Abstract: The channel number detecting circuit detects the operation channel number based on the output terminal voltage after falling down when the output terminal voltage falls down during the voltage boosting control, and the switching control circuit generates the control clock signal having the on-time and the off-time adjusted based on the operation channel number and performs the voltage boosting control using generating control clock signal. The voltage boosting control is properly performed based on the operation channel number when the operation channel number increase during performing the voltage boosting control. Thus boosting the power supply voltage up to a second voltage is accomplished.

Abstract: A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range.

Abstract: Voltages are applied to supply voltage application points of memory cells of an SRAM, a semiconductor substrate, a word line and bit lines so that voltage Vdd takes value V1, substrate voltage Vsub becomes 0 V, word line voltage Vw1 takes value V1, bit line voltage Vbll becomes 0 V, and bit line voltage Vblr takes value V1, the voltage difference between the word line and one of the bit lines is forced to be equal to a voltage difference V1h higher than a normal voltage difference V1 and the voltage difference between the word line and the other bit line is forced to be equal the normal voltage difference V1 lower than the voltage V1h to inject electrons into an insulating layer near a diffusion layer connected to an output terminal of an inverter constituting the memory cell. This can improve the operating characteristics of the memory cell.

Abstract: One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips.

Abstract: A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.

Abstract: A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

Abstract: One package contains a plurality of memory chips. Each memory chip has an I/O terminal which generates a busy signal. The busy signal enables a busy state when a power supply voltage value reaches a specified and guaranteed range after a power-on sequence. The busy signal maintains the busy state until completion of initialization operations for the plurality of memory chips. The busy signal releases the busy state after completion of all initialization operations for the plurality of memory chips.

Abstract: Provided is a technique for a data-driven database which frees a user from having to be conscious of a sequence in which instructions of a program for accessing a database are described, an interrelation of data items, and the like, and from having to describe redundant instructions. A data-driven database processor includes: schema definition storage means 2 for storing a schema definition of a database 24; derived definition storage means 3 for storing a derived definition describing a cause-and-effect relationship that exists when a value of a given data item is derived from a value of another data item; derived definition processing means 26 for generating a trigger program 27 that makes a chain of changes to values of data items based on the cause-and-effect relationship described in the derived definition; and a database management system 23 for executing the trigger program 27 when a change is made to the other data item that affects the value of the given data item.

Abstract: A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

Abstract: A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having a plurality of memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from that of the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

Abstract: A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range.

Abstract: A NAND cell unit includes memory cells which are connected in series. An erase operation is effected on all memory cells. Then, a soft-program voltage, which is opposite in polarity to the erase voltage applied in an erase operation, is applied to all memory cells, thereby setting all memory cells out of an over-erased state. Thereafter, a program voltage of 20V is applied to the control gate of a selected memory cell, 0V is applied to the control gates of the two memory cells provided adjacent to the selected memory cell, and 11V is applied to the control gates of the remaining memory cells. Data is thereby programmed into the selected memory cell. The time for which the program voltage is applied to the selected memory cell is adjusted in accordance with the data to be programmed into the selected memory cell. Hence, data “0” can be correctly programmed into the selected memory cell, multi-value data can be read from any selected memory cell at high speed.

Abstract: When write request signal is input from a host device 10, an SSD 20 inputs data input from the host device 10 in an encoder 30 sequentially and controls a RRAM 24 to store data output from the encoder 30. When size of data stored in the RRAM 24 reaches predetermined size Sref, the SSD 20 controls the RRAM 24 to read out data of size of the predetermined size Sref, inputs read data from the RRAM 24 in the encoder 32, and controls a flash memory 22 to store data output from the encoder 32. This configuration accomplishes the increase of the data write speed and improvement of reliability of the data.

Abstract: A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.

Abstract: A non-volatile semiconductor device has a memory cell array having electrically erasable programmable non-volatile memory cells, reprogramming and retrieval circuits that temporarily store data to be programmed in the memory cell array and sense data retrieved from the memory cell array. Each reprogramming and retrieval circuit has first and second latches that are selectively connected to the memory cell array and transfer data. A controller controls the reprogramming and retrieval circuits on a data-reprogramming operation to and a data-retrieval operation from the memory cell array. Each reprogramming and retrieval circuit has a multilevel logical operation mode and a caching operation mode. In the multilevel logical operation mode, re-programming and retrieval of upper and lower bits of two-bit four-level data is performed using the first and the second latches to store the two-bit four-level data in one of the memory cells in a predetermined threshold level range.

Abstract: When write data D is high rewritten data, a PC 10 controls a DRAM 24 to store the write data D (steps S100 and S110). When the write data D is not the high rewritten data, the PC 10 outputs an RRAM write request signal and the write data D to an SSD (step S100 and S120). A memory controller of the SSD input the RRAM write request signal controls the RRAM and an SRAM to store the write data D in the RRAM or the SRAM. This treatment enables data stored in the DRAM to be rewritten frequently. Therefore, the decrease of number of times of refresh operation of the DRAM and the decrease of power consumption are accomplished.

Abstract: This invention has the purpose of providing a nonvolatile semiconductor storage device which is capable of entering multivalued storage in a FeFET unit without requiring preparation of a plurality of voltage sources. The nonvolatile semiconductor storage device is provided with multivalued ferroelectric memory cells which impart varied quantities of polarization to a ferroelectric material by applying pulse voltages having one and the same height and varied widths and consequently produce varied states of storage in conformity with the varied quantities of polarization.

Abstract: The SSD performs to encode input data from the host device into BCH code having data length Sdr and code length Scr sequentially (step S100 and step S110) and controls RRAM to stores the encoded data (step S120) when the write requesting signal is input from the host device. When the number of BCH code that becomes data of one page of the flash memory after being decoded is stored to RRAM (step S130), the SSD controls RRAM to read out data stored in RRAM (step S140), performs error correction and decoding to the read data as BCH code having the data length Sdr and the code length Scr, and controls the flash memory to store the encoded data.

Abstract: A select gate transistor has a select gate electrode composed of a first-level conductive layer and a second-level conductive layer. The first-level conductive layer has contact areas. The second-level conductive layer has its portions removed that are located above the contact areas. Two adjacent select gate electrodes that are adjacent to each other in the column direction are arranged such that the contact areas of one select gate electrode are not opposed to the contact areas of the other select gate electrode. One select gate electrode has its first- and second-level conductive layers removed in their portions that are opposed to the contact areas of the other select gate electrode.

Abstract: The channel number detecting circuit 50 detects the operation channel number Nch based on the the output terminal voltage Vpgm after falling down when the output terminal voltage Vpgm falls down during the voltage boosting control, and the switching control circuit 70 generates the control clock signal CLK having the on-time and the off-time adjusted based on the operation channel number Nch and performs the voltage boosting control using generating control clock signal CLK. The voltage boosting control is properly performed based on the operation channel number Nch when the operation channel number Nch increase during performing the voltage boosting control. Thus boosting the power supply voltage Vdd up to the voltage V2 is accomplished.