Patents by Inventor Ken Vo

Ken Vo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hydrogen treatment enhanced gap fill
    Patent number: 7211525
    Abstract: Methods of filling gaps on semiconductor substrates with dielectric film are described. The methods reduce or eliminate sidewall deposition and top-hat formation. The methods also reduce or eliminate the need for etch steps during dielectric film deposition. The methods include treating a semiconductor substrate with a hydrogen plasma before depositing dielectric film on the substrate. In some embodiments, the hydrogen treatment is used is conjunction with a high rate deposition process.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: May 1, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Sunil Shanker, Sean Cox, Chi-I Lang, Judy H. Huang, Minh Anh Nguyen, Ken Vo, Wenxian Zhu