Patents by Inventor Ken Vanhille

Ken Vanhille has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

Publication number: 20200022277

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Type: Application

Filed: March 28, 2019

Publication date: January 16, 2020

Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

Publication number: 20190393580

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Type: Application

Filed: January 25, 2019

Publication date: December 26, 2019

Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems

Patent number: 10361471

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Type: Grant

Filed: March 18, 2016

Date of Patent: July 23, 2019

Assignee: NUVOTRONICS, INC

Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
Substrate-free interconnected electronic mechanical structural systems

Patent number: 10257951

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Type: Grant

Filed: December 27, 2017

Date of Patent: April 9, 2019

Assignee: NUVOTRONICS, INC

Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems

Patent number: 10193203

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Type: Grant

Filed: January 3, 2018

Date of Patent: January 29, 2019

Assignee: NUVOTRONICS, INC

Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

Publication number: 20180153055

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Type: Application

Filed: December 27, 2017

Publication date: May 31, 2018

Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

Publication number: 20180123217

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Type: Application

Filed: January 3, 2018

Publication date: May 3, 2018

Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
Substrate-free interconnected electronic mechanical structural systems

Patent number: 9888600

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.

Type: Grant

Filed: March 14, 2016

Date of Patent: February 6, 2018

Assignee: NUVOTRONICS, INC

Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

Publication number: 20160294035

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Type: Application

Filed: March 18, 2016

Publication date: October 6, 2016

Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

Publication number: 20160198584

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.

Type: Application

Filed: March 14, 2016

Publication date: July 7, 2016

Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration

Patent number: 9306254

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.

Type: Grant

Filed: March 14, 2014

Date of Patent: April 5, 2016

Assignee: NUVOTRONICS, INC.

Inventors: Ian Hovey, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other

Patent number: 9306255

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Type: Grant

Filed: March 14, 2014

Date of Patent: April 5, 2016

Assignee: NUVOTRONICS, INC.

Inventors: Jean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith