Patents by Inventor Ken Tsai

Ken Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942418
    Abstract: A semiconductor structure includes a combined feature, a protection layer and a polymeric layer. The combined feature includes a passivation layer, an interconnecting structure disposed on the passivation layer, and a dielectric layer disposed on the passivation layer and the interconnecting structure. The protection layer is disposed on the dielectric layer, and is oxide-and-nitride based. The polymeric layer is disposed on the protection layer, and is separated from the interconnecting structure by the protection layer. A method of making a semiconductor structure is also provided.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Chuan Tsai, Wei-Ken Lin
  • Publication number: 20240040730
    Abstract: A detaching mechanism for a detachable module is provided. The detaching mechanism includes an engaging component and a driving component. The engaging component is for separately engaging with a positioning component. The engaging component is movable relatively to the detachable module along a first direction. The driving component is movable relatively to the detachable module along a second direction different from the first direction. When the driving component moves along the second direction, the driving component pushes the engaging component to move along the first direction, so as to drive the engaging component to disengage from the positioning component. An electronic device with the aforementioned detaching mechanism is also provided.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 1, 2024
    Applicant: Wistron Corporation
    Inventors: Yi-Sing Syu, Chi-Ken Tsai
  • Publication number: 20230317044
    Abstract: A noise reduction module includes a casing, at least one sound weakening mechanism and at least one sound absorbing mechanism. The at least one sound weakening mechanism is disposed in the casing. Each of the at least one sound weakening mechanism includes two plate members and a passage is formed between the two plate members. The at least one sound absorbing mechanism is disposed in the casing. Each of the at least one sound absorbing mechanism includes a bracket and at least one first sound absorbing structure, and the at least one first sound absorbing structure is disposed on the bracket.
    Type: Application
    Filed: June 14, 2022
    Publication date: October 5, 2023
    Applicant: Wistron Corporation
    Inventors: Cheng-Pang Wang, Guang-Zong Li, Chieh-Yu Ma, Chi-Ken Tsai
  • Patent number: 11764530
    Abstract: A circuit board device includes a fixing member and a circuit board having a first hole. The fixing member includes abase having a second positioning portion and an opening, a first fixing component and a pillar structure having a first pillar body and a positioning pillar extending downward from the first pillar body and having a first positioning portion and a clamping portion. The clamping portion clamps the circuit board with the first pillar body when the first positioning portion is engaged with the first hole. The base is disposed in the first hole and abuts against the positioning pillar when the second positioning portion hooks the first hole and the opening is engaged with the positioning pillar. The first fixing component is detachably inserted into the pillar structure for clamping a first interface card with the first pillar body.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: September 19, 2023
    Assignee: Wistron Corporation
    Inventors: Long-Hua Wu, Chi-Ken Tsai
  • Patent number: 11683903
    Abstract: A host casing of an electronic device includes a housing, a filler panel, and a disassembly and assembly structure. A front side of the housing has an opening. The dummy cover is disposed in the opening of the housing. The disassembly and assembly structure is disposed inside the housing. In a first state, the disassembly and assembly structure buckles with the dummy cover, thereby fixing the dummy cover. In a second state, the disassembly and assembly structure releases the dummy cover, and simultaneously pushes the dummy cover out of the opening. Therefore, the replacement action between the dummy cover and a pluggable device can be effectively simplified, so that maintenance personnel can easily assemble or disassemble the dummy cover without the assistance of additional tools.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: June 20, 2023
    Assignee: WISTRON CORPORATION
    Inventors: Long-Hua Wu, Chi-Ken Tsai
  • Publication number: 20230064895
    Abstract: A circuit board device includes a fixing member and a circuit board having a first hole. The fixing member includes abase having a second positioning portion and an opening, a first fixing component and a pillar structure having a first pillar body and a positioning pillar extending downward from the first pillar body and having a first positioning portion and a clamping portion. The clamping portion clamps the circuit board with the first pillar body when the first positioning portion is engaged with the first hole. The base is disposed in the first hole and abuts against the positioning pillar when the second positioning portion hooks the first hole and the opening is engaged with the positioning pillar. The first fixing component is detachably inserted into the pillar structure for clamping a first interface card with the first pillar body.
    Type: Application
    Filed: November 15, 2021
    Publication date: March 2, 2023
    Applicant: Wistron Corporation
    Inventors: Long-Hua Wu, Chi-Ken Tsai
  • Publication number: 20230008508
    Abstract: Disclosed are compositions comprising a glycolysis inhibitor and a HDAC inhibitor and methods for treatment of cancer using said compositions.
    Type: Application
    Filed: December 10, 2020
    Publication date: January 12, 2023
    Inventors: Elsa FLORES, Ken TSAI
  • Publication number: 20220156861
    Abstract: Systems and methods for blockchain-based data-driven property management are disclosed. In one embodiment, a method for blockchain-based data-driven property management may include: (1) receiving, by a property management computer program, title information for a property from a title recordation office; (2) validating, by the property management computer program, the title information with an owner of the property, a lienholder of the property, and/or a recorder of the title information; (3) recording, by the property management computer program, the title information to a distributed ledger, wherein a consensus algorithm executing on nodes in a distributed ledger network update the distributed ledger with a block comprising the title information; (4) periodically polling, by a first smart contract, the title recordation office for updated title information for the property. (5) automatically notifying, by the first smart contract, an interested party of the updated title information.
    Type: Application
    Filed: November 16, 2021
    Publication date: May 19, 2022
    Inventors: Bridget BRYNES, Samuel YEN, Octavio KEW, Ken TSAI, Arul NARAYANA
  • Publication number: 20220159863
    Abstract: A host casing of an electronic device includes a housing, a filler panel, and a disassembly and assembly structure. A front side of the housing has an opening. The dummy cover is disposed in the opening of the housing. The disassembly and assembly structure is disposed inside the housing. In a first state, the disassembly and assembly structure buckles with the dummy cover, thereby fixing the dummy cover. In a second state, the disassembly and assembly structure releases the dummy cover, and simultaneously pushes the dummy cover out of the opening. Therefore, the replacement action between the dummy cover and a pluggable device can be effectively simplified, so that maintenance personnel can easily assemble or disassemble the dummy cover without the assistance of additional tools.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 19, 2022
    Inventors: Long-Hua Wu, Chi-Ken Tsai
  • Patent number: 10939574
    Abstract: A server apparatus includes a casing having an opening and a fixing structure away from the opening, a tray mechanism and a server module. The tray mechanism includes a tray, a transmission member slidably disposed on the tray and having a slot, a link having an engaging structure and being slidably disposed through the slot, and a handle movably connected to the transmission member and pivoted to the tray. The server module is disposed on the tray. When the tray is disposed in the casing and the handle pivots to a mounting position, the transmission member slides relative to the tray to drive the link to pivot, so as to rotate the engaging structure to be engaged with the fixing structure.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: March 2, 2021
    Assignee: Wistron Corporation
    Inventors: Long-Hua Wu, Chi-Ken Tsai
  • Publication number: 20200396858
    Abstract: A server apparatus includes a casing having an opening and a fixing structure away from the opening, a tray mechanism and a server module. The tray mechanism includes a tray, a transmission member slidably disposed on the tray and having a slot, a link having an engaging structure and being slidably disposed through the slot, and a handle movably connected to the transmission member and pivoted to the tray. The server module is disposed on the tray. When the tray is disposed in the casing and the handle pivots to a mounting position, the transmission member slides relative to the tray to drive the link to pivot, so as to rotate the engaging structure to be engaged with the fixing structure.
    Type: Application
    Filed: September 2, 2019
    Publication date: December 17, 2020
    Inventors: Long-Hua Wu, Chi-Ken Tsai
  • Patent number: 10852029
    Abstract: A window-shades mechanism with an anti-backflow function is applied to a fan device and an electronic apparatus. The window-shades mechanism includes a supporter, a blade, a shaft and a connecting rod. The blade is disposed inside the supporter and includes two sides. Each side includes a first region and a second region. The shaft is connected to the supporter and the blade. The connecting rod is connected to the second region on the side of the blade. The connecting rod has a holding portion. When the connecting rod is moved by the holding portion, the blade is driven to rotate relative to the supporter via the shaft.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: December 1, 2020
    Assignee: Wistron Corporation
    Inventors: Chi-Ken Tsai, Xiao-Ju Huang
  • Publication number: 20200116385
    Abstract: A window-shades mechanism with an anti-backflow function is applied to a fan device and an electronic apparatus. The window-shades mechanism includes a supporter, a blade, a shaft and a connecting rod. The blade is disposed inside the supporter and includes two sides. Each side includes a first region and a second region. The shaft is connected to the supporter and the blade. The connecting rod is connected to the second region on the side of the blade. The connecting rod has a holding portion. When the connecting rod is moved by the holding portion, the blade is driven to rotate relative to the supporter via the shaft.
    Type: Application
    Filed: December 24, 2018
    Publication date: April 16, 2020
    Inventors: Chi-Ken Tsai, Xiao-Ju Huang
  • Patent number: 10588225
    Abstract: In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: March 10, 2020
    Assignee: Hewlett-Packard Development Compnay, L.P.
    Inventors: Arthur Lin, Chienchih Chiu, Ken Tsai, Chiacheng Wei
  • Publication number: 20190053390
    Abstract: In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.
    Type: Application
    Filed: January 23, 2017
    Publication date: February 14, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Arthur LIN, Chienchih CHIU, Ken TSAI, Chiacheng WEI
  • Patent number: 9565785
    Abstract: A fan securing device includes first and second holders. The first holder includes a first holding frame that has two holding slots located in opposite sides of the first holding frame, and two first locking units respectively formed adjacent to the holding slots. The second holder includes a second holding frame that has two connecting arms located on opposite sides of the second holding frame and extending respectively into the holding slots. Each connecting arm has a plurality of second locking units. Each first locking unit engages a selected one of the second locking units of a respective one of the connecting arms so as to clamp at least one cooling fan between the first and second surfaces.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: February 7, 2017
    Assignee: Wistron Corporation
    Inventor: Chi-Ken Tsai
  • Patent number: 9442537
    Abstract: A server with a detachable panel module includes a case with an accommodating space, a circuit board module and a panel module. The circuit board module includes a circuit board, a first assembling frame and a button. The first assembling frame includes a first plate. The first plate is installed in the accommodating space. The circuit board is installed on the first plate. The button is movable relative to the first plate. The panel module includes a panel and a second assembling frame. The second assembling frame includes a second plate, a plurality of elastic arms. The plurality of elastic arms is connected to the second plate. The panel is installed on the second plate. When the button is separated from the second plate, the elastic force of the plurality of elastic arms making the panel module leaves the accommodating space.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: September 13, 2016
    Assignee: WISTRON CORP.
    Inventor: Chi-Ken Tsai
  • Publication number: 20160085274
    Abstract: A server with a detachable panel module includes a case with an accommodating space, a circuit board module and a panel module. The circuit board module includes a circuit board, a first assembling frame and a button. The first assembling frame includes a first plate. The first plate is installed in the accommodating space. The circuit board is installed on the first plate. The button is movable relative to the first plate. The panel module includes a panel and a second assembling frame. The second assembling frame includes a second plate, a plurality of elastic arms. The plurality of elastic arms is connected to the second plate. The panel is installed on the second plate. When the button is separated from the second plate, the elastic force of the plurality of elastic arms making the panel module leaves the accommodating space.
    Type: Application
    Filed: April 24, 2015
    Publication date: March 24, 2016
    Inventor: Chi-Ken TSAI
  • Publication number: 20140241875
    Abstract: A fan securing device includes first and second holders. The first holder includes a first holding frame that has two holding slots located in opposite sides of the first holding frame, and two first locking units respectively formed adjacent to the holding slots. The second holder includes a second holding frame that has two connecting arms located on opposite sides of the second holding frame and extending respectively into the holding slots. Each connecting arm has a plurality of second locking units. Each first locking unit engages a selected one of the second locking units of a respective one of the connecting arms so as to clamp at least one cooling fan between the first and second surfaces.
    Type: Application
    Filed: February 21, 2014
    Publication date: August 28, 2014
    Applicant: WISTRON CORPORATION
    Inventor: Chi-Ken Tsai
  • Patent number: 7165998
    Abstract: An improved structure of USB compatible application apparatus is mainly provided a PCB circuit board to be a USB compatible application module of a connector. A top surface of the PCB carrying board is used to carry a plurality of connecting terminators. A board bottom sandwich is naturally formed between a bottom surface of the PCB carrying board and an covering shell of the connector. At least one electrical element are fixed inside of the board bottom thereby selectively reducing a length of a USB compatible application module or increasing working efficiency of the USB compatible application module. Further, at least one board top data transmission lines are set on part of the top surface of the PCB carrying board without setting the first connecting terminators thereby further raising working efficiency of the USB compatible application apparatus.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: January 23, 2007
    Assignee: Innodisk Corporation
    Inventors: Chung-Liang Lee, Chanson Lin, Ken Tsai