axis and second direction surfaces that are adjacent to the first direction surfaces and are disposed in a second direction different from the first direction surfaces. The first direction surfaces further includes a plurality of surfaces formed into a staircase shape when being viewed from the treatment portion and one or more surfaces formed into a staircase shape when being viewed from a side opposed to the distal side of the treatment portion. The second direction surfaces further includes a plurality of surfaces formed into a staircase shape toward the distal side.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Applicant: Olympus Corporation
    Inventors: Ken Fujisaki, Takamitsu Sakamoto, Ken Yokoyama, Yasuyuki Matsumura, Hideto Yoshimine
  • Publication number: 20200091047
    Abstract: A first lead terminal, a second lead terminal provided parallel to the first lead terminal, and a tie bar connecting the first lead terminal and the second lead terminal are provided. The tie bar includes a first narrow-width section touching the first lead terminal, a second narrow-width section touching the second lead terminal, and a wide-width section having a larger width than the first narrow-width section and the second narrow-width section and connecting the first narrow-width section and the second narrow-width section. The wide-width section has a through-hole formed between the first narrow-width section and the second narrow-width section.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 19, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Ken SAKAMOTO, Taketoshi SHIKANO, Hiroshi KAWASHIMA
  • Publication number: 20200078041
    Abstract: A surgical procedure of preparing bone holes to dispose an implanted tendon to a femur when performing reconstruction of a ligament in a knee joint, includes: forming a first bone hole in the femur; and applying ultrasonic vibration from a treatment portion of an ultrasonic treatment instrument to the femur, thereby cutting and expanding the first bone hole from the inside of the knee joint to the first bone hole of the femur along a predetermined depth, and forming a second bone hole having a polygonal shape, an approximately polygonal shape, an elliptical shape or an approximately elliptical shape to receive the implanted tendon.
    Type: Application
    Filed: November 18, 2019
    Publication date: March 12, 2020
    Applicant: OLYMPUS CORPORATION
    Inventors: Michio TAKAYAMA, Takamitsu SAKAMOTO, Ken FUJISAKI
  • Publication number: 20200038052
    Abstract: An ultrasonic surgical instrument includes an elongated shaft having respective proximal and distal end sides. An ultrasonic transducer is secured to the shaft and is configured to transmit ultrasonic vibrations from the proximal end side toward a distal end side along a longitudinal axis of the shaft. A cutting portion includes an outermost shape-defining portion that when pressed at a tip of the block shape against a bone cuts the bone in a direction of a pressing force to form a bone tunnel and to produce small particle of bone. A burying portion is configured to direct a flow of the fluid, which contains the small particle of bone produced upon formation of the bone tunnel, toward a wall formed in the bone tunnel by the cutting portion along the direction of the pressing force and to bury the small particle of bone in the wall of the bone tunnel.
    Type: Application
    Filed: September 25, 2019
    Publication date: February 6, 2020
    Applicant: Olympus Corporation
    Inventors: Ken Fujisaki, Takamitsu Sakamoto, Ken Yokoyama, Michio Takayama
  • Patent number: 10541193
    Abstract: A first lead terminal, a second lead terminal provided parallel to the first lead terminal, and a tie bar connecting the first lead terminal and the second lead terminal are provided. The tie bar includes a first narrow-width section touching the first lead terminal, a second narrow-width section touching the second lead terminal, and a wide-width section having a larger width than the first narrow-width section and the second narrow-width section and connecting the first narrow-width section and the second narrow-width section. The wide-width section has a through-hole formed between the first narrow-width section and the second narrow-width section.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: January 21, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Ken Sakamoto, Taketoshi Shikano, Hiroshi Kawashima
  • Patent number: 10504706
    Abstract: A sputtering target which is made of an alumina sintered body having a purity of not less than 99.99% by mass %, a relative density of not less than 98%, and an average grain size of less than 5 ?m or is made of an alumina sintered body having a purity of not less than 99.999% by mass % and a relative density of not less than 98%. A sputtered film having an excellent insulation resistance and an excellent homogeneity can be obtained by using the sputtering target.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: December 10, 2019
    Assignee: Ferrotec Ceramics Corporation
    Inventors: Ken Okamoto, Tadahisa Arahori, Akishige Sato, Sachio Miyashita, Eiji Kusano, Muneaki Sakamoto
  • Publication number: 20190371625
    Abstract: A semiconductor device includes a lead frame, a semiconductor chip fixed to an upper surface of the lead frame, a first resin in contact with a lower surface of the lead frame, and a second resin provided on the first resin, wherein the first resin is higher in heat conductivity than the second resin, and the first resin and the second resin cover the semiconductor chip.
    Type: Application
    Filed: February 27, 2017
    Publication date: December 5, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventor: Ken SAKAMOTO
  • Patent number: 10490422
    Abstract: An object is to provide a technology that reduces the number of components and that is capable of suppressing the cost. A structure including semiconductor elements, a plurality of electrode terminals, and a dam bar for connecting the plurality of electrode terminals is prepared, and a part of the structure including a part of the plurality of electrode terminals and the dam bar is arranged in the terminal hole. Further, the part of the structure is clamped by a movable clamp inside the terminal hole, and at least a portion of the movable clamp is fitted into the terminal hole, and then a resin is injected into an internal space of a pair of molds.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: November 26, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tetsuya Ueda, Hiroshi Yoshida, Seiji Oka, Ken Sakamoto
  • Patent number: 10442213
    Abstract: A drying device includes a plurality of blowers to blow air onto an object to be dried, the plurality of blowers being disposed along a direction of conveyance of the object to be dried, and a plurality of heaters to heat air inside the plurality of blowers. Each of the plurality of blowers includes an elongated nozzle arranged along a nozzle direction perpendicular to the direction of conveyance of the object to be dried, and an airflow generator to generate airflow to be blown from the elongated nozzle. The plurality of blowers includes a first blower including the airflow generator at a first end of the first blower in the nozzle direction and a second blower including the airflow generator at a second end of the second blower opposite the first end in the nozzle direction.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: October 15, 2019
    Assignee: Ricoh Company, Ltd.
    Inventors: Hideaki Nishimura, Toshihiro Yoshinuma, Wataru Sakamoto, Sho Sawahata, Ken Onodera
  • Publication number: 20190300666
    Abstract: The present invention provides a method for producing an antifouling film capable of long-term continuous production of an antifouling film having excellent antifouling properties. The method for producing an antifouling film of the present invention includes Process (1) of applying a resin to a surface of a substrate; Process (2) of applying a second release agent to a surface of a die coated with a first release agent; Process (3) of pushing the substrate to the surface of the die coated with the second release agent with the resin in between to form an uneven structure on a surface of the resin; and Process (4) of curing the resin including the uneven structure on the surface thereof to form a polymer layer. The resin contains an antifouling agent that contains a predetermined compound. The first release agent contains a predetermined compound. The second release agent contains a predetermined compound.
    Type: Application
    Filed: July 3, 2017
    Publication date: October 3, 2019
    Inventors: Hidekazu HAYASHI, Tokio TAGUCHI, Kenichiro NAKAMATSU, Yasuhiro SHIBAI, Ken ATSUMO, Tsuneo YAMASHITA, Eiji SAKAMOTO, Saya NII, Takayuki ARAKI
  • Patent number: 10431528
    Abstract: A leadframe of a semiconductor device includes a die pad, first and second suspension leads, and a frame. The main surfaces of the die pad and the frame are located on different planes, and the die pad and the frame are connected to each other by the first and second suspension leads. A first boundary line between the first suspension lead and the die pad runs on a straight line different from a second boundary line between the second suspension lead and the die pad. A third boundary line between the first suspension lead and the frame runs on a straight line different from a fourth boundary line between the second suspension lead and the frame.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: October 1, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takamasa Iwai, Satoshi Kondo, Hiroshi Kawashima, Junji Fujino, Ken Sakamoto
  • Publication number: 20190265593
    Abstract: There is provided a silicon-containing resist underlayer film that is usable as a hard mask in a lithography process and can be removed by a wet process using a chemical solution, and particularly, a mixed aqueous solution of sulfuric acid with hydrogen peroxide (SPM). A resist underlayer film-forming composition is represented by comprising a hydrolysis-condensation of a hydrolysable silane having an epoxy group in an amount of 10 to 90% by mole relative to the total amount of hydrolysable silanes by an aqueous solution of an alkaline substance, and in a reaction system containing the hydrolysis-condensate, a hydrolysis-condensate containing an organic group having a dihydroxy group obtained by ring-opening the epoxy group by an inorganic acid or a cation exchange resin is further comprised.
    Type: Application
    Filed: October 25, 2017
    Publication date: August 29, 2019
    Applicant: NISSAN CHEMICAL CORPORATION
    Inventors: Wataru SHIBAYAMA, Makoto NAKAJIMA, Ken ISHIBASHI, Rikimaru SAKAMOTO
  • Patent number: 10383642
    Abstract: A surgical procedure of preparing bone holes to fix an implanted tendon to a femur when performing reconstruction of a ligament in a knee joint, includes: bringing a treatment portion of an ultrasonic treatment instrument into contact with the femur in the knee joint, and applying ultrasonic vibration from the treatment portion to the femur, thereby cutting and forming a first bone hole from the inside of the knee joint to the femur in a predetermined depth.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: August 20, 2019
    Assignee: OLYMPUS CORPORATION
    Inventors: Sohei Ueda, Chie Onuma, Manabu Ishikawa, Michio Takayama, Takamitsu Sakamoto, Ken Fujisaki
  • Publication number: 20190247081
    Abstract: An ultrasonic probe includes a treatment portion that has a through-hole or concave portions. The through-hole extends from a first outer surface to a second outer surface facing in an opposite direction to that of the first outer surface. The concave portions include a first concave portion on the first outer surface, and a second concave portion on the second outer surface. The treatment portion includes a blade formed along an edge of an opening of the through-hole or the first concave portion. An outer relay surface extends from the blade to the second outer surface and faces away from a center axis of the through-hole or the concave portions. A distance from the center axis to the blade is greater than or equal to a distance from the center axis to the outer relay surface at a position between the blade and the second outer surface.
    Type: Application
    Filed: April 25, 2019
    Publication date: August 15, 2019
    Applicant: OLYMPUS CORPORATION
    Inventors: Ken FUJISAKI, Takamitsu SAKAMOTO, Hiroyuki ARAKI, Hideto YOSHIMINE