Patents by Inventor Ken Shepard

Ken Shepard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230064374
    Abstract: An apparatus includes a flexible, electrically conducting layer disposed between a first flexible electrically insulating layer and a second flexible electrically insulating layer. At least one of the first electrically insulating layer, the electrically conducting layer, or the second electrically insulating layer includes multiple recesses defined therein, the recesses collectively having a predefined pattern. The apparatus also includes protrusions in the form of penetrating beam structures capable of accessing deep tissue structures, and at least one electrical access site electrically coupled to the electrically conducting layer, forming an electrode site. The apparatus also includes microelectronic circuitry/coils and components to serve as an implantable, flexible, conformally adjustable, interface for stimulating and/or recording electrical activity in biological tissue.
    Type: Application
    Filed: August 30, 2022
    Publication date: March 2, 2023
    Inventors: Moritz Michael LEBER, Florian SOLZBACHER, Ken SHEPARD
  • Publication number: 20230010731
    Abstract: This disclosure is related to a method of sequencing a single-stranded DNA using deoxynucleotide polyphosphate analogues and translocation of tags from incorporated deoxynucleotide polyphosphate analogues through a nanopore.
    Type: Application
    Filed: May 5, 2022
    Publication date: January 12, 2023
    Applicant: The Trustees of Columbia University in the City of New York
    Inventors: Jingyue Ju, Shiv Kumar, Zengmin Li, Chuanjuan Tao, Minchen Chien, James J. Russo, Sergey Kalachikov, Ken Shepard, Jacob Karl Rosenstein
  • Patent number: 11499186
    Abstract: This disclosure is related to a method of sequencing a single-stranded DNA using deoxynucleotide polyphosphate analogues and translocation of tags from incorporated deoxynucleotide polyphosphate analogues through a nanopore.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: November 15, 2022
    Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Jingyue Ju, Shiv Kumar, Zengmin Li, Chuanjuan Tao, Minchen Chien, James J. Russo, Sergey Kalachikov, Ken Shepard, Jacob Karl Rosenstein
  • Publication number: 20200115745
    Abstract: This disclosure is related to a method of sequencing a single-stranded DNA using deoxynucleotide polyphosphate analogues and translocation of tags from incorporated deoxynucleotide polyphosphate analogues through a nanopore.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 16, 2020
    Applicant: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Jingyue JU, Shiv KUMAR, Zengmin LI, Chuanjuan TAO, Minchen CHIEN, James J. RUSSO, Sergey KALACHIKOV, Ken SHEPARD, Jacob Karl ROSENSTEIN
  • Patent number: 10443096
    Abstract: This disclosure is related to a method of sequencing a single-stranded DNA using deoxynucleotide polyphosphate analogues and translocation of tags from incorporated deoxynucleotide polyphosphate analogues through a nanopore.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: October 15, 2019
    Assignee: THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
    Inventors: Jingyue Ju, Shiv Kumar, Zengmin Li, Chuanjuan Tao, Minchen Chien, James J. Russo, Sergey Kalachikov, Ken Shepard, Jacob Karl Rosenstein
  • Publication number: 20130264207
    Abstract: This disclosure is related to a method of sequencing a single-stranded DNA using deoxynucleotide polyphosphate analogues and translocation of tags from incorporated deoxynucleotide polyphosphate analogues through a nanopore.
    Type: Application
    Filed: December 16, 2011
    Publication date: October 10, 2013
    Inventors: Jingyue Ju, Shiv Kumar, Zengmin Li, Chuanjuan Tao, Minchen Chien, James J. Russo, Sergey Kalachikov, Ken Shepard, Jacob Karl Rosenstein
  • Publication number: 20050057286
    Abstract: A circuit for distributing a clock signal in an integrated circuit includes a capacitive clock distribution circuit having at least conductor therein. At least one inductor is formed in a metal layer of the integrated circuit and is coupled to the clock distribution circuit. The inductor, generally in the form of a number of spiral inductors distributed throughout the integrated circuit, provides an inductance value selected to resonate with the capacitive clock distribution circuit. By operating the clock distribution circuit at resonance, power dissipation is reduced while skew and jitter performance can be improved.
    Type: Application
    Filed: July 26, 2004
    Publication date: March 17, 2005
    Inventors: Ken Shepard, Steven Chan