Patents by Inventor Ken Schertzer

Ken Schertzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5199631
    Abstract: A method and apparatus for bonding high temperature structures, such as face sheets to high performance honeycomb cores, using differential gas pressure at high temperatures. A high temperature resistant, foil sheet having a thickness of from about 0.0005 to 0.003 inch is welded to a support to form a vacuum bag to surround the structure to be bonded. A vacuum line is connected to the bag to allow evacuation of the bag. Typically, the structure is bonded in a vacuum furnace. Initially, the furnace is heated to the bonding temperature of the assembly while both the furnace chamber and the vacuum bag are substantially completely evacuated. Then slight pressure is allowed to return to the chamber to force the foil sheet into intimate presure contact with the structural assembly to bring the components tightly together, using the relative pressure different between the vacuum in the chamber and the vacuum within the bag.
    Type: Grant
    Filed: June 1, 1992
    Date of Patent: April 6, 1993
    Assignee: Rohr, Inc.
    Inventors: John J. Anderson, Ken Schertzer, James F. Steckbeck, Donald O. Nelepovitz