Abstract: The present invention relates to a method of connecting circuit elements and a corresponding system for connecting circuit elements. The method includes providing a plurality of flexible circuit elements on a carrier element; forming a connecting structure. The formed connecting structure includes at least two contact points; and operative connections between each of the plurality of flexible circuit elements and the at least two contact points. The method further includes severing the operative connection between at least one of the plurality of flexible circuit elements and the at least two contact points.

Abstract: A method for fabricating a thin-film integrated circuit, IC, including a plurality of electronic components, the method comprising: forming, using a first fabrication technique, the plurality of electronic components, and forming, using a second fabrication technique, a conductive layer on the plurality of electronic components to form a redistribution layer, RDL, wherein the first fabrication technique includes photolithographic patterning, and the first fabrication technique is different to the second fabrication technique.

Abstract: The present invention provides for an interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly comprises a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within said flexible base layer, and at least one first patterned contact layer, provided on any one of said first surface and said second surface of said flexible base layer and which is configured to operably interface with said at least one active electronic circuit component and the at least one 1C component.

Abstract: An integrated circuit and corresponding method of manufacture. The integrated circuit has a die comprising: an outer strengthening ring around a periphery of the die, the outer ring having one or more gaps; and an inner strengthening ring within the outer ring and around interior circuitry of the die, the inner ring having one or more gaps offset from the gaps of the outer ring. One or more conducting members are electrically isolated from said rings and electrically connected to the interior circuitry, each member passing through a gap of the inner ring and through a gap of the outer ring.

Abstract: An integrated circuit and corresponding method of manufacture. The integrated circuit has a die comprising: an outer strengthening ring around a periphery of the die, the outer ring having one or more gaps; and an inner strengthening ring within the outer ring and around interior circuitry of the die, the inner ring having one or more gaps offset from the gaps of the outer ring. One or more conducting members are electrically isolated from said rings and electrically connected to the interior circuitry, each member passing through a gap of the inner ring and through a gap of the outer ring.